HK1068654A1 - Copper electrolytic solution containing quaternaryamine compound polymer of specified skeleton and organic sulfur compound as additives and electrolytic copper foil produced therewith - Google Patents

Copper electrolytic solution containing quaternaryamine compound polymer of specified skeleton and organic sulfur compound as additives and electrolytic copper foil produced therewith

Info

Publication number
HK1068654A1
HK1068654A1 HK05101029A HK05101029A HK1068654A1 HK 1068654 A1 HK1068654 A1 HK 1068654A1 HK 05101029 A HK05101029 A HK 05101029A HK 05101029 A HK05101029 A HK 05101029A HK 1068654 A1 HK1068654 A1 HK 1068654A1
Authority
HK
Hong Kong
Prior art keywords
quaternaryamine
additives
compound
solution containing
electrolytic
Prior art date
Application number
HK05101029A
Other languages
English (en)
Inventor
Masashi Kumagai
Mikio Hanafusa
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of HK1068654A1 publication Critical patent/HK1068654A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Laminated Bodies (AREA)
HK05101029A 2002-12-25 2005-02-07 Copper electrolytic solution containing quaternaryamine compound polymer of specified skeleton and organic sulfur compound as additives and electrolytic copper foil produced therewith HK1068654A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002373719 2002-12-25
PCT/JP2003/011858 WO2004059040A1 (ja) 2002-12-25 2003-09-17 特定骨格を有する四級アミン化合物重合体及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔

Publications (1)

Publication Number Publication Date
HK1068654A1 true HK1068654A1 (en) 2005-04-29

Family

ID=32677265

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05101029A HK1068654A1 (en) 2002-12-25 2005-02-07 Copper electrolytic solution containing quaternaryamine compound polymer of specified skeleton and organic sulfur compound as additives and electrolytic copper foil produced therewith

Country Status (8)

Country Link
US (2) US20060011488A1 (xx)
EP (1) EP1607495A4 (xx)
JP (1) JP4083171B2 (xx)
KR (1) KR100598994B1 (xx)
CN (1) CN1312323C (xx)
HK (1) HK1068654A1 (xx)
TW (1) TWI285683B (xx)
WO (1) WO2004059040A1 (xx)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100389061B1 (ko) * 2002-11-14 2003-06-25 일진소재산업주식회사 전해 동박 제조용 전해액 및 이를 이용한 전해 동박 제조방법
JP4255130B2 (ja) * 2003-07-29 2009-04-15 日鉱金属株式会社 特定骨格を有するジアルキルアミノ基含有重合体及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
US7282602B2 (en) * 2004-09-21 2007-10-16 Bionumerik Pharmaceuticals, Inc. Medicinal disulfide salts
JP4750486B2 (ja) * 2005-07-06 2011-08-17 株式会社Ａｄｅｋａ 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法
JP2007131946A (ja) * 2005-10-14 2007-05-31 Mitsui Mining & Smelting Co Ltd フレキシブル銅張積層板、そのフレキシブル銅張積層板を用いて得られるフレキシブルプリント配線板、そのフレキシブル銅張積層板を用いて得られるフィルムキャリアテープ、そのフレキシブル銅張積層板を用いて得られる半導体装置、フレキシブル銅張積層板の製造方法及びフィルムキャリアテープの製造方法
JP4992308B2 (ja) * 2006-06-14 2012-08-08 日本電気株式会社 通信システム、動作制御方法、位置管理サーバ及びプログラム
WO2009116432A1 (ja) * 2008-03-17 2009-09-24 日鉱金属株式会社 電解銅箔製造用の電解液
TWI434965B (zh) * 2008-05-28 2014-04-21 Mitsui Mining & Smelting Co A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method
US20110139626A1 (en) * 2008-06-12 2011-06-16 Furukawa Electric Co., Ltd. Electrolytic copper coating, method of manufacturing the same, and copper electrolyte for manufacturing electrolytic copper coating
JP4827952B2 (ja) * 2008-07-07 2011-11-30 古河電気工業株式会社 電解銅箔および銅張積層板
EP2671760B1 (de) 2009-11-09 2018-03-07 Coroplast Fritz Müller GmbH & Co. KG Quereinreißbares Gewebeklebeband mit hoher Abriebfestigkeit
EP2641999A1 (en) 2010-11-15 2013-09-25 JX Nippon Mining & Metals Corporation Electrolytic copper foil
EP2735627A1 (en) * 2012-11-26 2014-05-28 ATOTECH Deutschland GmbH Copper plating bath composition
KR102377286B1 (ko) 2017-03-23 2022-03-21 에스케이넥실리스 주식회사 리튬 이온 2차전지, 이 2차전지의 음극 전극을 구성하는 집전체 및 이 음극 집전체를 구성하는 전해동박
KR102378297B1 (ko) 2017-03-29 2022-03-23 에스케이넥실리스 주식회사 리튬 이온 2차전지, 이 2차전지의 음극 전극을 구성하는 집전체 및 이 음극 집전체를 구성하는 전해동박
TWI660541B (zh) * 2018-10-01 2019-05-21 長春石油化學股份有限公司 用於鋰二次電池集電體之銅箔及包含其之負極

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57114685A (en) * 1981-01-07 1982-07-16 Kuraray Co Ltd Brightener for plating bath
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
US4667049A (en) * 1984-11-02 1987-05-19 Etd Technology Inc. Method of making dialkylamino-thioxomethyl-thioalkanesulfonic acid compounds
US5232575A (en) * 1990-07-26 1993-08-03 Mcgean-Rohco, Inc. Polymeric leveling additive for acid electroplating baths
JPH0853789A (ja) * 1994-08-09 1996-02-27 Furukawa Circuit Foil Kk 電解銅箔の製造方法
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
JP4394234B2 (ja) * 2000-01-20 2010-01-06 日鉱金属株式会社 銅電気めっき液及び銅電気めっき方法
US6800188B2 (en) * 2001-05-09 2004-10-05 Ebara-Udylite Co., Ltd. Copper plating bath and plating method for substrate using the copper plating bath

Also Published As

Publication number Publication date
US20060011488A1 (en) 2006-01-19
JPWO2004059040A1 (ja) 2006-04-27
US20080075972A1 (en) 2008-03-27
TWI285683B (en) 2007-08-21
CN1564881A (zh) 2005-01-12
KR20040076847A (ko) 2004-09-03
JP4083171B2 (ja) 2008-04-30
TW200411082A (en) 2004-07-01
EP1607495A4 (en) 2006-07-12
CN1312323C (zh) 2007-04-25
WO2004059040A1 (ja) 2004-07-15
US7678257B2 (en) 2010-03-16
EP1607495A1 (en) 2005-12-21
KR100598994B1 (ko) 2006-07-07

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Legal Events

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PE Patent expired

Effective date: 20230916