HK1062022A1 - One-pack moisture curable epoxy resin composition. - Google Patents

One-pack moisture curable epoxy resin composition.

Info

Publication number
HK1062022A1
HK1062022A1 HK04105081A HK04105081A HK1062022A1 HK 1062022 A1 HK1062022 A1 HK 1062022A1 HK 04105081 A HK04105081 A HK 04105081A HK 04105081 A HK04105081 A HK 04105081A HK 1062022 A1 HK1062022 A1 HK 1062022A1
Authority
HK
Hong Kong
Prior art keywords
resin composition
epoxy resin
curable epoxy
moisture curable
pack moisture
Prior art date
Application number
HK04105081A
Other languages
English (en)
Inventor
Takeshi Endo
Fumio Sanda
Kentaro Suzuki
Hisakazu Horii
Nobuki Matsuura
Original Assignee
Konishi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000383380A external-priority patent/JP3404378B2/ja
Priority claimed from JP2001058696A external-priority patent/JP3404385B2/ja
Priority claimed from JP2001058695A external-priority patent/JP3541942B2/ja
Application filed by Konishi Co Ltd filed Critical Konishi Co Ltd
Publication of HK1062022A1 publication Critical patent/HK1062022A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/28—Phosphorus compounds with one or more P—C bonds
    • C07F9/38—Phosphonic acids [RP(=O)(OH)2]; Thiophosphonic acids ; [RP(=X1)(X2H)2(X1, X2 are each independently O, S or Se)]
    • C07F9/3804—Phosphonic acids [RP(=O)(OH)2]; Thiophosphonic acids ; [RP(=X1)(X2H)2(X1, X2 are each independently O, S or Se)] not used, see subgroups
    • C07F9/3808—Acyclic saturated acids which can have further substituents on alkyl
    • C07F9/3813—N-Phosphonomethylglycine; Salts or complexes thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Epoxy Resins (AREA)
HK04105081A 2000-12-18 2004-07-13 One-pack moisture curable epoxy resin composition. HK1062022A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000383379 2000-12-18
JP2000383380A JP3404378B2 (ja) 2000-12-18 2000-12-18 一液湿気硬化型エポキシ樹脂組成物
JP2001058696A JP3404385B2 (ja) 2001-03-02 2001-03-02 一液湿気硬化型エポキシ樹脂組成物
JP2001058695A JP3541942B2 (ja) 2001-03-02 2001-03-02 一液湿気硬化型エポキシ樹脂組成物
PCT/JP2001/011070 WO2002050154A1 (fr) 2000-12-18 2001-12-17 Composition de resine epoxy en une seule solution pouvant etre reticulee par l'humidite

Publications (1)

Publication Number Publication Date
HK1062022A1 true HK1062022A1 (en) 2004-10-15

Family

ID=27481874

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04105081A HK1062022A1 (en) 2000-12-18 2004-07-13 One-pack moisture curable epoxy resin composition.

Country Status (8)

Country Link
US (1) US20040019140A1 (zh)
EP (1) EP1362876B1 (zh)
KR (1) KR100573378B1 (zh)
CN (1) CN1213090C (zh)
DE (1) DE60117692T2 (zh)
HK (1) HK1062022A1 (zh)
TW (1) TWI289146B (zh)
WO (1) WO2002050154A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE514517T1 (de) * 2003-03-30 2011-07-15 L 3 Comm Corp Verfahren zum diffusionsverbinden einer mikrokanalplatte mit einem mehrschichtkeramikkörper; diffusionsverbundene mikrokanalplattenkörperanordnung
DE102016207075A1 (de) * 2016-04-26 2017-10-26 Tesa Se Repositionierbares feuchtigkeitshärtendes Klebeband
CN113698844B (zh) * 2021-09-03 2023-03-03 厦门市金泰祥新科技有限公司 环氧改性有机硅化合物、可室温湿气固化的组合物及其制备方法和应用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3291775A (en) * 1958-12-31 1966-12-13 Shell Oil Co Process for curing polyepoxides with a polyimine
ATE63110T1 (de) * 1986-04-03 1991-05-15 Akzo Nv Farblose ketimine, ihre herstellung und ihre verwendung als vernetzungsmittel.
JP3097960B2 (ja) * 1989-08-22 2000-10-10 コニシ株式会社 エポキシ樹脂組成物
JPH07188634A (ja) * 1993-12-27 1995-07-25 Konishi Kk 一液硬化型エポキシ樹脂系粘接着型接着剤、及びこれを用いた粘接着型テープ
CN1075525C (zh) * 1995-08-23 2001-11-28 关西油漆株式会社 单包装环氧树脂组合物单包装防腐蚀漆组合物及使用方法
JPH09235352A (ja) * 1995-12-27 1997-09-09 Mitsui Toatsu Chem Inc 樹脂用硬化剤
KR100310925B1 (ko) * 1997-01-21 2001-12-17 하기와라 세이지 일액형상온습기경화성수지조성물
JP3973266B2 (ja) * 1997-07-01 2007-09-12 横浜ゴム株式会社 湿気硬化型１液エポキシ樹脂接着剤組成物
AT407748B (de) * 1998-05-12 2001-05-25 Solutia Austria Gmbh Verkappte amine als härter für wasserverdünnbare einkomponenten (1k)-epoxidharzsysteme
JP2000044773A (ja) * 1998-07-28 2000-02-15 Konishi Co Ltd １液湿気硬化型組成物
JP4547060B2 (ja) * 1999-05-27 2010-09-22 関西ペイント株式会社 一液型エポキシ樹脂塗料組成物
US6573357B1 (en) * 1999-06-30 2003-06-03 Resolution Performance Products Llc Process for the preparation of ketimine curing agents

Also Published As

Publication number Publication date
TWI289146B (en) 2007-11-01
DE60117692T2 (de) 2006-11-16
US20040019140A1 (en) 2004-01-29
EP1362876A1 (en) 2003-11-19
CN1213090C (zh) 2005-08-03
EP1362876B1 (en) 2006-03-08
CN1468270A (zh) 2004-01-14
EP1362876A4 (en) 2005-03-16
KR100573378B1 (ko) 2006-04-25
KR20030061425A (ko) 2003-07-18
DE60117692D1 (de) 2006-05-04
WO2002050154A1 (fr) 2002-06-27

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20131217