HK1074813A1 - Fluid mixing apparatus and cutting apparatus - Google Patents

Fluid mixing apparatus and cutting apparatus

Info

Publication number
HK1074813A1
HK1074813A1 HK05106970A HK05106970A HK1074813A1 HK 1074813 A1 HK1074813 A1 HK 1074813A1 HK 05106970 A HK05106970 A HK 05106970A HK 05106970 A HK05106970 A HK 05106970A HK 1074813 A1 HK1074813 A1 HK 1074813A1
Authority
HK
Hong Kong
Prior art keywords
fluid mixing
cutting
cutting apparatus
mixing apparatus
fluid
Prior art date
Application number
HK05106970A
Other languages
English (en)
Inventor
Yoshida Miki
Original Assignee
Disco Disco Corp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Disco Corp Kk filed Critical Disco Disco Corp Kk
Publication of HK1074813A1 publication Critical patent/HK1074813A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/20—Mixing gases with liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/20—Mixing gases with liquids
    • B01F23/29—Mixing systems, i.e. flow charts or diagrams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/80—Forming a predetermined ratio of the substances to be mixed
    • B01F35/83—Forming a predetermined ratio of the substances to be mixed by controlling the ratio of two or more flows, e.g. using flow sensing or flow controlling devices
    • B01F35/833—Flow control by valves, e.g. opening intermittently
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F2101/00—Mixing characterised by the nature of the mixed materials or by the application field
    • B01F2101/56—Mixing photosensitive chemicals or photographic base materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S261/00—Gas and liquid contact apparatus
    • Y10S261/07—Carbonators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9372—Rotatable type
    • Y10T83/9403—Disc type

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
HK05106970A 2002-03-29 2005-08-12 Fluid mixing apparatus and cutting apparatus HK1074813A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002095194A JP4210462B2 (ja) 2002-03-29 2002-03-29 切削装置
PCT/JP2003/001237 WO2003082523A1 (fr) 2002-03-29 2003-02-06 Dispositif de melange de fluide et dispositif de coupe

Publications (1)

Publication Number Publication Date
HK1074813A1 true HK1074813A1 (en) 2005-11-25

Family

ID=28671804

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05106970A HK1074813A1 (en) 2002-03-29 2005-08-12 Fluid mixing apparatus and cutting apparatus

Country Status (9)

Country Link
US (1) US6945521B2 (ja)
JP (1) JP4210462B2 (ja)
KR (1) KR100876926B1 (ja)
CN (1) CN100364721C (ja)
AU (1) AU2003207277A1 (ja)
DE (1) DE10392232B4 (ja)
HK (1) HK1074813A1 (ja)
TW (1) TWI265071B (ja)
WO (1) WO2003082523A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4986511B2 (ja) * 2006-06-16 2012-07-25 株式会社ディスコ 切削装置
JP4908097B2 (ja) * 2006-07-28 2012-04-04 株式会社ディスコ 切削装置
JP2009027030A (ja) * 2007-07-20 2009-02-05 Disco Abrasive Syst Ltd ウエーハの切削方法
KR20090024408A (ko) * 2007-09-04 2009-03-09 삼성전자주식회사 스크라이브 래인 내의 금속 버를 제거하는 노즐을 갖는웨이퍼 소잉 장치, 웨이퍼 소잉 방법 및 이를 이용하여제작된 반도체 패키지
JP5415184B2 (ja) * 2009-08-21 2014-02-12 株式会社ディスコ 切削装置
CN102756167B (zh) * 2011-04-27 2014-01-22 承澔科技股份有限公司 切割机刀具护盖的掀盖装置
US9383147B2 (en) * 2011-09-16 2016-07-05 Makino Milling Machine Co., Ltd. Coolant supply apparatus
JP5995133B2 (ja) * 2012-03-09 2016-09-21 株式会社東京精密 ダイシング装置
JP6410626B2 (ja) * 2015-02-06 2018-10-24 株式会社ディスコ 切削装置
JP6441704B2 (ja) * 2015-02-10 2018-12-19 株式会社ディスコ 切削装置
CN106111003A (zh) * 2016-08-29 2016-11-16 慈溪市汇丽机电有限公司 一种自动化配液装置
JP2018073875A (ja) * 2016-10-25 2018-05-10 株式会社ディスコ ウェーハの加工方法
JP6887722B2 (ja) * 2016-10-25 2021-06-16 株式会社ディスコ ウェーハの加工方法及び切削装置
JP6837859B2 (ja) * 2017-02-14 2021-03-03 株式会社ディスコ ウエーハの加工方法
JP7193972B2 (ja) * 2018-10-10 2022-12-21 株式会社ディスコ 混合装置
CN111921395B (zh) * 2020-07-30 2022-01-07 武汉大学 一种溶气式水射流装置及溶气式水射流发生方法

