HK1098246A1 - Conductive filler and use thereof - Google Patents

Conductive filler and use thereof

Info

Publication number
HK1098246A1
HK1098246A1 HK07104421.4A HK07104421A HK1098246A1 HK 1098246 A1 HK1098246 A1 HK 1098246A1 HK 07104421 A HK07104421 A HK 07104421A HK 1098246 A1 HK1098246 A1 HK 1098246A1
Authority
HK
Hong Kong
Prior art keywords
conductive filler
conductive
elastomer
graphite
microns
Prior art date
Application number
HK07104421.4A
Other languages
English (en)
Inventor
Brian William Callen
William Kimber Walkhouse
Original Assignee
Sulzer Metco Canada Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sulzer Metco Canada Inc filed Critical Sulzer Metco Canada Inc
Publication of HK1098246A1 publication Critical patent/HK1098246A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
HK07104421.4A 2005-07-12 2007-04-25 Conductive filler and use thereof HK1098246A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05405434 2005-07-12

Publications (1)

Publication Number Publication Date
HK1098246A1 true HK1098246A1 (en) 2007-07-13

Family

ID=34943000

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07104421.4A HK1098246A1 (en) 2005-07-12 2007-04-25 Conductive filler and use thereof

Country Status (14)

Country Link
US (2) US20070012900A1 (de)
EP (1) EP1744326B1 (de)
JP (1) JP2007027111A (de)
KR (1) KR101224091B1 (de)
AT (1) ATE444558T1 (de)
CA (1) CA2548835C (de)
DE (1) DE602006009442D1 (de)
DK (1) DK1744326T3 (de)
ES (1) ES2332106T3 (de)
HK (1) HK1098246A1 (de)
PL (1) PL1744326T3 (de)
SG (1) SG129379A1 (de)
SI (1) SI1744326T1 (de)
TW (1) TWI381399B (de)

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CN104558979B (zh) * 2014-12-26 2016-08-24 中北大学 通过导电性大分子偶联剂制备碳基填料/聚合物基复合材料的方法
CN104637566B (zh) * 2015-02-16 2017-01-04 中国科学院宁波材料技术与工程研究所 一种金属/石墨烯复合材料及其制备方法和应用
KR101704454B1 (ko) * 2015-05-18 2017-02-09 대상에스티 주식회사 전자파 차폐 필름
US10744736B2 (en) 2015-06-12 2020-08-18 Neograf Solutions, Llc Graphite composites and thermal management systems
JP6704229B2 (ja) 2015-09-14 2020-06-03 リンテック オブ アメリカ インコーポレーテッドＬｉｎｔｅｃ ｏｆ Ａｍｅｒｉｃａ， Ｉｎｃ． 柔軟性シート、熱伝導部材、導電性部材、帯電防止部材、発熱体、電磁波遮蔽体、及び柔軟性シートの製造方法
US10183420B2 (en) * 2016-02-15 2019-01-22 General Electric Company Resistively heated thermoplastic washout mandrel
US11189420B2 (en) 2016-03-31 2021-11-30 Neograf Solutions, Llc Noise suppressing assemblies
US10711141B1 (en) * 2016-10-04 2020-07-14 Triton Systems, Inc. Nickel free conductive filler
US10468574B2 (en) * 2017-05-04 2019-11-05 Baker Hughes, A Ge Company, Llc Thermoelectric materials and related compositions and methods
US11075331B2 (en) 2018-07-30 2021-07-27 Gentherm Incorporated Thermoelectric device having circuitry with structural rigidity
US20200123379A1 (en) * 2018-10-23 2020-04-23 Lockheed Martin Corporation Toughened, high conductivity emi thermoplastic with nanomaterials and articles and methods thereof
US20230311204A1 (en) * 2020-11-20 2023-10-05 Oerlikon Metco (Us) Inc. Electrically conductive fillers with improved microwave shielding performance
WO2022120186A1 (en) * 2020-12-03 2022-06-09 Oerlikon Metco (Us) Inc. Electrically conductive fillers with improved corrosion resistance

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Also Published As

Publication number Publication date
KR20070008407A (ko) 2007-01-17
TWI381399B (zh) 2013-01-01
DE602006009442D1 (de) 2009-11-12
ES2332106T3 (es) 2010-01-26
DK1744326T3 (da) 2009-11-23
ATE444558T1 (de) 2009-10-15
KR101224091B1 (ko) 2013-01-18
PL1744326T3 (pl) 2010-03-31
EP1744326B1 (de) 2009-09-30
US20110108775A1 (en) 2011-05-12
JP2007027111A (ja) 2007-02-01
EP1744326A1 (de) 2007-01-17
CA2548835C (en) 2013-11-12
US20070012900A1 (en) 2007-01-18
SI1744326T1 (sl) 2010-01-29
TW200707467A (en) 2007-02-16
CA2548835A1 (en) 2007-01-12
SG129379A1 (en) 2007-02-26

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150613