SG99343A1 - A compact and reliable press for packaging semiconductor devices - Google Patents

A compact and reliable press for packaging semiconductor devices

Info

Publication number
SG99343A1
SG99343A1 SG200100560A SG200100560A SG99343A1 SG 99343 A1 SG99343 A1 SG 99343A1 SG 200100560 A SG200100560 A SG 200100560A SG 200100560 A SG200100560 A SG 200100560A SG 99343 A1 SG99343 A1 SG 99343A1
Authority
SG
Singapore
Prior art keywords
compact
semiconductor devices
packaging semiconductor
reliable press
reliable
Prior art date
Application number
SG200100560A
Inventor
Lothar Berghoff Hans
Original Assignee
Lobe Technologi Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lobe Technologi Pte Ltd filed Critical Lobe Technologi Pte Ltd
Priority to SG200100560A priority Critical patent/SG99343A1/en
Priority to PCT/SG2002/000015 priority patent/WO2002063673A1/en
Publication of SG99343A1 publication Critical patent/SG99343A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1742—Mounting of moulds; Mould supports
    • B29C45/1744—Mould support platens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/66—Mould opening, closing or clamping devices mechanical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/68—Mould opening, closing or clamping devices hydro-mechanical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
SG200100560A 2001-02-05 2001-02-05 A compact and reliable press for packaging semiconductor devices SG99343A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG200100560A SG99343A1 (en) 2001-02-05 2001-02-05 A compact and reliable press for packaging semiconductor devices
PCT/SG2002/000015 WO2002063673A1 (en) 2001-02-05 2002-02-01 A compact and reliable press for packaging semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200100560A SG99343A1 (en) 2001-02-05 2001-02-05 A compact and reliable press for packaging semiconductor devices

Publications (1)

Publication Number Publication Date
SG99343A1 true SG99343A1 (en) 2003-10-27

Family

ID=20430733

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200100560A SG99343A1 (en) 2001-02-05 2001-02-05 A compact and reliable press for packaging semiconductor devices

Country Status (2)

Country Link
SG (1) SG99343A1 (en)
WO (1) WO2002063673A1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2273175B (en) * 1992-12-04 1996-05-15 Advanced Systems Automation Pt Direct drive electro-mechanical press for encapsulating semiconductor devices
NL1002691C2 (en) * 1996-03-22 1997-09-23 Fico Bv Press for encapsulating electronic components and methods for using the press.

Also Published As

Publication number Publication date
WO2002063673A1 (en) 2002-08-15

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