HK1042813B - 電磁干涉屏蔽裝置 - Google Patents

電磁干涉屏蔽裝置

Info

Publication number
HK1042813B
HK1042813B HK02102902.1A HK02102902A HK1042813B HK 1042813 B HK1042813 B HK 1042813B HK 02102902 A HK02102902 A HK 02102902A HK 1042813 B HK1042813 B HK 1042813B
Authority
HK
Hong Kong
Prior art keywords
electromagnetic interference
shielding device
interference shielding
areas
conductive
Prior art date
Application number
HK02102902.1A
Other languages
English (en)
Other versions
HK1042813A1 (en
Inventor
C Benn Robert Jr
Original Assignee
Vanguard Products Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vanguard Products Corp filed Critical Vanguard Products Corp
Publication of HK1042813A1 publication Critical patent/HK1042813A1/xx
Publication of HK1042813B publication Critical patent/HK1042813B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Surgical Instruments (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
HK02102902.1A 1998-12-15 2002-04-17 電磁干涉屏蔽裝置 HK1042813B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11233398P 1998-12-15 1998-12-15
PCT/US1999/029636 WO2000036895A2 (en) 1998-12-15 1999-12-14 Electromagnetic interference shielding device

Publications (2)

Publication Number Publication Date
HK1042813A1 HK1042813A1 (en) 2002-08-23
HK1042813B true HK1042813B (zh) 2006-01-27

Family

ID=22343339

Family Applications (2)

Application Number Title Priority Date Filing Date
HK02102902.1A HK1042813B (zh) 1998-12-15 2002-04-17 電磁干涉屏蔽裝置
HK09107847.1A HK1129800A1 (en) 1998-12-15 2009-08-26 Electromagnetic interference shielding device

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK09107847.1A HK1129800A1 (en) 1998-12-15 2009-08-26 Electromagnetic interference shielding device

Country Status (9)

Country Link
US (1) US6410846B1 (zh)
EP (1) EP1145611B1 (zh)
JP (1) JP4176310B2 (zh)
CN (1) CN101427618B (zh)
AT (1) ATE291829T1 (zh)
AU (1) AU2181300A (zh)
DE (1) DE69924410T2 (zh)
HK (2) HK1042813B (zh)
WO (1) WO2000036895A2 (zh)

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US20080080160A1 (en) * 2005-12-16 2008-04-03 Laird Technologies, Inc. Emi shielding assemblies
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US7317618B2 (en) * 2006-03-09 2008-01-08 Laird Technologies, Inc. Combined board level shielding and thermal management
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
US8623265B2 (en) * 2007-02-06 2014-01-07 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
GB2458067B (en) * 2007-02-06 2011-10-05 World Properties Inc Conductive polymer foams, method of manufacture, and uses thereof
US20090226696A1 (en) * 2008-02-06 2009-09-10 World Properties, Inc. Conductive Polymer Foams, Method of Manufacture, And Uses Thereof
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US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US20110079962A1 (en) * 2009-10-02 2011-04-07 Saint-Gobain Performance Plastics Corporation Modular polymeric emi/rfi seal
WO2011082058A1 (en) * 2009-12-29 2011-07-07 Rogers Corporation Conductive polymer foams, method of manufacture, and uses thereof
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JP5060647B1 (ja) * 2011-09-14 2012-10-31 三菱航空機株式会社 航空機の窓、開口部の閉塞体、ガスケットシール
US9888562B2 (en) * 2012-12-24 2018-02-06 Apple Inc. Electromagnetic interference shielding and strain relief structures for coupled printed circuits
CN104847894A (zh) * 2014-07-15 2015-08-19 北汽福田汽车股份有限公司 一种平面密封方法
JP6574024B1 (ja) * 2018-06-07 2019-09-11 レノボ・シンガポール・プライベート・リミテッド 電子機器
WO2021034768A1 (en) * 2019-08-16 2021-02-25 Emseal Joint Systems Ltd. Expansion joint sealing system having shielding properties

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Also Published As

Publication number Publication date
HK1129800A1 (en) 2009-12-04
EP1145611A3 (en) 2002-11-06
DE69924410T2 (de) 2006-03-23
CN101427618A (zh) 2009-05-06
JP4176310B2 (ja) 2008-11-05
WO2000036895A2 (en) 2000-06-22
CN101427618B (zh) 2011-04-20
HK1042813A1 (en) 2002-08-23
US6410846B1 (en) 2002-06-25
AU2181300A (en) 2000-07-03
EP1145611A2 (en) 2001-10-17
JP2003510797A (ja) 2003-03-18
ATE291829T1 (de) 2005-04-15
EP1145611B1 (en) 2005-03-23
DE69924410D1 (de) 2005-04-28
WO2000036895A3 (en) 2002-09-19

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Legal Events

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PE Patent expired

Effective date: 20191213