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US3256802A (en) * 1962-03-14 1966-06-21 Shasta Beverage Division Of Co Continuous carbonation system
GB1051907A (ja) * 1963-05-07
US3583601A (en) * 1968-12-12 1971-06-08 Cornelius Co Method and apparatus for producing and dispensing a foamy carbonated beverage
US3612495A (en) * 1969-07-03 1971-10-12 Ato Inc Carbonator and method of operation thereof
FR2078342A5 (ja) * 1970-02-26 1971-11-05 Tremolada Franco
US4133853A (en) * 1977-08-26 1979-01-09 Mojonnier Bros. Co. Aerosol carbonator
SU885812A1 (ru) * 1978-01-17 1981-11-30 Таллинское Производственное Управление Водоснабжения И Канализации Устройство дл автоматического дозировани газа в жидкость,например хлора в воду
US4304736A (en) * 1980-01-29 1981-12-08 The Coca-Cola Company Method of and apparatus for making and dispensing a carbonated beverage utilizing propellant carbon dioxide gas for carbonating
DE3232938C2 (de) * 1982-09-04 1984-06-28 Kohlensäurewerke C. G. Rommenhöller GmbH, 3490 Bad Driburg-Herste Verfahren und Vorrichtung zur Lösung von Gas, insbesondere Kohlendioxid in flüssigem Brennstoff und dessen Verteilung in Verbrennungsluft in übersättigtem Zustand
JPS62121694A (ja) * 1985-11-19 1987-06-02 Mitsubishi Heavy Ind Ltd 炭酸ガスを使用した飲料水化装置の制御方法
US4859376A (en) * 1987-06-26 1989-08-22 Aquatec Gas-driven carbonator and method
EP0370870B1 (en) * 1988-11-21 1995-05-24 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Process for producing low-concentration gas mixtures, and apparatus for producing the same
EP0370151A1 (en) * 1988-11-21 1990-05-30 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Process for producing low-concentration gas mixtures, and apparatus for producing the same
JP2581662Y2 (ja) * 1992-04-22 1998-09-24 呉羽化学工業株式会社 水道水の改善装置
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JP3894526B2 (ja) * 1998-07-06 2007-03-22 株式会社ディスコ 切削装置
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JP2001030170A (ja) * 1999-07-16 2001-02-06 Disco Abrasive Syst Ltd 加工水生成装置及び切削装置
US6743722B2 (en) * 2002-01-29 2004-06-01 Strasbaugh Method of spin etching wafers with an alkali solution

Also Published As

Publication number Publication date
JP2003291065A (ja) 2003-10-14
US6945521B2 (en) 2005-09-20
KR100876926B1 (ko) 2009-01-07
WO2003082523A1 (fr) 2003-10-09
US20050051913A1 (en) 2005-03-10
CN100364721C (zh) 2008-01-30
TWI265071B (en) 2006-11-01
KR20040105739A (ko) 2004-12-16
DE10392232B4 (de) 2013-03-28
DE10392232T5 (de) 2005-06-30
TW200304399A (en) 2003-10-01
AU2003207277A1 (en) 2003-10-13
CN1638920A (zh) 2005-07-13
JP4210462B2 (ja) 2009-01-21

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Effective date: 20230205