MY124505A - Copper bath and method of depositing a matt copper coating - Google Patents
Copper bath and method of depositing a matt copper coatingInfo
- Publication number
- MY124505A MY124505A MYPI20014834A MYPI20014834A MY124505A MY 124505 A MY124505 A MY 124505A MY PI20014834 A MYPI20014834 A MY PI20014834A MY PI20014834 A MYPI20014834 A MY PI20014834A MY 124505 A MY124505 A MY 124505A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper
- matt
- bath
- layers
- poly
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Laminated Bodies (AREA)
Abstract
IN THE PRODUCTION OF PRINTED CIRCUIT BOARDS IT IS REQUIRED THAT ORGANIC PROTECTIVE COATINGS ADHERE TIGHTLY ON THE COPPER SURFACES. ACCORDINGLY, MATT LAYERS OF COPPER ARE TO BE PREFERRED OVER LUSTROUS COATINGS. THE BATH IN ACCORDANCE WITH THE INVENTION SERVES TO DEPOSIT MATT LAYERS OF COPPER AND HAS THE ADDITIONAL ADVANTAGEOUS PROPERTY THAT THE LAYERS MAY ALSO DEPOSITED WITH SUFFICIENT COATING THICKNESS IN VARY NARROW BORE HOLES AT AVERAGE CATHODE CURRENT DENSITY. FOR THIS PURPOSE THE BATH CONTAINS AT LEAST ONE POLYGLYCERIN COMPOUND SELECTED FROM THE GROUP COMPRISING POLY (1,2,3-PROPANTRIOL), POLY (2,3-EPOXY-1-PROPANOL ) AND DERIVATIVES THEREOF. FIG. 2
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10052987 | 2000-10-19 | ||
DE10058896A DE10058896C1 (en) | 2000-10-19 | 2000-11-22 | Electrolytic copper bath, its use and method for depositing a matt copper layer |
Publications (1)
Publication Number | Publication Date |
---|---|
MY124505A true MY124505A (en) | 2006-06-30 |
Family
ID=7661064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20014834A MY124505A (en) | 2000-10-19 | 2001-10-17 | Copper bath and method of depositing a matt copper coating |
Country Status (2)
Country | Link |
---|---|
DE (2) | DE10058896C1 (en) |
MY (1) | MY124505A (en) |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4928571B1 (en) * | 1969-11-05 | 1974-07-27 | ||
US3682788A (en) * | 1970-07-28 | 1972-08-08 | M & T Chemicals Inc | Copper electroplating |
US3945894A (en) * | 1975-04-11 | 1976-03-23 | Oxy Metal Industries Corporation | Bath composition and method of electrodepositing utilizing the same |
DE2527701C3 (en) * | 1975-06-21 | 1978-03-30 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Iodophor solution (B) |
US4134803A (en) * | 1977-12-21 | 1979-01-16 | R. O. Hull & Company, Inc. | Nitrogen and sulfur compositions and acid copper plating baths |
US4336114A (en) * | 1981-03-26 | 1982-06-22 | Hooker Chemicals & Plastics Corp. | Electrodeposition of bright copper |
US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
DE3483078D1 (en) * | 1983-09-28 | 1990-10-04 | Blasberg Oberflaechentech | ACID GALVANIC COPPER BATH AND METHOD FOR THE PRODUCTION THEREOF. |
US4555315A (en) * | 1984-05-29 | 1985-11-26 | Omi International Corporation | High speed copper electroplating process and bath therefor |
US4781801A (en) * | 1987-02-03 | 1988-11-01 | Mcgean-Rohco, Inc. | Method of copper plating gravure rolls |
DE3836521C2 (en) * | 1988-10-24 | 1995-04-13 | Atotech Deutschland Gmbh | Aqueous acidic bath for the galvanic deposition of shiny and crack-free copper coatings and use of the bath |
DE4126502C1 (en) * | 1991-08-07 | 1993-02-11 | Schering Ag Berlin Und Bergkamen, 1000 Berlin, De | |
US5328589A (en) * | 1992-12-23 | 1994-07-12 | Enthone-Omi, Inc. | Functional fluid additives for acid copper electroplating baths |
-
2000
- 2000-11-22 DE DE10058896A patent/DE10058896C1/en not_active Expired - Fee Related
-
2001
- 2001-10-10 DE DE60103426T patent/DE60103426T2/en not_active Expired - Lifetime
- 2001-10-17 MY MYPI20014834A patent/MY124505A/en unknown
Also Published As
Publication number | Publication date |
---|---|
DE10058896C1 (en) | 2002-06-13 |
DE60103426T2 (en) | 2005-06-09 |
DE60103426D1 (en) | 2004-06-24 |
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