HK1068655A1 - Copper electrolytic solution containing quaternaryamine compound with specific skeleton and organo- sulfur compound as additives, and electrolytic copper foil manufactured using the same - Google Patents

Copper electrolytic solution containing quaternaryamine compound with specific skeleton and organo- sulfur compound as additives, and electrolytic copper foil manufactured using the same

Info

Publication number
HK1068655A1
HK1068655A1 HK05101030A HK05101030A HK1068655A1 HK 1068655 A1 HK1068655 A1 HK 1068655A1 HK 05101030 A HK05101030 A HK 05101030A HK 05101030 A HK05101030 A HK 05101030A HK 1068655 A1 HK1068655 A1 HK 1068655A1
Authority
HK
Hong Kong
Prior art keywords
compound
quaternaryamine
organo
additives
electrolytic
Prior art date
Application number
HK05101030A
Other languages
English (en)
Inventor
Masashi Kumagai
Mikio Hanafusa
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of HK1068655A1 publication Critical patent/HK1068655A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
HK05101030A 2002-10-21 2005-02-07 Copper electrolytic solution containing quaternaryamine compound with specific skeleton and organo- sulfur compound as additives, and electrolytic copper foil manufactured using the same HK1068655A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002305650A JP4115240B2 (ja) 2002-10-21 2002-10-21 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
PCT/JP2003/010552 WO2004035874A1 (ja) 2002-10-21 2003-08-20 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔

Publications (1)

Publication Number Publication Date
HK1068655A1 true HK1068655A1 (en) 2005-04-29

Family

ID=32105177

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05101030A HK1068655A1 (en) 2002-10-21 2005-02-07 Copper electrolytic solution containing quaternaryamine compound with specific skeleton and organo- sulfur compound as additives, and electrolytic copper foil manufactured using the same

Country Status (10)

Country Link
US (2) US7144491B2 (de)
EP (1) EP1568802B8 (de)
JP (1) JP4115240B2 (de)
KR (1) KR100589901B1 (de)
CN (1) CN1321225C (de)
ES (1) ES2450042T3 (de)
HK (1) HK1068655A1 (de)
MY (1) MY139358A (de)
TW (1) TWI250224B (de)
WO (1) WO2004035874A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4115240B2 (ja) * 2002-10-21 2008-07-09 日鉱金属株式会社 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
KR100389061B1 (ko) * 2002-11-14 2003-06-25 일진소재산업주식회사 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법
US20050126919A1 (en) * 2003-11-07 2005-06-16 Makoto Kubota Plating method, plating apparatus and a method of forming fine circuit wiring
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
US7824534B2 (en) 2005-01-25 2010-11-02 Nippon Mining & Metals Co., Ltd. Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith
EP1741804B1 (de) * 2005-07-08 2016-04-27 Rohm and Haas Electronic Materials, L.L.C. Procédé de dépôt électrolytique de cuivre
JP2007146289A (ja) * 2005-10-31 2007-06-14 Mitsui Mining & Smelting Co Ltd 電解銅箔の製造方法、該製造方法で得られる電解銅箔、該電解銅箔を用いて得られる表面処理銅箔及び該電解銅箔又は該表面処理銅箔を用いて得られる銅張積層板
JP4954686B2 (ja) * 2006-11-29 2012-06-20 福田金属箔粉工業株式会社 電解銅箔とその製造方法
US20080142249A1 (en) * 2006-12-13 2008-06-19 International Business Machines Corporation Selective surface roughness for high speed signaling
US20100084275A1 (en) * 2007-03-15 2010-04-08 Mikio Hanafusa Copper electrolytic solution and two-layer flexible substrate obtained using the same
JP2008266722A (ja) * 2007-04-20 2008-11-06 Ebara Udylite Kk パルス銅めっき浴用添加剤およびこれを用いたパルス銅めっき浴
WO2009116432A1 (ja) * 2008-03-17 2009-09-24 日鉱金属株式会社 電解銅箔製造用の電解液
WO2011135673A1 (ja) * 2010-04-27 2011-11-03 荏原ユージライト株式会社 新規化合物およびその用途
WO2011135716A1 (ja) * 2010-04-30 2011-11-03 荏原ユージライト株式会社 新規化合物およびその利用
JP5595320B2 (ja) * 2011-03-31 2014-09-24 Ｊｘ日鉱日石金属株式会社 銅電解液
JP6640567B2 (ja) 2015-01-16 2020-02-05 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法
WO2020044416A1 (ja) * 2018-08-28 2020-03-05 株式会社Ｊｃｕ 硫酸銅めっき液およびこれを用いた硫酸銅めっき方法
CN112111761B (zh) * 2020-09-07 2021-09-21 浙江大学 一种高延伸率电解铜箔的电解液及其应用
LU500134B1 (en) 2021-05-07 2022-11-08 Circuit Foil Luxembourg Method for producing an electrodeposited copper foil and copper foil obtained therewith

