HK1098985A1 - Laser machining apparatus - Google Patents

Laser machining apparatus

Info

Publication number
HK1098985A1
HK1098985A1 HK07105214.2A HK07105214A HK1098985A1 HK 1098985 A1 HK1098985 A1 HK 1098985A1 HK 07105214 A HK07105214 A HK 07105214A HK 1098985 A1 HK1098985 A1 HK 1098985A1
Authority
HK
Hong Kong
Prior art keywords
machining apparatus
laser machining
laser
machining
Prior art date
Application number
HK07105214.2A
Other languages
English (en)
Inventor
Nobuaki Iehisa
Original Assignee
Kataoka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kataoka Corp filed Critical Kataoka Corp
Publication of HK1098985A1 publication Critical patent/HK1098985A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
    • H01S3/131—Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
    • H01S3/1312—Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the active medium, e.g. by controlling the processes or apparatus for excitation by controlling the optical pumping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/10069—Memorized or pre-programmed characteristics, e.g. look-up table [LUT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/16—Solid materials
    • H01S3/163—Solid materials characterised by a crystal matrix
    • H01S3/164—Solid materials characterised by a crystal matrix garnet
    • H01S3/1643—YAG
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0428—Electrical excitation ; Circuits therefor for applying pulses to the laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/0617—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium using memorised or pre-programmed laser characteristics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Lasers (AREA)
  • Laser Beam Processing (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Semiconductor Lasers (AREA)
HK07105214.2A 2001-10-16 2007-05-17 Laser machining apparatus HK1098985A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001318645 2001-10-16
JP2001318644 2001-10-16

Publications (1)

Publication Number Publication Date
HK1098985A1 true HK1098985A1 (en) 2007-08-03

Family

ID=26623934

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07105214.2A HK1098985A1 (en) 2001-10-16 2007-05-17 Laser machining apparatus

Country Status (8)

Country Link
US (2) US7215689B2 (xx)
EP (2) EP2355270A3 (xx)
JP (2) JPWO2003034555A1 (xx)
KR (2) KR100598247B1 (xx)
CN (2) CN1572049B (xx)
CA (1) CA2461754A1 (xx)
HK (1) HK1098985A1 (xx)
WO (1) WO2003034555A1 (xx)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003034555A1 (fr) 2001-10-16 2003-04-24 Kataoka Corporation Appareil laser solide a oscillations d'impulsions et appareil d'usinage a laser
US7352784B2 (en) 2004-07-20 2008-04-01 Jds Uniphase Corporation Laser burst boosting method and apparatus
TWI380868B (zh) * 2005-02-02 2013-01-01 Mitsuboshi Diamond Ind Co Ltdl Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same
CN101427429B (zh) 2006-04-25 2013-07-10 三菱电机株式会社 激光振荡器及其电源装置、该激光振荡器的控制方法
JP2008028317A (ja) * 2006-07-25 2008-02-07 Fanuc Ltd レーザ装置
JP4271247B2 (ja) * 2007-04-10 2009-06-03 ファナック株式会社 レーザ装置
JP4994452B2 (ja) * 2007-07-04 2012-08-08 三菱電機株式会社 レーザ加工装置、加工制御装置および加工装置
JP5219623B2 (ja) * 2008-05-23 2013-06-26 三菱電機株式会社 レーザ加工制御装置およびレーザ加工装置
JP5303305B2 (ja) * 2009-02-16 2013-10-02 東芝Ｉｔコントロールシステム株式会社 レーザ制御装置
BR112012011822A2 (pt) * 2009-11-18 2017-09-26 Wavelight Gmbh dispositivo de processamento de material, e, processo para operar um dispositivo de processamento de material
JP2011142187A (ja) * 2010-01-06 2011-07-21 Nikon Corp レーザ装置
JP5388913B2 (ja) * 2010-03-15 2014-01-15 三菱電機株式会社 画像表示装置
JP5995414B2 (ja) * 2011-06-20 2016-09-21 キヤノン株式会社 レーザー装置
JP6096022B2 (ja) * 2013-03-25 2017-03-15 株式会社フジクラ ファイバレーザ装置における出力光パワー低下の判定方法及び光増幅システム
JP5947740B2 (ja) * 2013-03-29 2016-07-06 トヨタ自動車株式会社 溶接部の検査装置とその検査方法
FR3010924B1 (fr) 2013-09-20 2015-11-06 Essilor Int Dispositif et procede de marquage laser d'une lentille ophtalmique
TW201544222A (zh) * 2014-02-21 2015-12-01 Panasonic Ip Man Co Ltd 雷射加工裝置
JP6234296B2 (ja) * 2014-03-27 2017-11-22 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
JP6771810B2 (ja) * 2015-04-20 2020-10-21 住友重機械工業株式会社 レーザ加工装置
CN107855672B (zh) * 2017-12-22 2024-03-01 上海海事大学 一种耦合高能量脉冲电流降低激光焊接残余应力的方法及系统
KR101976441B1 (ko) * 2018-11-27 2019-08-28 주식회사 21세기 펨토초 레이저를 이용한 초정밀 블레이드 엣지 가공방법
CN112542763A (zh) * 2019-09-20 2021-03-23 山东华光光电子股份有限公司 一种用于激光器的指示装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57202794A (en) * 1981-06-09 1982-12-11 Mitsubishi Electric Corp Controlling device for laser output
US4553155A (en) * 1982-06-18 1985-11-12 At&T Bell Laboratories High speed bias-free photodetector
JPH0714097B2 (ja) 1985-10-30 1995-02-15 株式会社日平トヤマ レ−ザ出力制御装置
JPS63104389A (ja) * 1986-10-21 1988-05-09 Mitsubishi Electric Corp レ−ザ出力測定装置
DE3733489A1 (de) * 1987-10-03 1989-04-20 Telemit Electronic Gmbh Verfahren und vorrichtung zur materialbearbeitung mit hilfe eines lasers
JP2820939B2 (ja) 1988-08-18 1998-11-05 ファナック 株式会社 Ｎｃレーザ装置
JP2537571Y2 (ja) * 1990-02-23 1997-06-04 ミヤチテクノス株式会社 レーザ装置
JPH0459193A (ja) 1990-06-28 1992-02-26 Nec Corp レーザ加工装置
JP3580430B2 (ja) 1991-12-18 2004-10-20 株式会社ニコン 露光システム及び露光方法
JP2917642B2 (ja) * 1992-01-24 1999-07-12 三菱電機株式会社 レーザ出力制御装置
JPH05212047A (ja) 1992-02-10 1993-08-24 Olympus Optical Co Ltd レーザ装置
JP2720744B2 (ja) * 1992-12-28 1998-03-04 三菱電機株式会社 レーザ加工機
JPH0724587A (ja) 1993-07-13 1995-01-27 Matsushita Electric Ind Co Ltd レーザ照射装置
JP3315556B2 (ja) * 1994-04-27 2002-08-19 三菱電機株式会社 レーザ加工装置
JP3494517B2 (ja) 1995-03-17 2004-02-09 ミヤチテクノス株式会社 固体レーザ装置
US5740194A (en) * 1995-03-17 1998-04-14 Miyachi Technos Corporation Solid-state laser apparatus
DE19705330C1 (de) * 1997-02-12 1998-02-19 Lambda Physik Gmbh Verfahren und Festkörperlasersystem zum Erzeugen von Laserimpulsen mit variabler Impulsfolgefrequenz und konstanten Strahleigenschaften
IT1290576B1 (it) * 1997-03-07 1998-12-10 Cise Spa Dispositivo per la rilevazione di parametri ottici di un fascio laser
US5854805A (en) * 1997-03-21 1998-12-29 Lumonics Inc. Laser machining of a workpiece
JPH11156570A (ja) 1997-11-21 1999-06-15 Daihen Corp レーザ加工装置
JPH11320147A (ja) * 1998-05-18 1999-11-24 Miyachi Technos Corp レーザ加工装置
US6418154B1 (en) * 1999-06-07 2002-07-09 Coherent, Inc. Pulsed diode-pumped solid-state laser
WO2003034555A1 (fr) * 2001-10-16 2003-04-24 Kataoka Corporation Appareil laser solide a oscillations d'impulsions et appareil d'usinage a laser

