HK1030678A1 - Light emitting device and method of manufacturing the same. - Google Patents

Light emitting device and method of manufacturing the same.

Info

Publication number
HK1030678A1
HK1030678A1 HK01101455A HK01101455A HK1030678A1 HK 1030678 A1 HK1030678 A1 HK 1030678A1 HK 01101455 A HK01101455 A HK 01101455A HK 01101455 A HK01101455 A HK 01101455A HK 1030678 A1 HK1030678 A1 HK 1030678A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
light emitting
same
emitting device
light
Prior art date
Application number
HK01101455A
Other languages
English (en)
Inventor
Hideki Matsubara
Koji Katayama
Akihiko Saegusa
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of HK1030678A1 publication Critical patent/HK1030678A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/28—Materials of the light emitting region containing only elements of Group II and Group VI of the Periodic Table

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
HK01101455A 1999-05-13 2001-02-28 Light emitting device and method of manufacturing the same. HK1030678A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13292499 1999-05-13
JP2000112012A JP2001028459A (ja) 1999-05-13 2000-04-13 発光装置およびその製造方法

Publications (1)

Publication Number Publication Date
HK1030678A1 true HK1030678A1 (en) 2001-05-11

Family

ID=26467390

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01101455A HK1030678A1 (en) 1999-05-13 2001-02-28 Light emitting device and method of manufacturing the same.

Country Status (7)

Country Link
US (2) US6465273B1 (xx)
EP (1) EP1052706A2 (xx)
JP (1) JP2001028459A (xx)
KR (2) KR20010014905A (xx)
CN (1) CN1168153C (xx)
HK (1) HK1030678A1 (xx)
TW (1) TW448583B (xx)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002211652A1 (en) * 2000-10-13 2002-04-22 Emcore Corporation Method of making an electrode
JP2002299699A (ja) 2001-03-30 2002-10-11 Sumitomo Electric Ind Ltd 発光装置およびその製造方法
JP4085953B2 (ja) * 2003-10-22 2008-05-14 住友電気工業株式会社 半導体光素子
KR100727605B1 (ko) * 2005-12-20 2007-06-14 서울반도체 주식회사 고효율 발광소자
KR200455042Y1 (ko) * 2009-02-14 2011-08-11 한국철도공사 철도차량의 윤축베어링 인발기
JP5359662B2 (ja) * 2009-08-03 2013-12-04 日亜化学工業株式会社 発光装置及びその製造方法
US8080436B2 (en) * 2009-07-30 2011-12-20 Nichia Corporation Light emitting device and method of manufacturing the light emitting device
TWI453844B (zh) * 2010-03-12 2014-09-21 矽品精密工業股份有限公司 四方平面無導腳半導體封裝件及其製法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1234525A (en) * 1917-02-28 1917-07-24 Aspinwall Mfg Company Fertilizer attachment for planting-machines.
US3161981A (en) * 1961-12-18 1964-12-22 Frank J Luketa Lines for trawl nets
US4347655A (en) * 1978-09-28 1982-09-07 Optical Information Systems, Inc. Mounting arrangement for semiconductor optoelectronic devices
FR2618706B1 (fr) * 1987-07-29 1989-12-22 Recoules & Fils Ets Dispositif de percage et rivetage
US5221984A (en) * 1989-09-18 1993-06-22 Kabushiki Kaisha Toshiba Optical data transmission device with parallel channel paths for arrayed optical elements
JPH03161981A (ja) 1989-11-21 1991-07-11 Toshiba Corp 半導体装置と２―６族化合物半導体結晶層の製造方法
DE4024863A1 (de) * 1990-08-04 1992-02-06 Werner & Pfleiderer Verfahren zur temperaturmessung des mischgutes in einer mischkammer eines kneters
WO1992006551A1 (en) * 1990-10-09 1992-04-16 Autotrol Corporation Improved apparatus and method for transmitting text data directly to a facsimile machine
US5226053A (en) * 1991-12-27 1993-07-06 At&T Bell Laboratories Light emitting diode
EP0989448A3 (en) * 1992-03-17 2000-05-31 Sony Corporation Photographic camera and film
JP3221073B2 (ja) 1992-06-19 2001-10-22 ソニー株式会社 発光素子
US5660461A (en) * 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
WO1997000753A1 (fr) * 1995-06-20 1997-01-09 Matsushita Electric Industrial Co., Ltd. Metal d'apport de brasage, composant electronique soude et plaque de circuit electronique
TW365071B (en) * 1996-09-09 1999-07-21 Toshiba Corp Semiconductor light emitting diode and method for manufacturing the same
JP3161981B2 (ja) 1996-09-27 2001-04-25 日石三菱株式会社 廃油混合型液体燃料燃焼用ノズル及び燃焼方法
JPH11135883A (ja) * 1997-10-28 1999-05-21 Sony Corp 半導体発光素子およびその製造方法
US6204094B1 (en) * 1998-02-04 2001-03-20 Texas Instruments Incorporated Method and apparatus for populating an adhesive sheet with particles
JP3637228B2 (ja) * 1999-02-09 2005-04-13 住友電気工業株式会社 光送受信モジュール

Also Published As

Publication number Publication date
US20040214363A1 (en) 2004-10-28
KR20010014905A (ko) 2001-02-26
KR20020097091A (ko) 2002-12-31
CN1168153C (zh) 2004-09-22
JP2001028459A (ja) 2001-01-30
US6465273B1 (en) 2002-10-15
TW448583B (en) 2001-08-01
EP1052706A2 (en) 2000-11-15
KR100408312B1 (ko) 2003-12-01
CN1274177A (zh) 2000-11-22

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