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3636114A (en) * 1968-07-16 1972-01-18 Union Carbide Corp Novel quaternary ammonium compounds and method for preparation thereof
GB1526076A (en) * 1975-03-11 1978-09-27 Oxy Metal Industries Corp Electrodeposition of copper
US4036711A (en) * 1975-12-18 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper
US4384930A (en) * 1981-08-21 1983-05-24 Mcgean-Rohco, Inc. Electroplating baths, additives therefor and methods for the electrodeposition of metals
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions
JPS59501829A (ja) * 1982-09-30 1984-11-01 リ−ロ−ナル　インコ−ポレ−テツド 電気銅メッキ液
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
JPH0853789A (ja) 1994-08-09 1996-02-27 Furukawa Circuit Foil Kk 電解銅箔の製造方法
DE19758121C2 (de) 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
US6541122B2 (en) * 2000-03-28 2003-04-01 Ube Industries, Ltd. Roll of metal film/aromatic polyimide film composite web
KR100845189B1 (ko) * 2000-12-20 2008-07-10 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 전해적 구리 도금액 및 이의 제어법
JP3679362B2 (ja) * 2000-12-27 2005-08-03 矢崎総業株式会社 リレー、リレーユニット及び電気接続箱
US6800188B2 (en) * 2001-05-09 2004-10-05 Ebara-Udylite Co., Ltd. Copper plating bath and plating method for substrate using the copper plating bath
EP1264918B1 (de) 2001-06-07 2011-11-23 Shipley Co. L.L.C. Verfahren zur elektrolytischen Kupferplatierung
WO2003006553A1 (fr) * 2001-07-09 2003-01-23 Kaneka Corporation Composition de resine
JP4022440B2 (ja) * 2002-07-01 2007-12-19 株式会社オートネットワーク技術研究所 回路ユニット
JP4115240B2 (ja) * 2002-10-21 2008-07-09 日鉱金属株式会社 特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔

Also Published As

Publication number Publication date
ES2450042T3 (es) 2014-03-21
TWI250224B (en) 2006-03-01
EP1568802A1 (de) 2005-08-31
TW200408726A (en) 2004-06-01
US20050173256A1 (en) 2005-08-11
KR100589901B1 (ko) 2006-06-14
US7144491B2 (en) 2006-12-05
JP4115240B2 (ja) 2008-07-09
KR20040058010A (ko) 2004-07-02
CN1321225C (zh) 2007-06-13
JP2004137588A (ja) 2004-05-13
EP1568802A4 (de) 2007-11-07
WO2004035874A1 (ja) 2004-04-29
EP1568802B8 (de) 2014-03-26
US20070042201A1 (en) 2007-02-22
EP1568802B1 (de) 2014-01-08
CN1564880A (zh) 2005-01-12
MY139358A (en) 2009-09-30
US7771835B2 (en) 2010-08-10

Similar Documents

Publication Publication Date Title
HK1068655A1 (en) Copper electrolytic solution containing quaternaryamine compound with specific skeleton and organo- sulfur compound as additives, and electrolytic copper foil manufactured using the same
EP1524335A4 (de) Kupferelektrolytlösung, die eine aminverbindung mit speziellem gerüst und eine organische schwefelverbindung enthält, und damit hergestelltes elektrolytkupferblech
AU2003259049A8 (en) Electrolytic copper plating solutions
HK1084159A1 (en) Copper electrolytic solution and electrolytic copper foil produced therewith
GB2405747B (en) Laminated solid electrolytic capacitor.
AU2003290809A8 (en) Flip-flop circuit
AU2003265826A8 (en) Electrolyte
HK1068654A1 (en) Copper electrolytic solution containing quaternaryamine compound polymer of specified skeleton and organic sulfur compound as additives and electrolytic copper foil produced therewith
EP1560227A4 (de) Leitfähige paste
GB2392460B (en) Delayed-gelation solution
LU91060B1 (de) Galvanisch niedergeschlagene Kupferfolie mit Traegerfolie
EP1670008A4 (de) Organischer elektrolytkondensator
IL163928A0 (en) Pyridinoylpiperidines as 5-htf agonists
EP1842939A4 (de) Kupferelektrolyselösung mit einer verbindung mit speziellem gerüst als additiv und daraus hergestelltes elektrolytkupferblech
EP1642670A4 (de) Lötpaste
GB2408641B (en) Pulse-based flip-flop
EP1683168A4 (de) Festelektrolyt-kondensator
EP1580773A4 (de) Elektrolytkondensator
EP1682423A4 (de) Chemilumineszierender behälter
HK1087255A1 (en) Flip-flop circuit assembly
AU2003280836A8 (en) Solid electrolytic capacitor
TWI318650B (en) Electrolytic silver-plating solution
AU2003901058A0 (en) Electroplating pcb components
TWI319586B (en) Electrolytic condenser
AU2003254474A1 (en) An electrolyte solution

Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20230819