Also Published As

Publication number Publication date
KR100598247B1 (ko) 2006-07-07
WO2003034555A1 (fr) 2003-04-24
EP1437806B1 (en) 2014-11-19
EP1437806A4 (en) 2008-04-30
US20040258108A1 (en) 2004-12-23
EP1437806A1 (en) 2004-07-14
US7653103B2 (en) 2010-01-26
KR20040058204A (ko) 2004-07-03
CN1572049A (zh) 2005-01-26
EP2355270A3 (en) 2012-05-09
KR20060014460A (ko) 2006-02-15
CN1572049B (zh) 2012-06-06
JP2009065202A (ja) 2009-03-26
CA2461754A1 (en) 2003-04-24
US20080165814A1 (en) 2008-07-10
CN1907633A (zh) 2007-02-07
JPWO2003034555A1 (ja) 2005-02-03
JP5435930B2 (ja) 2014-03-05
KR100598248B1 (ko) 2006-07-07
US7215689B2 (en) 2007-05-08
EP2355270A2 (en) 2011-08-10
CN1907633B (zh) 2012-09-26

Similar Documents

Publication Publication Date Title
HK1098985A1 (en) Laser machining apparatus
TWI297628B (en) Laser machining method
SG108963A1 (en) Machining apparatus utilizing laser beam
EP1409958A4 (en) LASER LEVELING DEVICE
AU2002359687A8 (en) Multiple laser treatment
GB0214419D0 (en) Laser beam machining apparatus and laser beam machining method
GB0311318D0 (en) Work welding method
AU2002357185A8 (en) Multiple laser diagnostics
TW582314U (en) Laser positioning device
AU2002350581A1 (en) Laser apparatus
GB0119974D0 (en) Laser systems
GB0117789D0 (en) Laser apparatus
EP1453156A4 (en) LASER DEVICE
AU2001271286A1 (en) Apparatus for microchip laser geo-sensors
GB2372628B (en) Solid state laser apparatus
SG109505A1 (en) Laminated core machining apparatus
GB0213883D0 (en) Workpiece support
GB0120845D0 (en) Laser apparatus
GB0108291D0 (en) Laser
AU2002254975A1 (en) Laser apparatus
GB0117788D0 (en) Laser apparatus
GB0116747D0 (en) Machining apparatus
GB0126071D0 (en) Ranging apparatus
GB2394436B (en) Laser machining
AU2002232228A1 (en) Laser apparatus

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170218