HK1043872B - 封裝電子器件的裝置 - Google Patents

封裝電子器件的裝置

Info

Publication number
HK1043872B
HK1043872B HK02103625.5A HK02103625A HK1043872B HK 1043872 B HK1043872 B HK 1043872B HK 02103625 A HK02103625 A HK 02103625A HK 1043872 B HK1043872 B HK 1043872B
Authority
HK
Hong Kong
Prior art keywords
electronic components
encapsulating electronic
encapsulating
components
electronic
Prior art date
Application number
HK02103625.5A
Other languages
English (en)
Other versions
HK1043872A1 (en
Inventor
Hendrikus Johannes Harmsen Wilhelmus
Franciscus Wilhelmus Van Haren Lambertus
Lambertus Gerardus Maria Venrooij Johannes
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Publication of HK1043872A1 publication Critical patent/HK1043872A1/xx
Publication of HK1043872B publication Critical patent/HK1043872B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/20—Opening, closing or clamping
    • B29C33/22—Opening, closing or clamping by rectilinear movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/66—Mould opening, closing or clamping devices mechanical
    • B29C45/661—Mould opening, closing or clamping devices mechanical using a toggle mechanism for mould clamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
HK02103625.5A 1996-03-22 2002-05-14 封裝電子器件的裝置 HK1043872B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1002691A NL1002691C2 (nl) 1996-03-22 1996-03-22 Pers voor het omhullen van electronische componenten en werkwijzen voor het gebruik van de pers.

Publications (2)

Publication Number Publication Date
HK1043872A1 HK1043872A1 (en) 2002-09-27
HK1043872B true HK1043872B (zh) 2005-01-07

Family

ID=19762550

Family Applications (2)

Application Number Title Priority Date Filing Date
HK00100943A HK1022664A1 (en) 1996-03-22 2000-02-17 Encapsulating device and method for closing a device for encapsulating electronic components
HK02103625.5A HK1043872B (zh) 1996-03-22 2002-05-14 封裝電子器件的裝置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK00100943A HK1022664A1 (en) 1996-03-22 2000-02-17 Encapsulating device and method for closing a device for encapsulating electronic components

Country Status (9)

Country Link
US (1) US6165405A (zh)
EP (2) EP1154465B1 (zh)
JP (1) JP2000507175A (zh)
KR (1) KR20000005098A (zh)
AU (1) AU1947197A (zh)
DE (2) DE69705533T2 (zh)
HK (2) HK1022664A1 (zh)
NL (1) NL1002691C2 (zh)
WO (1) WO1997035701A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG98439A1 (en) * 2001-01-09 2003-09-19 Hongguan Technologies S Pte Lt Apparatus for and a method used in compressing a workpiece
SG99343A1 (en) * 2001-02-05 2003-10-27 Lobe Technologi Pte Ltd A compact and reliable press for packaging semiconductor devices
NL1021266C2 (nl) * 2002-08-13 2004-02-17 Otb Group Bv Werkwijze en inrichting voor het geheel of ten dele bedekken van ten minste één elektronische component met een compound.
NL1028904C2 (nl) * 2005-04-29 2006-10-31 Fico Bv Pers met plaatvormige gesteldelen, en werkwijze voor het bedrijven van een dergelijke platenpers.
US20080057528A1 (en) * 2006-08-30 2008-03-06 Kimberly-Clark Worldwide, Inc. Detection of hydrogen peroxide released by enzyme-catalyzed oxidation of an analyte
US20080179793A1 (en) * 2007-01-26 2008-07-31 Husky Injection Molding Systems Ltd. Ejector-Plate Actuator of a Molding System
US8469693B2 (en) * 2010-08-24 2013-06-25 Athena Automation Ltd. Low profile stack mold carrier
US10500765B2 (en) * 2016-12-19 2019-12-10 GM Global Technology Operations LLC Online die face monitoring

