HK1054766A1 - Copper bath and method of depositing a matt copper coating - Google Patents

Copper bath and method of depositing a matt copper coating

Info

Publication number
HK1054766A1
HK1054766A1 HK03106996A HK03106996A HK1054766A1 HK 1054766 A1 HK1054766 A1 HK 1054766A1 HK 03106996 A HK03106996 A HK 03106996A HK 03106996 A HK03106996 A HK 03106996A HK 1054766 A1 HK1054766 A1 HK 1054766A1
Authority
HK
Hong Kong
Prior art keywords
copper
matt
bath
layers
poly
Prior art date
Application number
HK03106996A
Other languages
English (en)
Inventor
Gonzalo Urrutia Desmaison
Stefan Kretschmer
Gerd Senge
Thorsten Ross
Torsten Kussner
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10058896A external-priority patent/DE10058896C1/de
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1054766A1 publication Critical patent/HK1054766A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
HK03106996A 2000-10-19 2003-09-27 Copper bath and method of depositing a matt copper coating HK1054766A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10052987 2000-10-19
DE10058896A DE10058896C1 (de) 2000-10-19 2000-11-22 Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht
PCT/EP2001/011734 WO2002033153A2 (en) 2000-10-19 2001-10-10 Copper bath and method of depositing a matt copper coating

Publications (1)

Publication Number Publication Date
HK1054766A1 true HK1054766A1 (en) 2003-12-12

Family

ID=26007494

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03106996A HK1054766A1 (en) 2000-10-19 2003-09-27 Copper bath and method of depositing a matt copper coating

Country Status (13)

Country Link
US (1) US7074315B2 (ja)
EP (1) EP1341951B1 (ja)
JP (1) JP3899313B2 (ja)
KR (1) KR100801908B1 (ja)
CN (1) CN1314839C (ja)
AT (1) ATE267278T1 (ja)
AU (1) AU2002215939A1 (ja)
BR (1) BR0114600B1 (ja)
CA (1) CA2419595A1 (ja)
HK (1) HK1054766A1 (ja)
MX (1) MX230531B (ja)
TW (1) TW526293B (ja)
WO (1) WO2002033153A2 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7079246B2 (en) * 2003-04-15 2006-07-18 Lucent Technologies Inc. Method and apparatus for measuring polarization
CN100362141C (zh) * 2005-09-01 2008-01-16 山东建筑工程学院材料科学研究所 丙三醇无氰光亮镀铜液
JP4811880B2 (ja) * 2006-01-06 2011-11-09 エントン インコーポレイテッド 艶消し金属層を堆積するための電解液および工程
JP4954686B2 (ja) * 2006-11-29 2012-06-20 福田金属箔粉工業株式会社 電解銅箔とその製造方法
CN102597329B (zh) * 2009-07-30 2015-12-16 巴斯夫欧洲公司 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物
PL2620529T3 (pl) * 2012-01-25 2014-09-30 Atotech Deutschland Gmbh Sposób wytwarzania matowych warstw miedzianych
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content
US11384446B2 (en) * 2020-08-28 2022-07-12 Macdermid Enthone Inc. Compositions and methods for the electrodeposition of nanotwinned copper

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4928571B1 (ja) * 1969-11-05 1974-07-27
US3682788A (en) 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating
JPS4928571A (ja) 1972-07-11 1974-03-14
US3945894A (en) 1975-04-11 1976-03-23 Oxy Metal Industries Corporation Bath composition and method of electrodepositing utilizing the same
US4134803A (en) 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US4336114A (en) 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper
US4376685A (en) 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4385967A (en) 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
SU1158621A1 (ru) * 1981-12-30 1985-05-30 Dn Khim T I Im F E Dzerzhinsko "элektpoлиt циhkobahия"
DE3483078D1 (de) * 1983-09-28 1990-10-04 Blasberg Oberflaechentech Saures galvanisches kupferbad und verfahren zu seiner herstellung.
US4555315A (en) 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor
DE3645319C3 (de) 1986-07-19 2000-07-27 Atotech Deutschland Gmbh Anordnung und Verfahren zum elektrolytischen Behandeln von plattenförmigen Gegenständen
US4755271A (en) 1986-07-28 1988-07-05 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
US4781801A (en) 1987-02-03 1988-11-01 Mcgean-Rohco, Inc. Method of copper plating gravure rolls
DE3836521C2 (de) 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
DE4126502C1 (ja) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
JP3718790B2 (ja) * 1998-12-24 2005-11-24 石原薬品株式会社 銀及び銀合金メッキ浴

Also Published As

Publication number Publication date
MXPA03002739A (es) 2003-07-28
MX230531B (es) 2005-09-12
KR20030045101A (ko) 2003-06-09
CA2419595A1 (en) 2002-04-25
TW526293B (en) 2003-04-01
WO2002033153A2 (en) 2002-04-25
BR0114600A (pt) 2004-01-20
EP1341951B1 (en) 2004-05-19
EP1341951A2 (en) 2003-09-10
US20040020783A1 (en) 2004-02-05
JP3899313B2 (ja) 2007-03-28
WO2002033153A3 (en) 2003-06-19
CN1314839C (zh) 2007-05-09
JP2004511663A (ja) 2004-04-15
ATE267278T1 (de) 2004-06-15
CN1636083A (zh) 2005-07-06
US7074315B2 (en) 2006-07-11
AU2002215939A1 (en) 2002-04-29
BR0114600B1 (pt) 2011-04-05
KR100801908B1 (ko) 2008-02-12

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20091010