HK1054576A1 - Electroplating solutions for the preparation of ternary tin zinc cobalt alloy layers - Google Patents
Electroplating solutions for the preparation of ternary tin zinc cobalt alloy layersInfo
- Publication number
- HK1054576A1 HK1054576A1 HK03106913.8A HK03106913A HK1054576A1 HK 1054576 A1 HK1054576 A1 HK 1054576A1 HK 03106913 A HK03106913 A HK 03106913A HK 1054576 A1 HK1054576 A1 HK 1054576A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- preparation
- cobalt alloy
- alloy layers
- tin zinc
- electroplating solutions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C18/00—Alloys based on zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10045991A DE10045991A1 (de) | 2000-09-16 | 2000-09-16 | Ternäre Zinn-Zink-Legierungen, galvanische Bäder und galvanisches Verfahren zur Erzeugung von ternären Zinn-Zink-Legierungsschichten |
PCT/EP2001/009452 WO2002022913A2 (de) | 2000-09-16 | 2001-08-16 | Ternäre zinn-zink legierungen enthaltend eisen, kobalt oder nickel, galvanische bäder und galvanisches verfahren zu ihrer erzeugung |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1054576A1 true HK1054576A1 (en) | 2003-12-05 |
Family
ID=7656548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK03106913.8A HK1054576A1 (en) | 2000-09-16 | 2003-09-25 | Electroplating solutions for the preparation of ternary tin zinc cobalt alloy layers |
Country Status (7)
Country | Link |
---|---|
US (1) | US20040091385A1 (xx) |
EP (1) | EP1319093B1 (xx) |
JP (1) | JP4817352B2 (xx) |
CN (1) | CN1239751C (xx) |
DE (2) | DE10045991A1 (xx) |
HK (1) | HK1054576A1 (xx) |
WO (1) | WO2002022913A2 (xx) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3878978B2 (ja) * | 2002-10-24 | 2007-02-07 | コーア株式会社 | 鉛非含有はんだ、および鉛非含有の継手 |
JP2005026188A (ja) | 2003-07-03 | 2005-01-27 | Koa Corp | 電流ヒューズ及び電流ヒューズの製造方法 |
JP4901120B2 (ja) * | 2005-03-29 | 2012-03-21 | 兵庫県 | 亜鉛を含むめっき皮膜 |
CN100554528C (zh) * | 2006-03-29 | 2009-10-28 | 哈尔滨工业大学 | 具有良好耐化学性及粘结力的电解铜箔镀层表面处理方法 |
EP2085502A1 (en) * | 2008-01-29 | 2009-08-05 | Enthone, Incorporated | Electrolyte composition and method for the deposition of a tin-zinc alloy |
KR20110028010A (ko) * | 2009-09-11 | 2011-03-17 | 삼성전기주식회사 | 미립 주석 분말 및 그 제조 방법 |
KR101445953B1 (ko) * | 2010-02-01 | 2014-09-29 | 크루서블 인텔렉츄얼 프라퍼티 엘엘씨. | 니켈 기재의 합금을 포함하는 코팅, 상기 코팅을 포함하는 장치, 및 그의 제조 방법 |
CN102212809B (zh) * | 2011-05-12 | 2012-07-18 | 北京化工大学 | 一种镍基合金加热管的防腐蚀方法 |
US20130098691A1 (en) * | 2011-10-25 | 2013-04-25 | Longyear Tm, Inc. | High-strength, high-hardness binders and drilling tools formed using the same |
CN102690975B (zh) * | 2012-06-11 | 2014-12-03 | 东莞市闻誉实业有限公司 | 一种三元锡-锌合金及其电镀方法 |
CN103849912A (zh) * | 2012-11-29 | 2014-06-11 | 沈阳工业大学 | 一种电镀光亮锡锌镍合金工艺 |
EP2936946A4 (en) * | 2012-12-18 | 2016-08-17 | Lanxess Butyl Pte Ltd | ELECTRONIC DEVICES WITH BUTYL RUBBER |
CN103436825A (zh) * | 2013-08-23 | 2013-12-11 | 哈尔滨理工大学 | 纳米氧化锡涂覆陶瓷相增强体/铝基复合材料的制备方法 |
CN106521580A (zh) * | 2016-11-02 | 2017-03-22 | 苏州市汉宜化学有限公司 | 四价锡Sn‑Co‑Zn三元合金代铬电镀液及电镀方法 |
CN112779576B (zh) * | 2020-12-25 | 2022-06-21 | 南通正海磁材有限公司 | 一种钕铁硼磁体复合镀层及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH103474A (fr) * | 1923-04-13 | 1924-02-16 | Enrico Scala Giuseppe | Soudure pour aluminium et procédé de fabrication de celle-ci. |
US3791801A (en) * | 1971-07-23 | 1974-02-12 | Toyo Kohan Co Ltd | Electroplated steel sheet |
US3881919A (en) * | 1974-01-07 | 1975-05-06 | Whyco Chromium Co | Ternary alloys |
JPS51131427A (en) * | 1975-05-05 | 1976-11-15 | Whyco Chromium Co | Ternary alloy |
SU670638A1 (ru) * | 1977-02-14 | 1979-06-30 | Ярославский политехнический институт | Электролит дл нанесени покрытий из сплавов на основе олова |
CA1193222A (en) * | 1981-02-25 | 1985-09-10 | Wim M.J.C. Verberne | Electroplating cobalt alloy with zinc or tin from amine bath |
