DE602006009442D1 - Leitfähiger Füllstoff und Verwendung desselben - Google Patents

Leitfähiger Füllstoff und Verwendung desselben

Info

Publication number
DE602006009442D1
DE602006009442D1 DE602006009442T DE602006009442T DE602006009442D1 DE 602006009442 D1 DE602006009442 D1 DE 602006009442D1 DE 602006009442 T DE602006009442 T DE 602006009442T DE 602006009442 T DE602006009442 T DE 602006009442T DE 602006009442 D1 DE602006009442 D1 DE 602006009442D1
Authority
DE
Germany
Prior art keywords
conductive filler
conductive
elastomer
graphite
microns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006009442T
Other languages
English (en)
Inventor
Brian William Callen
William Kimber Walkhouse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oerlikon Metco Canada Inc
Original Assignee
Sulzer Metco Canada Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sulzer Metco Canada Inc filed Critical Sulzer Metco Canada Inc
Publication of DE602006009442D1 publication Critical patent/DE602006009442D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
DE602006009442T 2005-07-12 2006-06-13 Leitfähiger Füllstoff und Verwendung desselben Active DE602006009442D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05405434 2005-07-12

Publications (1)

Publication Number Publication Date
DE602006009442D1 true DE602006009442D1 (de) 2009-11-12

Family

ID=34943000

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006009442T Active DE602006009442D1 (de) 2005-07-12 2006-06-13 Leitfähiger Füllstoff und Verwendung desselben

Country Status (14)

Country Link
US (2) US20070012900A1 (de)
EP (1) EP1744326B1 (de)
JP (1) JP2007027111A (de)
KR (1) KR101224091B1 (de)
AT (1) ATE444558T1 (de)
CA (1) CA2548835C (de)
DE (1) DE602006009442D1 (de)
DK (1) DK1744326T3 (de)
ES (1) ES2332106T3 (de)
HK (1) HK1098246A1 (de)
PL (1) PL1744326T3 (de)
SG (1) SG129379A1 (de)
SI (1) SI1744326T1 (de)
TW (1) TWI381399B (de)

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TWI381399B (zh) * 2005-07-12 2013-01-01 Sulzer Metco Canada Inc 性能增進之導電性填料及由該填料製成的聚合物
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KR100956240B1 (ko) * 2007-11-14 2010-05-06 삼성전기주식회사 고분자 복합체
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US8299159B2 (en) * 2009-08-17 2012-10-30 Laird Technologies, Inc. Highly thermally-conductive moldable thermoplastic composites and compositions
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US9346991B2 (en) * 2011-04-14 2016-05-24 Ada Technologies, Inc. Thermal interface materials and systems and devices containing the same
EP2557571B1 (de) * 2011-08-08 2014-07-02 Tyco Electronics Corporation Elektrisch leitfähige Metall-/Kunststoffmischung mit einem Polymermaterial, einem ersten Metall und Metallpartikel eines zweiten Metalls eingebettet in das erste Metall und Herstellungsverfahren dafür
DE112012004803B4 (de) 2011-11-17 2022-03-03 Gentherm Inc. Thermoelektrische Vorrichtung mit Grenzflächenmaterialien und Verfahren zur Herstellung derselben
US9780061B2 (en) * 2014-05-26 2017-10-03 Infineon Technologies Ag Molded chip package and method of manufacturing the same
KR101597346B1 (ko) 2014-05-30 2016-02-25 (주) 유니플라텍 저비중 도전 입자를 포함하는 코팅제 조성물을 이용한 전자파 차폐 필름
CN104558979B (zh) * 2014-12-26 2016-08-24 中北大学 通过导电性大分子偶联剂制备碳基填料/聚合物基复合材料的方法
CN104637566B (zh) * 2015-02-16 2017-01-04 中国科学院宁波材料技术与工程研究所 一种金属/石墨烯复合材料及其制备方法和应用
KR101704454B1 (ko) * 2015-05-18 2017-02-09 대상에스티 주식회사 전자파 차폐 필름
KR102458548B1 (ko) 2015-06-12 2022-10-25 네오그라프 솔루션즈, 엘엘씨 그라파이트 복합재 및 열적 관리 시스템
JP6704229B2 (ja) 2015-09-14 2020-06-03 リンテック オブ アメリカ インコーポレーテッドＬｉｎｔｅｃ ｏｆ Ａｍｅｒｉｃａ， Ｉｎｃ． 柔軟性シート、熱伝導部材、導電性部材、帯電防止部材、発熱体、電磁波遮蔽体、及び柔軟性シートの製造方法
US10183420B2 (en) * 2016-02-15 2019-01-22 General Electric Company Resistively heated thermoplastic washout mandrel
KR102359198B1 (ko) 2016-03-31 2022-02-07 네오그라프 솔루션즈, 엘엘씨 노이즈 억제 조립체
US11076514B1 (en) 2016-10-04 2021-07-27 Triton Systems, Inc. Metalized fiber mat
US10468574B2 (en) * 2017-05-04 2019-11-05 Baker Hughes, A Ge Company, Llc Thermoelectric materials and related compositions and methods
US11223004B2 (en) 2018-07-30 2022-01-11 Gentherm Incorporated Thermoelectric device having a polymeric coating
US20200123379A1 (en) * 2018-10-23 2020-04-23 Lockheed Martin Corporation Toughened, high conductivity emi thermoplastic with nanomaterials and articles and methods thereof
KR20230107788A (ko) * 2020-11-20 2023-07-18 오를리콘 메트코 (유에스) 아이엔씨. 개선된 전자파 차폐 성능을 갖는 전기전도성 충전제
US20230380121A1 (en) * 2020-12-03 2023-11-23 Oerlikon Metco (Us) Inc. Electrically conductive fillers with improved corrosion resistance

