HK1043255A1 - Memory module with offset notches for improved insertion and stability and memory module connector - Google Patents

Memory module with offset notches for improved insertion and stability and memory module connector

Info

Publication number
HK1043255A1
HK1043255A1 HK02104590A HK02104590A HK1043255A1 HK 1043255 A1 HK1043255 A1 HK 1043255A1 HK 02104590 A HK02104590 A HK 02104590A HK 02104590 A HK02104590 A HK 02104590A HK 1043255 A1 HK1043255 A1 HK 1043255A1
Authority
HK
Hong Kong
Prior art keywords
memory module
stability
improved insertion
offset notches
connector
Prior art date
Application number
HK02104590A
Other languages
English (en)
Inventor
Ali Hassanzadeh
Victor Odisho
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Publication of HK1043255A1 publication Critical patent/HK1043255A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1429—Housings for circuits carrying a CPU and adapted to receive expansion cards
    • H05K7/1431—Retention mechanisms for CPU modules

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
HK02104590A 1999-04-16 2002-06-20 Memory module with offset notches for improved insertion and stability and memory module connector HK1043255A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/293,120 US6315614B1 (en) 1999-04-16 1999-04-16 Memory module with offset notches for improved insertion and stability and memory module connector
PCT/US2000/009283 WO2000064010A1 (en) 1999-04-16 2000-04-06 Memory module with offset notches for improved insertion and stability and memory module connector

Publications (1)

Publication Number Publication Date
HK1043255A1 true HK1043255A1 (en) 2002-09-06

Family

ID=23127746

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02104590A HK1043255A1 (en) 1999-04-16 2002-06-20 Memory module with offset notches for improved insertion and stability and memory module connector

Country Status (9)

Country Link
US (3) US6315614B1 (de)
EP (1) EP1171932B1 (de)
JP (1) JP2002542594A (de)
KR (1) KR100548038B1 (de)
AU (1) AU765640B2 (de)
CA (1) CA2370518C (de)
DE (1) DE60005939T2 (de)
HK (1) HK1043255A1 (de)
WO (1) WO2000064010A1 (de)

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US7234099B2 (en) * 2003-04-14 2007-06-19 International Business Machines Corporation High reliability memory module with a fault tolerant address and command bus
US7133287B2 (en) * 2004-03-31 2006-11-07 Intel Corporation ATCA integrated heatsink and core power distribution mechanism
US7192312B2 (en) 2004-04-30 2007-03-20 Bruce Michaud Design and method for plating PCI express (PCIE) edge connector
US7423885B2 (en) 2004-09-03 2008-09-09 Entorian Technologies, Lp Die module system
US7760513B2 (en) 2004-09-03 2010-07-20 Entorian Technologies Lp Modified core for circuit module system and method
US7443023B2 (en) 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US7912543B2 (en) 2005-03-21 2011-03-22 Defibtech, Llc PCB blade connector system and method
US7433193B2 (en) * 2005-05-11 2008-10-07 Cisco Technology, Inc. Techniques for controlling a position of a transceiver module relative to a connector
US7442088B2 (en) * 2005-06-04 2008-10-28 Tellabs San Jôse, Inc. Methods and apparatus for the prevention of incorrect card insertion
US7207815B1 (en) * 2006-04-12 2007-04-24 Lotes Co., Ltd. Card connector
US7717752B2 (en) * 2008-07-01 2010-05-18 International Business Machines Corporation 276-pin buffered memory module with enhanced memory system interconnect and features
US7883344B1 (en) * 2008-09-26 2011-02-08 Emc Corporation Electrical connector
US8052448B2 (en) * 2009-12-25 2011-11-08 Hon Hai Precision Ind. Co., Ltd. Card edge connector
US8083526B2 (en) * 2010-02-12 2011-12-27 Tyco Electronics Corporation Socket connector with ground shields between adjacent signal contacts
CN202363681U (zh) * 2011-11-02 2012-08-01 富士康(昆山)电脑接插件有限公司 卡缘连接器
US9357649B2 (en) 2012-05-08 2016-05-31 Inernational Business Machines Corporation 276-pin buffered memory card with enhanced memory system interconnect
KR20150045406A (ko) * 2012-08-17 2015-04-28 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 착탈식 인쇄 회로 조립체와 맞물림 및 맞물림 해제되도록 탄성 부재와 협동하는 플랜지를 포함하는 연결부
US9519315B2 (en) 2013-03-12 2016-12-13 International Business Machines Corporation 276-pin buffered memory card with enhanced memory system interconnect
USD733145S1 (en) * 2014-03-14 2015-06-30 Kingston Digital, Inc. Memory module
USD735201S1 (en) * 2014-07-30 2015-07-28 Kingston Digital, Inc. Memory module
US10727618B2 (en) 2016-08-09 2020-07-28 Intel Corporation Connector with anchoring power pin
KR101903253B1 (ko) * 2016-12-23 2018-10-01 엘지전자 주식회사 청소기
EP3488748B1 (de) * 2016-08-25 2022-08-17 LG Electronics Inc. Staubsauger
WO2018038474A1 (ko) * 2016-08-25 2018-03-01 엘지전자 주식회사 청소기
USD868069S1 (en) * 2017-06-29 2019-11-26 V-Color Technology Inc. Memory device
US11158969B2 (en) * 2018-03-09 2021-10-26 Intel Corporation Connectors for integrated circuit packages
US20200119476A1 (en) * 2018-10-16 2020-04-16 HKC Corporation Limited Display assembly and display device
US11264748B2 (en) * 2018-10-25 2022-03-01 TE Connectivity Services Gmbh Low profile electrical connector
USD954061S1 (en) * 2018-12-07 2022-06-07 Sung-Yu Chen Double-data-rate SDRAM card
USD897345S1 (en) * 2018-12-07 2020-09-29 Sung-Yu Chen Double-data-rate SDRAM card
JP7203653B2 (ja) * 2019-03-20 2023-01-13 キオクシア株式会社 ストレージデバイスおよび情報処理装置
TW202339356A (zh) * 2022-01-18 2023-10-01 美商Ｆｃｉ美國有限責任公司 具有吸收材料的卡緣連接器

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Also Published As

Publication number Publication date
JP2002542594A (ja) 2002-12-10
AU765640B2 (en) 2003-09-25
DE60005939D1 (de) 2003-11-20
WO2000064010A9 (en) 2001-11-29
KR100548038B1 (ko) 2006-01-31
US6520805B2 (en) 2003-02-18
EP1171932A1 (de) 2002-01-16
WO2000064010A1 (en) 2000-10-26
US6428360B2 (en) 2002-08-06
US20020019170A1 (en) 2002-02-14
US6315614B1 (en) 2001-11-13
CA2370518A1 (en) 2000-10-26
AU4211400A (en) 2000-11-02
EP1171932B1 (de) 2003-10-15
KR20020002421A (ko) 2002-01-09
CA2370518C (en) 2006-11-14
DE60005939T2 (de) 2004-07-22
US20010001085A1 (en) 2001-05-10

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20070406