HK1095210A1 - Transfer mechanism and transfer method of semiconductor package - Google Patents

Transfer mechanism and transfer method of semiconductor package

Info

Publication number
HK1095210A1
HK1095210A1 HK07102623.4A HK07102623A HK1095210A1 HK 1095210 A1 HK1095210 A1 HK 1095210A1 HK 07102623 A HK07102623 A HK 07102623A HK 1095210 A1 HK1095210 A1 HK 1095210A1
Authority
HK
Hong Kong
Prior art keywords
transfer
semiconductor package
transfer mechanism
transfer method
package
Prior art date
Application number
HK07102623.4A
Other languages
English (en)
Inventor
Hyun-Gyun Jung
Suk-Bae Kim
Original Assignee
Hanmi Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanmi Semiconductor Co Ltd filed Critical Hanmi Semiconductor Co Ltd
Publication of HK1095210A1 publication Critical patent/HK1095210A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
HK07102623.4A 2003-12-22 2007-03-09 Transfer mechanism and transfer method of semiconductor package HK1095210A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020030094757A KR20050063359A (ko) 2003-12-22 2003-12-22 반도체 패키지 이송 메카니즘 및 이송방법
PCT/KR2004/003339 WO2005062375A1 (en) 2003-12-22 2004-12-17 Transfer mechanism and transfer method of semiconductor package

Publications (1)

Publication Number Publication Date
HK1095210A1 true HK1095210A1 (en) 2007-04-27

Family

ID=34709234

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07102623.4A HK1095210A1 (en) 2003-12-22 2007-03-09 Transfer mechanism and transfer method of semiconductor package

Country Status (5)

Country Link
US (1) US20060272987A1 (zh)
KR (1) KR20050063359A (zh)
CN (1) CN100401496C (zh)
HK (1) HK1095210A1 (zh)
WO (1) WO2005062375A1 (zh)

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TWI387053B (zh) 2004-08-23 2013-02-21 Rokko Systems Pte Ltd 用於積體電路切割裝置之夾盤的供給機構
KR100693197B1 (ko) * 2005-11-04 2007-03-13 삼성전자주식회사 비전검사장치
KR100769860B1 (ko) * 2005-12-12 2007-10-24 옵토팩 주식회사 이미지센서 패키지 검사 장치 및 방법
TWI323503B (en) 2005-12-12 2010-04-11 Optopac Co Ltd Apparatus, unit and method for testing image sensor packages
KR100792485B1 (ko) 2006-07-01 2008-01-10 (주)테크윙 픽앤플레이스 장치
KR100795950B1 (ko) * 2006-09-06 2008-01-21 한미반도체 주식회사 반도체 패키지 처리장치 및 그 제어방법
KR100838240B1 (ko) * 2006-12-29 2008-06-17 한미반도체 주식회사 반도체 패키지 제조 장비의 듀얼 테이블 간섭 방지 장치 및방법
KR100814284B1 (ko) * 2007-02-06 2008-03-18 한미반도체 주식회사 쏘잉 앤 플레이스먼트 장비의 비전 시스템
KR100917024B1 (ko) * 2007-09-20 2009-09-10 세크론 주식회사 리버싱 장치를 이용한 반도체 패키지의 소팅 방법
US20090324368A1 (en) * 2008-06-27 2009-12-31 Applied Materials, Inc. Processing system and method of operating a processing system
KR101037186B1 (ko) * 2009-05-11 2011-05-26 주식회사 에프엔텍 어레이형 칩 패키지 자동검사장치 및 그 검사방법
US9444004B1 (en) * 2014-05-02 2016-09-13 Deployable Space Systems, Inc. System and method for producing modular photovoltaic panel assemblies for space solar arrays
DE102015009004A1 (de) 2015-06-05 2016-12-08 Solaero Technologies Corp. Automatisierte Anordnung und Befestigung von Solarzellen auf Paneelen für Weltraumanwendungen
US10276742B2 (en) 2015-07-09 2019-04-30 Solaero Technologies Corp. Assembly and mounting of solar cells on space vehicles or satellites
JP7488442B2 (ja) * 2019-09-26 2024-05-22 シンフォニアテクノロジー株式会社 搬送システム
CN113578781B (zh) * 2021-07-26 2023-07-25 北京比特大陆科技有限公司 一种芯片分选方法、装置、设备及存储介质
CN115351130B (zh) * 2022-10-20 2023-03-10 宁波德洲精密电子有限公司 一种引线框架自动整平设备

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JP3132353B2 (ja) * 1995-08-24 2001-02-05 松下電器産業株式会社 チップの搭載装置および搭載方法
JPH0964067A (ja) * 1995-08-29 1997-03-07 Rohm Co Ltd ワークに対する半導体チップの供給装置
CN1214116A (zh) * 1996-03-15 1999-04-14 株式会社日立制作所 表面晶体缺陷的测量方法及装置
US6112905A (en) * 1996-07-31 2000-09-05 Aseco Corporation Automatic semiconductor part handler
KR100248704B1 (ko) * 1997-11-08 2000-03-15 정문술 반도체 소자검사기의 소자 간격조절장치
TW369692B (en) * 1997-12-26 1999-09-11 Samsung Electronics Co Ltd Test and burn-in apparatus, in-line system using the apparatus, and test method using the system
KR19990066153A (ko) * 1998-01-22 1999-08-16 윤종용 반도체 패키지 트림/폼 설비
JPH11274202A (ja) * 1998-03-24 1999-10-08 Fuji Xerox Co Ltd バンプ形成装置およびバンプ形成に使用されるチップトレイ
CN1241021A (zh) * 1998-07-04 2000-01-12 三星电子株式会社 破裂检测系统和方法
KR100269948B1 (ko) * 1998-08-07 2000-10-16 윤종용 반도체 번-인 공정의 반도체 디바이스 추출/삽입 및자동분류장치
JP2000338178A (ja) * 1999-05-26 2000-12-08 Ando Electric Co Ltd オートハンドラ、その駆動制御方法、及び記憶媒体
KR100342179B1 (ko) * 2000-07-18 2002-07-02 윤성석 반도체 칩 패키지 컷팅용 핸들러
GB2370411B (en) * 2000-12-20 2003-08-13 Hanmi Co Ltd Handler system for cutting a semiconductor package device

Also Published As

Publication number Publication date
US20060272987A1 (en) 2006-12-07
CN100401496C (zh) 2008-07-09
KR20050063359A (ko) 2005-06-28
CN1898789A (zh) 2007-01-17
WO2005062375A1 (en) 2005-07-07

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)