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US5366664A (en) * 1992-05-04 1994-11-22 The Penn State Research Foundation Electromagnetic shielding materials
US5498372A (en) 1992-08-14 1996-03-12 Hexcel Corporation Electrically conductive polymeric compositions
US6132645A (en) 1992-08-14 2000-10-17 Eeonyx Corporation Electrically conductive compositions of carbon particles and methods for their production
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DE4317302A1 (de) * 1993-05-25 1994-12-01 Degussa Leitfähige Bodenbeschichtung
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US20030113531A1 (en) * 2001-12-19 2003-06-19 Karel Hajmrle Conductive fillers and conductive polymers made therefrom
JP3749504B2 (ja) * 2002-05-29 2006-03-01 Ｔｄｋ株式会社 Ｐｔｃ組成物、サーミスタ素子およびこれらの製造方法
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DE10253399A1 (de) * 2002-11-15 2004-05-27 Eramet & Comilog Chemicals S.A. Carbon-Black-Zusammensetzungen und ihre Anwendungen
TWI276117B (en) * 2003-07-04 2007-03-11 Natoco Co Ltd Coated conductive particle, conductive material, anisotropic conductive adhesive and anisotropic conductive junction structure
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EP1876249A4 (de) * 2005-03-29 2014-10-01 Hitachi Metals Ltd Gut wärmeleitender verbundwerkstoff mit dispergiertem graphitkorn und herstellungsverfahren dafür
TWI381399B (zh) * 2005-07-12 2013-01-01 Sulzer Metco Canada Inc 性能增進之導電性填料及由該填料製成的聚合物

Also Published As

Publication number Publication date
US20110108775A1 (en) 2011-05-12
EP1744326B1 (de) 2009-09-30
DK1744326T3 (da) 2009-11-23
SI1744326T1 (sl) 2010-01-29
TW200707467A (en) 2007-02-16
HK1098246A1 (en) 2007-07-13
CA2548835C (en) 2013-11-12
PL1744326T3 (pl) 2010-03-31
EP1744326A1 (de) 2007-01-17
TWI381399B (zh) 2013-01-01
SG129379A1 (en) 2007-02-26
ATE444558T1 (de) 2009-10-15
ES2332106T3 (es) 2010-01-26
US20070012900A1 (en) 2007-01-18
CA2548835A1 (en) 2007-01-12
JP2007027111A (ja) 2007-02-01
KR20070008407A (ko) 2007-01-17
KR101224091B1 (ko) 2013-01-18

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