ATE444558T1 - Leitfähiger füllstoff und verwendung desselben - Google Patents

Leitfähiger füllstoff und verwendung desselben

Info

Publication number
ATE444558T1
ATE444558T1 AT06405255T AT06405255T ATE444558T1 AT E444558 T1 ATE444558 T1 AT E444558T1 AT 06405255 T AT06405255 T AT 06405255T AT 06405255 T AT06405255 T AT 06405255T AT E444558 T1 ATE444558 T1 AT E444558T1
Authority
AT
Austria
Prior art keywords
conductive filler
conductive
elastomer
graphite
microns
Prior art date
Application number
AT06405255T
Other languages
English (en)
Inventor
Brian William Callen
William Kimber Walkhouse
Original Assignee
Sulzer Metco Canada Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sulzer Metco Canada Inc filed Critical Sulzer Metco Canada Inc
Application granted granted Critical
Publication of ATE444558T1 publication Critical patent/ATE444558T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
AT06405255T 2005-07-12 2006-06-13 Leitfähiger füllstoff und verwendung desselben ATE444558T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05405434 2005-07-12

Publications (1)

Publication Number Publication Date
ATE444558T1 true ATE444558T1 (de) 2009-10-15

Family

ID=34943000

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06405255T ATE444558T1 (de) 2005-07-12 2006-06-13 Leitfähiger füllstoff und verwendung desselben

Country Status (13)

Country Link
US (2) US20070012900A1 (de)
EP (1) EP1744326B1 (de)
JP (1) JP2007027111A (de)
KR (1) KR101224091B1 (de)
AT (1) ATE444558T1 (de)
CA (1) CA2548835C (de)
DE (1) DE602006009442D1 (de)
DK (1) DK1744326T3 (de)
ES (1) ES2332106T3 (de)
PL (1) PL1744326T3 (de)
SG (1) SG129379A1 (de)
SI (1) SI1744326T1 (de)
TW (1) TWI381399B (de)

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TWI381399B (zh) * 2005-07-12 2013-01-01 Sulzer Metco Canada Inc 性能增進之導電性填料及由該填料製成的聚合物
JP5496446B2 (ja) * 2007-07-12 2014-05-21 東海ゴム工業株式会社 静電容量型センサ
KR100850007B1 (ko) * 2007-08-31 2008-08-01 이재욱 전자파를 차폐하는 조성물, 이의 제조방법 및 전자파차폐기능을 갖는 카메라 하우징
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US8299159B2 (en) * 2009-08-17 2012-10-30 Laird Technologies, Inc. Highly thermally-conductive moldable thermoplastic composites and compositions
BR112012006139A2 (pt) * 2009-10-02 2016-06-28 Saint Gobain Performance Plast vedação de emi/rfi polimérica modular.
US8673416B2 (en) * 2009-10-28 2014-03-18 Xerox Corporation Multilayer electrical component, coating composition, and method of making electrical component
US20120080639A1 (en) * 2010-10-04 2012-04-05 Laird Technologies, Inc. Potato shaped graphite filler, thermal interface materials and emi shielding
MX2013006845A (es) * 2010-12-28 2013-07-29 Saint Gobain Performance Plast Polimeros con material de relleno metalico para apantallamiento contra la interferencia electromagnetica (emi).
US9346991B2 (en) * 2011-04-14 2016-05-24 Ada Technologies, Inc. Thermal interface materials and systems and devices containing the same
EP2557571B1 (de) * 2011-08-08 2014-07-02 Tyco Electronics Corporation Elektrisch leitfähige Metall-/Kunststoffmischung mit einem Polymermaterial, einem ersten Metall und Metallpartikel eines zweiten Metalls eingebettet in das erste Metall und Herstellungsverfahren dafür
US9178128B2 (en) 2011-11-17 2015-11-03 Gentherm Incorporated Thermoelectric devices with interface materials and methods of manufacturing the same
US9780061B2 (en) * 2014-05-26 2017-10-03 Infineon Technologies Ag Molded chip package and method of manufacturing the same
KR101597346B1 (ko) 2014-05-30 2016-02-25 (주) 유니플라텍 저비중 도전 입자를 포함하는 코팅제 조성물을 이용한 전자파 차폐 필름
CN104558979B (zh) * 2014-12-26 2016-08-24 中北大学 通过导电性大分子偶联剂制备碳基填料/聚合物基复合材料的方法
CN104637566B (zh) * 2015-02-16 2017-01-04 中国科学院宁波材料技术与工程研究所 一种金属/石墨烯复合材料及其制备方法和应用
KR101704454B1 (ko) * 2015-05-18 2017-02-09 대상에스티 주식회사 전자파 차폐 필름
US10744736B2 (en) 2015-06-12 2020-08-18 Neograf Solutions, Llc Graphite composites and thermal management systems
JP6704229B2 (ja) 2015-09-14 2020-06-03 リンテック オブ アメリカ インコーポレーテッドＬｉｎｔｅｃ ｏｆ Ａｍｅｒｉｃａ， Ｉｎｃ． 柔軟性シート、熱伝導部材、導電性部材、帯電防止部材、発熱体、電磁波遮蔽体、及び柔軟性シートの製造方法
US10183420B2 (en) * 2016-02-15 2019-01-22 General Electric Company Resistively heated thermoplastic washout mandrel
EP3436512A4 (de) 2016-03-31 2019-12-11 NeoGraf Solutions, LLC Rauschunterdrückungsanordnungen
US10711141B1 (en) * 2016-10-04 2020-07-14 Triton Systems, Inc. Nickel free conductive filler
US10468574B2 (en) * 2017-05-04 2019-11-05 Baker Hughes, A Ge Company, Llc Thermoelectric materials and related compositions and methods
US20200035898A1 (en) 2018-07-30 2020-01-30 Gentherm Incorporated Thermoelectric device having circuitry that facilitates manufacture
US20200123379A1 (en) * 2018-10-23 2020-04-23 Lockheed Martin Corporation Toughened, high conductivity emi thermoplastic with nanomaterials and articles and methods thereof
WO2022109281A1 (en) * 2020-11-20 2022-05-27 Oerlikon Metco (Us) Inc. Electrically conductive fillers with improved microwave shielding performance
US20230380121A1 (en) * 2020-12-03 2023-11-23 Oerlikon Metco (Us) Inc. Electrically conductive fillers with improved corrosion resistance
CN115019999A (zh) * 2022-06-30 2022-09-06 航天特种材料及工艺技术研究所 一种耐高温铂包镍导电浆料及其制备方法

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TWI381399B (zh) * 2005-07-12 2013-01-01 Sulzer Metco Canada Inc 性能增進之導電性填料及由該填料製成的聚合物

Also Published As

Publication number Publication date
PL1744326T3 (pl) 2010-03-31
JP2007027111A (ja) 2007-02-01
TWI381399B (zh) 2013-01-01
KR101224091B1 (ko) 2013-01-18
ES2332106T3 (es) 2010-01-26
DE602006009442D1 (de) 2009-11-12
SI1744326T1 (sl) 2010-01-29
DK1744326T3 (da) 2009-11-23
US20070012900A1 (en) 2007-01-18
EP1744326A1 (de) 2007-01-17
CA2548835C (en) 2013-11-12
CA2548835A1 (en) 2007-01-12
EP1744326B1 (de) 2009-09-30
SG129379A1 (en) 2007-02-26
US20110108775A1 (en) 2011-05-12
HK1098246A1 (en) 2007-07-13
TW200707467A (en) 2007-02-16
KR20070008407A (ko) 2007-01-17

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