GB2394436B - Laser machining - Google Patents

Laser machining

Info

Publication number
GB2394436B
GB2394436B GB0224585A GB0224585A GB2394436B GB 2394436 B GB2394436 B GB 2394436B GB 0224585 A GB0224585 A GB 0224585A GB 0224585 A GB0224585 A GB 0224585A GB 2394436 B GB2394436 B GB 2394436B
Authority
GB
United Kingdom
Prior art keywords
laser machining
machining
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0224585A
Other versions
GB0224585D0 (en
GB2394436A (en
Inventor
Adrian Boyle
Maria Farsari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xsil Technology Ltd
Original Assignee
Xsil Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xsil Technology Ltd filed Critical Xsil Technology Ltd
Priority to GB0224585A priority Critical patent/GB2394436B/en
Publication of GB0224585D0 publication Critical patent/GB0224585D0/en
Priority to US10/523,846 priority patent/US20060163209A1/en
Priority to KR1020057002172A priority patent/KR20050033072A/en
Priority to EP03784191A priority patent/EP1529309A1/en
Priority to JP2004526895A priority patent/JP4718835B2/en
Priority to PCT/EP2003/008706 priority patent/WO2004015753A1/en
Priority to AU2003260374A priority patent/AU2003260374A1/en
Publication of GB2394436A publication Critical patent/GB2394436A/en
Application granted granted Critical
Publication of GB2394436B publication Critical patent/GB2394436B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
GB0224585A 2002-08-06 2002-10-22 Laser machining Expired - Fee Related GB2394436B (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB0224585A GB2394436B (en) 2002-10-22 2002-10-22 Laser machining
US10/523,846 US20060163209A1 (en) 2002-08-06 2003-08-06 Laser machining
KR1020057002172A KR20050033072A (en) 2002-08-06 2003-08-06 Laser machining
EP03784191A EP1529309A1 (en) 2002-08-06 2003-08-06 Laser machinining
JP2004526895A JP4718835B2 (en) 2002-08-06 2003-08-06 Laser machining method
PCT/EP2003/008706 WO2004015753A1 (en) 2002-08-06 2003-08-06 Laser machinining
AU2003260374A AU2003260374A1 (en) 2002-08-06 2003-08-06 Laser machinining

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0224585A GB2394436B (en) 2002-10-22 2002-10-22 Laser machining

Publications (3)

Publication Number Publication Date
GB0224585D0 GB0224585D0 (en) 2002-12-04
GB2394436A GB2394436A (en) 2004-04-28
GB2394436B true GB2394436B (en) 2006-03-15

Family

ID=9946367

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0224585A Expired - Fee Related GB2394436B (en) 2002-08-06 2002-10-22 Laser machining

Country Status (1)

Country Link
GB (1) GB2394436B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3866398A (en) * 1973-12-20 1975-02-18 Texas Instruments Inc In-situ gas-phase reaction for removal of laser-scribe debris
JPS61140396A (en) * 1984-12-14 1986-06-27 Fujikura Ltd Machining method of material by laser beam
US5164324A (en) * 1990-03-29 1992-11-17 The United States Of America As Represented By The Secretary Of The Navy Laser texturing
US5266532A (en) * 1990-03-29 1993-11-30 The United States Of America As Represented By The Secretary Of The Navy Method for laser-assisted silicon etching using halocarbon ambients
US5322988A (en) * 1990-03-29 1994-06-21 The United States Of America As Represented By The Secretary Of The Navy Laser texturing
US5348609A (en) * 1990-03-29 1994-09-20 The United States Of America As Represented By The Secretary Of The Navy Method for laser-assisted silicon etching using halocarbon ambients

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3866398A (en) * 1973-12-20 1975-02-18 Texas Instruments Inc In-situ gas-phase reaction for removal of laser-scribe debris
JPS61140396A (en) * 1984-12-14 1986-06-27 Fujikura Ltd Machining method of material by laser beam
US5164324A (en) * 1990-03-29 1992-11-17 The United States Of America As Represented By The Secretary Of The Navy Laser texturing
US5266532A (en) * 1990-03-29 1993-11-30 The United States Of America As Represented By The Secretary Of The Navy Method for laser-assisted silicon etching using halocarbon ambients
US5322988A (en) * 1990-03-29 1994-06-21 The United States Of America As Represented By The Secretary Of The Navy Laser texturing
US5348609A (en) * 1990-03-29 1994-09-20 The United States Of America As Represented By The Secretary Of The Navy Method for laser-assisted silicon etching using halocarbon ambients
US5385633A (en) * 1990-03-29 1995-01-31 The United States Of America As Represented By The Secretary Of The Navy Method for laser-assisted silicon etching using halocarbon ambients

Also Published As

Publication number Publication date
GB0224585D0 (en) 2002-12-04
GB2394436A (en) 2004-04-28

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20081022