HK1099372A1 - Curable compositions and rapid prototyping process using the same - Google Patents

Curable compositions and rapid prototyping process using the same

Info

Publication number
HK1099372A1
HK1099372A1 HK07105409.7A HK07105409A HK1099372A1 HK 1099372 A1 HK1099372 A1 HK 1099372A1 HK 07105409 A HK07105409 A HK 07105409A HK 1099372 A1 HK1099372 A1 HK 1099372A1
Authority
HK
Hong Kong
Prior art keywords
same
curable compositions
rapid prototyping
prototyping process
rapid
Prior art date
Application number
HK07105409.7A
Other languages
English (en)
Inventor
Xiaorong You
Jigeng Xu
Original Assignee
Dsm Ip Assets Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dsm Ip Assets Bv filed Critical Dsm Ip Assets Bv
Publication of HK1099372A1 publication Critical patent/HK1099372A1/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2/00—Addition polymers of aldehydes or cyclic oligomers thereof or of ketones; Addition copolymers thereof with less than 50 molar percent of other substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
HK07105409.7A 2003-11-06 2007-05-22 Curable compositions and rapid prototyping process using the same HK1099372A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US51740703P 2003-11-06 2003-11-06
US52615103P 2003-12-02 2003-12-02
PCT/NL2004/000778 WO2005045525A1 (fr) 2003-11-06 2004-11-05 Compositions durcissables et procede de prototypage faisant intervenir celles-ci

Publications (1)

Publication Number Publication Date
HK1099372A1 true HK1099372A1 (en) 2007-08-10

Family

ID=34576795

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07105409.7A HK1099372A1 (en) 2003-11-06 2007-05-22 Curable compositions and rapid prototyping process using the same

Country Status (6)

Country Link
EP (1) EP1680713B1 (fr)
JP (1) JP2007514805A (fr)
KR (1) KR20060108660A (fr)
CN (1) CN1879058B (fr)
HK (1) HK1099372A1 (fr)
WO (1) WO2005045525A1 (fr)

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JP2006348214A (ja) * 2005-06-17 2006-12-28 Jsr Corp 光造形用光硬化性液状組成物、立体造形物及びその製造方法
JP4738128B2 (ja) * 2005-10-12 2011-08-03 株式会社Ａｄｅｋａ 光学的立体造形用樹脂組成物及びこれを用いた光学的立体造形方法
JP5582524B2 (ja) * 2006-07-14 2014-09-03 ディーエスエム アイピー アセッツ ビー．ブイ． 有機ナノ粒子の調製方法
WO2009007446A1 (fr) * 2007-07-12 2009-01-15 Dsm Ip Assets B.V. Nanoparticules organiques et leur procédé de fabrication
ES2550756T3 (es) * 2007-09-24 2015-11-12 Qspex Technologies, Inc. Método para fabricar lentes oftálmicas polarizadas
JP5699365B2 (ja) * 2009-12-17 2015-04-08 ディーエスエム アイピー アセッツ ビー．ブイ． カチオン系光重合開始剤トリアリールスルホニウムボレートを含む積層造形用液状放射線硬化樹脂
CN102385250A (zh) * 2011-06-29 2012-03-21 南昌大学 一种紫外激光固化快速成型光敏树脂及制备方法
DE102011079812A1 (de) * 2011-07-26 2013-01-31 Evonik Röhm Gmbh Polymerpulver zur Herstellung dreidimensionaler Objekte
JP6186804B2 (ja) * 2013-03-28 2017-08-30 大日本印刷株式会社 太陽電池モジュール用裏面保護シート
CN104710548B (zh) * 2014-01-03 2017-09-29 南京波斯塔新材料科技有限公司 一种3d打印用核心材料
CN104774312B (zh) * 2015-04-28 2017-09-19 烟台德邦科技有限公司 一种可混杂固化树脂及其合成方法
GB201604322D0 (en) * 2016-03-14 2016-04-27 Ucl Business Plc Three-dimensional printing of impregnated plastics for chemical reactions
KR20190039163A (ko) * 2016-08-08 2019-04-10 다우 코닝 도레이 캄파니 리미티드 경화성 입상 실리콘 조성물, 이것으로 이루어지는 반도체용 부재 및 이의 성형 방법
JP6930816B2 (ja) 2016-08-08 2021-09-01 ダウ・東レ株式会社 硬化性粒状シリコーン組成物、それからなる半導体用部材、およびその成型方法
EP3375820A1 (fr) * 2017-03-13 2018-09-19 TIGER Coatings GmbH & Co. KG Utilisation d'une composition de poudre de polymère thermodurcissable
CN108275979B (zh) * 2017-04-26 2020-06-16 深圳光韵达光电科技股份有限公司 一种用于光固化3d打印的陶瓷材料、陶瓷件及其制备方法
WO2018235491A1 (fr) 2017-06-19 2018-12-27 東レ・ダウコーニング株式会社 Composition de silicone granuleuse durcissable, élément semi-conducteur la comprenant, et procédé de formation associé
JP7115491B2 (ja) * 2017-09-22 2022-08-09 コニカミノルタ株式会社 樹脂組成物、およびこれを用いた立体造形物の製造方法、ならびに立体造形物
EP3732021A1 (fr) * 2017-12-29 2020-11-04 DSM IP Assets B.V. Compositions et articles pour l'impression 3d, et leurs procédés d'utilisation
WO2019193961A1 (fr) * 2018-04-02 2019-10-10 コニカミノルタ株式会社 Composition de résine, procédé de fabrication d'un article de forme tridimensionnelle l'utilisant, et article de forme tridimensionnelle
EP3902877A1 (fr) * 2018-12-27 2021-11-03 Stratasys Ltd. Fabrication additive à l'aide de matériaux renforcés
EP3719088A1 (fr) * 2019-04-02 2020-10-07 3M Innovative Properties Company Précurseur durcissable d'une composition adhésive structurale
EP3719089A1 (fr) * 2019-04-02 2020-10-07 3M Innovative Properties Company Procédé de fabrication d'un précurseur durcissable d'une composition adhésive structurale
CN111849394B (zh) * 2019-04-29 2021-12-28 常州强力电子新材料股份有限公司 光固化粘接剂组合物、光固化粘接剂、偏光板及光学设备
US11054352B2 (en) 2019-05-16 2021-07-06 The Boeing Company Method of testing additive manufactured material and additive manufactured parts