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE976667C (de) * 1950-10-04 1964-02-06 May Pressenbau G M B H Kniehebelpresse mit einem Kniehebelsystem, bei dem sich der Systemaufhaengepunkt demSystemfestpunkt waehrend des Arbeitshubes naehert
GB724103A (en) * 1952-05-29 1955-02-16 Plastic Products Ltd Improvements in or relating to injection moulding apparatus
US3418692A (en) * 1965-10-06 1968-12-31 Emery I. Valyi Mold clamping apparatus
DE1704064C3 (de) * 1968-02-12 1975-08-14 Erlenbach Gmbh & Co, 5429 Lautert Vorrichtung zum Schließen von trennbaren Formteilen, insbesondere Schäumformen für Kunststoff
GB1186148A (en) * 1968-02-26 1970-04-02 Continental Copper & Steel Ind Mold to Eliminate Flash from Plastic Parts.
US4589830A (en) * 1983-08-01 1986-05-20 Clawson Burrell E Press control system
JPS61246023A (ja) * 1985-04-24 1986-11-01 Matsushita Electric Works Ltd 射出成形金型の異物検知装置
SE452127B (sv) * 1985-06-05 1987-11-16 Peter Andersson Anordning for parallellstyrning av en presslid
JPS6269521A (ja) * 1985-09-20 1987-03-30 Mitsubishi Electric Corp 半導体樹脂封入装置のクリ−ナ−エレベ−シヨン機構
JPS62248615A (ja) * 1986-04-22 1987-10-29 Toyo Mach & Metal Co Ltd 射出成形機
US4767302A (en) * 1986-09-26 1988-08-30 Yazaki Corporation Exchangeable multiplunger transfer molding die apparatus
US4915608A (en) * 1987-07-20 1990-04-10 Mitsubishi Denki Kabushiki Kaisha Device for resin sealing semiconductor devices
JPH01280521A (ja) * 1988-05-06 1989-11-10 Fanuc Ltd ダイレクトドライブ式型締装置
EP0428792B1 (en) * 1989-11-24 1996-02-28 Fico B.V. Single strip molding apparatus
JPH03180307A (ja) * 1989-12-08 1991-08-06 Mitsubishi Electric Corp 多段型締プレス装置
NL9101617A (nl) * 1991-09-24 1993-04-16 Amco Hi Tech Bv Pers voor een transfer- of spuitgietmatrijsinrichting alsmede werkwijze voor het sturen daarvan.
DE4200224A1 (de) * 1992-01-08 1993-07-15 Hohagen Ernst Georg Dr Med Herstellung mikroskopisch duenner schichten mittels einer mikrothermopresse durch druck und hitze
JPH05206186A (ja) * 1992-01-29 1993-08-13 Mitsubishi Electric Corp 樹脂封止装置および半導体装置の製造方法
JPH05261753A (ja) * 1992-03-19 1993-10-12 Matsushita Electric Ind Co Ltd マルチプランジャー式樹脂射出機構とその樹脂タブレット挿入ミス検出方法及び射出成形圧力制御方法
KR0137851B1 (ko) * 1992-04-13 1998-05-01 쯔게 슈이찌 트랜스퍼 성형 방법 및 트랜스퍼 성형 기계
JP2839220B2 (ja) * 1992-06-12 1998-12-16 住友重機械プラスチックマシナリー株式会社 電動射出成形機の型開閉装置
DE9312232U1 (de) * 1993-08-16 1993-10-28 Dorst - Maschinen- und Anlagen-Bau Otto Dorst u. Dipl. Ing. Walter Schlegel GmbH & Co, 82431 Kochel Presse zum Druckgießen keramischer Formlinge
JPH07178594A (ja) * 1993-12-24 1995-07-18 Nippon Muugu Kk 駆動装置
NL1002690C2 (nl) * 1996-03-22 1997-09-23 Fico Bv Mal-samenstel en werkwijze voor gebruik van mal-samenstel.
TW410194B (en) * 1996-08-20 2000-11-01 Apic Yamada Kk Resin molding machine

Also Published As

Publication number Publication date
WO1997035701A1 (en) 1997-10-02
JP2000507175A (ja) 2000-06-13
US6165405A (en) 2000-12-26
EP1154465A1 (en) 2001-11-14
HK1022664A1 (en) 2000-08-18
EP1154465B1 (en) 2004-08-25
NL1002691C2 (nl) 1997-09-23
DE69705533T2 (de) 2002-05-23
KR20000005098A (ko) 2000-01-25
HK1043872A1 (en) 2002-09-27
DE69730457D1 (de) 2004-09-30
EP0935520B1 (en) 2001-07-04
DE69705533D1 (de) 2001-08-09
AU1947197A (en) 1997-10-17
EP1154465A3 (en) 2002-08-07
EP0935520A1 (en) 1999-08-18
DE69730457T2 (de) 2005-09-15

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20080319