JPS5848694A (ja) * | 1981-09-16 | 1983-03-22 | Nippon Steel Corp | アルコ−ルを含有もしくはアルコ−ル系燃料容器用Sn−Zn系合金電気メツキ鋼板 |
JPS58153796A (ja) * | 1982-03-05 | 1983-09-12 | Sumitomo Metal Ind Ltd | 電気メツキ鋼板 |
JPS59170289A (ja) * | 1983-03-15 | 1984-09-26 | Sumitomo Metal Ind Ltd | 鉄系電気メツキ法 |
US4488942A (en) * | 1983-08-05 | 1984-12-18 | Omi International Corporation | Zinc and zinc alloy electroplating bath and process |
JPS63186860A (ja) * | 1987-01-27 | 1988-08-02 | Nippon Steel Corp | 耐錆性、溶接性に優れた表面処理鋼板の製造方法 |
JPH01172593A (ja) * | 1987-12-25 | 1989-07-07 | Kawasaki Steel Corp | 塗装後密着性が優れたZn−Ni−Sn合金めっき鋼板の製造方法 |
US5429882A (en) * | 1993-04-05 | 1995-07-04 | The Louis Berkman Company | Building material coating |
DE19644235C1 (de) * | 1996-10-24 | 1998-02-12 | Grillo Werke Ag | Schrot für Munitionszwecke |
-
2000
- 2000-09-16 DE DE10045991A patent/DE10045991A1/de not_active Ceased
-
2001
- 2001-08-16 WO PCT/EP2001/009452 patent/WO2002022913A2/de active Application Filing
- 2001-08-16 EP EP01969597A patent/EP1319093B1/de not_active Expired - Lifetime
- 2001-08-16 JP JP2002527347A patent/JP4817352B2/ja not_active Expired - Fee Related
- 2001-08-16 DE DE50114623T patent/DE50114623D1/de not_active Expired - Lifetime
- 2001-08-16 US US10/380,212 patent/US20040091385A1/en not_active Abandoned
- 2001-08-16 CN CN01816986.4A patent/CN1239751C/zh not_active Expired - Fee Related
-
2003
- 2003-09-25 HK HK03106913.8A patent/HK1054576A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2004509229A (ja) | 2004-03-25 |
WO2002022913A2 (de) | 2002-03-21 |
EP1319093B1 (de) | 2008-12-31 |
JP4817352B2 (ja) | 2011-11-16 |
CN1468327A (zh) | 2004-01-14 |
DE10045991A1 (de) | 2002-04-04 |
US20040091385A1 (en) | 2004-05-13 |
DE50114623D1 (de) | 2009-02-12 |
CN1239751C (zh) | 2006-02-01 |
WO2002022913A3 (de) | 2002-07-25 |
EP1319093A2 (de) | 2003-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1054576A1 (en) | Electroplating solutions for the preparation of ternary tin zinc cobalt alloy layers | |
EP1207216A4 (en) | COATED HARD ALLOY | |
SG93233A1 (en) | Electrolytic copper plating solutions | |
HUP0300498A3 (en) | Silver containing copper alloy | |
AU1352101A (en) | Inert anode containing oxides of nickel, iron and cobalt useful for the electrolytic production of metals | |
AU2003259049A1 (en) | Electrolytic copper plating solutions | |
SG91877A1 (en) | Nickel alloy films for reduced intermetallic formation on solder | |
HK1081604A1 (en) | Copper-tin-oxygen based alloy plating | |
GB0028215D0 (en) | Nickel alloy composition | |
AU2001262313A1 (en) | Electrolyte and method for depositing tin-silver alloy layers | |
GB0205896D0 (en) | Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys | |
AU4858800A (en) | Copper alloy | |
AU6237499A (en) | Zinc alloy shaped charge | |
HUP0201378A2 (en) | Components coated with an aluminium-silicon alloy | |
AU2002308221A1 (en) | Bath for the galvanic deposition of gold and gold alloys, and the use thereof | |
SG83186A1 (en) | Electroplating solution for electroplating lead and lead/tin alloys | |
AU7051601A (en) | Satin-finished nickel or nickel alloy coating | |
HK1037388A1 (en) | Sn-cu alloy plating bath | |
SG83221A1 (en) | Alloy composition and plating method | |
GB2361714A8 (en) | Chromatized zinc coated copper foil | |
HUP0301340A3 (en) | Leadfree chemical nickel alloy | |
AU2002327566A1 (en) | Zinc alloy containing a bismuth-indium intermetallic compound for use in alkaline batteries | |
AU6057200A (en) | Method and electroplating solution for plating antimony and antimony alloy coatings | |
AU3402499A (en) | Soluble metal hydride/transition metal dichalcogenide alloys | |
AU2001244277A1 (en) | Porous intermetallic alloy |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20120816 |