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WO1989007620A1 (fr) * 1988-02-19 1989-08-24 Asahi Denka Kogyo K.K. Preparation a base de resine pour le modelage optique
JPH09268205A (ja) * 1996-03-29 1997-10-14 Asahi Denka Kogyo Kk 光学的立体造形用樹脂組成物および光学的立体造形法
JP3626275B2 (ja) * 1996-04-09 2005-03-02 Ｊｓｒ株式会社 光硬化性樹脂組成物
JP3626302B2 (ja) * 1996-12-10 2005-03-09 Ｊｓｒ株式会社 光硬化性樹脂組成物
AU744727B2 (en) * 1997-07-21 2002-02-28 Vantico Ag Sedimentation stabilized radiation-curable filled compositions
JP4017236B2 (ja) * 1998-02-24 2007-12-05 Ｊｓｒ株式会社 光硬化性液状樹脂組成物
JP4017238B2 (ja) * 1998-02-24 2007-12-05 Ｊｓｒ株式会社 光硬化性液状樹脂組成物
US6136497A (en) * 1998-03-30 2000-10-24 Vantico, Inc. Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography
US6100007A (en) * 1998-04-06 2000-08-08 Ciba Specialty Chemicals Corp. Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures
JP4350832B2 (ja) * 1999-04-19 2009-10-21 Ｊｓｒ株式会社 立体造形用光硬化性樹脂組成物およびこれを硬化してなる造形物
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KR20120086737A (ko) * 2002-05-03 2012-08-03 디에스엠 아이피 어셋츠 비.브이. 방사선 경화성 수지 조성물 및 이를 이용한 급속 성형법
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Also Published As

Publication number Publication date
JP2007514805A (ja) 2007-06-07
WO2005045525A1 (fr) 2005-05-19
EP1680713A1 (fr) 2006-07-19
CN1879058B (zh) 2012-05-23
KR20060108660A (ko) 2006-10-18
EP1680713B1 (fr) 2015-09-23
CN1879058A (zh) 2006-12-13

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