HK1079A - Provision of wire connections for semiconductor devices - Google Patents

Provision of wire connections for semiconductor devices

Info

Publication number
HK1079A
HK1079A HK10/79A HK1079A HK1079A HK 1079 A HK1079 A HK 1079A HK 10/79 A HK10/79 A HK 10/79A HK 1079 A HK1079 A HK 1079A HK 1079 A HK1079 A HK 1079A
Authority
HK
Hong Kong
Prior art keywords
welding
wire
ball
tool
discharge
Prior art date
Application number
HK10/79A
Other languages
English (en)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of HK1079A publication Critical patent/HK1079A/xx

Links

Classifications

    • H10W72/075
    • H10W72/01551
    • H10W72/07141
    • H10W72/07511
    • H10W72/07533
    • H10W72/5363
    • H10W72/5438
    • H10W72/5522

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
HK10/79A 1974-05-21 1979-01-04 Provision of wire connections for semiconductor devices HK1079A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7406783A NL7406783A (nl) 1974-05-21 1974-05-21 Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.

Publications (1)

Publication Number Publication Date
HK1079A true HK1079A (en) 1979-01-12

Family

ID=19821385

Family Applications (1)

Application Number Title Priority Date Filing Date
HK10/79A HK1079A (en) 1974-05-21 1979-01-04 Provision of wire connections for semiconductor devices

Country Status (7)

Country Link
JP (1) JPS5118477A (OSRAM)
DE (1) DE2522022C3 (OSRAM)
FR (1) FR2272491B1 (OSRAM)
GB (1) GB1502965A (OSRAM)
HK (1) HK1079A (OSRAM)
IT (1) IT1038208B (OSRAM)
NL (1) NL7406783A (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1600021A (en) * 1977-07-26 1981-10-14 Welding Inst Electrical inter-connection method and apparatus
NL8005922A (nl) * 1980-10-29 1982-05-17 Philips Nv Werkwijze voor het vormen van een draadverbinding.
AU569998B2 (en) * 1981-03-27 1988-03-03 Dow Chemical Company, The Process for preparation of diene styrene alpha- methylstyrene block polymers
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
CH673908A5 (OSRAM) * 1987-05-26 1990-04-12 Vyacheslav Gennadievich Sizov
JPH0614322U (ja) * 1992-07-28 1994-02-22 東洋化学株式会社 合成樹脂製軒樋継手

Also Published As

Publication number Publication date
JPS5118477A (en) 1976-02-14
FR2272491A1 (OSRAM) 1975-12-19
DE2522022A1 (de) 1975-12-11
NL7406783A (nl) 1975-11-25
JPS5310427B2 (OSRAM) 1978-04-13
DE2522022B2 (de) 1979-05-17
FR2272491B1 (OSRAM) 1978-10-27
IT1038208B (it) 1979-11-20
GB1502965A (en) 1978-03-08
DE2522022C3 (de) 1980-01-10

Similar Documents

Publication Publication Date Title
GB1488476A (en) Terminal-cover assembly for an electrical component package
US3171014A (en) Method of effecting magnetic deformation of a workpiece
GB1094699A (en) Method of attaching leads to thin films
GB1502965A (en) Provision of wire connections for semiconductor devices
CA1178664A (en) Method of welding of connection wires to microcircuit contacts
GB1476606A (en) Wire bonding method and apparatus
ES8606048A1 (es) Perfeccionamientos en una herramienta para la soldadura por ultrasonidos
US3089947A (en) Arrangement and method for electrical impulse welding
GB1325016A (en) Handling beam-leading devices
KR970007819B1 (en) Contact forming method of semiconductor device
GB1468974A (en) Manufacture of semiconductor devices
US1810225A (en) Method of and apparatus for welding
FR2094394A5 (OSRAM)
GB1177517A (en) Method of Securing a Connecting Wire to a Microcircuit.
US3277559A (en) Method of cold pressure welding
JPH0347749Y2 (OSRAM)
US3974954A (en) Apparatus for making tined electrical contacts
GB964582A (en) Improvements in or relating to wound electric capacitors
JPS5745957A (en) Circuit substrate and manufacture thereof
JPS56138932A (en) Manufacture of semiconductor device
JPH0641783Y2 (ja) 放電加工機の通電子
JPS5943537A (ja) ワイヤボンデイング装置
JPS5687348A (en) Semiconductor device
JPH01149221U (OSRAM)
JPH04117442U (ja) ワイヤボンダ