HK1026770A1 - Method and device for separating products, mountedon a common substrate, from each other along (a) cutting line(s). - Google Patents

Method and device for separating products, mountedon a common substrate, from each other along (a) cutting line(s).

Info

Publication number
HK1026770A1
HK1026770A1 HK00105917A HK00105917A HK1026770A1 HK 1026770 A1 HK1026770 A1 HK 1026770A1 HK 00105917 A HK00105917 A HK 00105917A HK 00105917 A HK00105917 A HK 00105917A HK 1026770 A1 HK1026770 A1 HK 1026770A1
Authority
HK
Hong Kong
Prior art keywords
mountedon
along
cutting line
common substrate
separating products
Prior art date
Application number
HK00105917A
Other languages
English (en)
Inventor
Werner Rischke Jorg
Franklin Menschaar Hugo
Gijbertus Leonardus Wilhelmus
Original Assignee
Besi Plating B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Plating B V filed Critical Besi Plating B V
Publication of HK1026770A1 publication Critical patent/HK1026770A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
    • Y10T83/041—By heating or cooling
    • Y10T83/0414—At localized area [e.g., line of separation]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
    • Y10T83/0443—By fluid application
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0495—Making and using a registration cut
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/263—With means to apply transient nonpropellant fluent material to tool or work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/283—With means to control or modify temperature of apparatus or work
    • Y10T83/293—Of tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/525—Operation controlled by detector means responsive to work
    • Y10T83/533—With photo-electric work-sensing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Processing Of Solid Wastes (AREA)
HK00105917A 1999-01-19 2000-09-20 Method and device for separating products, mountedon a common substrate, from each other along (a) cutting line(s). HK1026770A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1011077A NL1011077C2 (nl) 1999-01-19 1999-01-19 Werkwijze en inrichting voor het langs een snijlijn(en) van elkaar scheiden van met een gemeenschappelijke drager gevormde producten.

Publications (1)

Publication Number Publication Date
HK1026770A1 true HK1026770A1 (en) 2000-12-22

Family

ID=19768507

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00105917A HK1026770A1 (en) 1999-01-19 2000-09-20 Method and device for separating products, mountedon a common substrate, from each other along (a) cutting line(s).

Country Status (12)

Country Link
US (1) US6588308B2 (zh)
EP (1) EP1022779A1 (zh)
JP (1) JP3641646B2 (zh)
KR (1) KR100366922B1 (zh)
CN (1) CN1155994C (zh)
CA (1) CA2295421A1 (zh)
HK (1) HK1026770A1 (zh)
ID (1) ID24404A (zh)
MY (1) MY124915A (zh)
NL (1) NL1011077C2 (zh)
SG (1) SG85684A1 (zh)
TW (1) TW437003B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4860177B2 (ja) * 2005-05-09 2012-01-25 エステック株式会社 ガラス板等ワークの切断方法及び装置
US7644512B1 (en) * 2006-01-18 2010-01-12 Akrion, Inc. Systems and methods for drying a rotating substrate
WO2008003502A1 (de) * 2006-07-06 2008-01-10 Rena Sondermaschinen Gmbh Vorrichtung und verfahren zum vereinzeln und transportieren von substraten
KR20110005473U (ko) * 2009-11-26 2011-06-01 세크론 주식회사 냉각용수 공급이 가능한 반도체소자 절단장치의 진공척테이블
JP5709370B2 (ja) * 2009-11-26 2015-04-30 株式会社ディスコ 切削装置及び切削方法
JP7019241B2 (ja) * 2017-09-21 2022-02-15 株式会社ディスコ 切削ブレードの装着機構
CN108823944B (zh) * 2018-07-02 2024-04-12 江苏湛德医疗用品有限公司 一种无纺布生产过程剪裁机系统

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2191916A (en) * 1938-02-28 1940-02-27 Bower Roller Bearing Co Method of forming roller bearing cups
US3407690A (en) * 1966-12-12 1968-10-29 Armstrong Cork Co Method of trimming and cutting in register
US3798782A (en) * 1971-10-18 1974-03-26 R Lindahl Register mark punch system and method
US3818790A (en) * 1972-11-29 1974-06-25 Armstrong Cork Co Carpet tile cutter
US4054070A (en) * 1976-05-17 1977-10-18 Globe Machine Manufacturing Company Panel saw mechanism
US4209129A (en) * 1978-12-29 1980-06-24 International Business Machines Corporation Cooling manifold for multiple solenoid operated punching apparatus
JPS55118647A (en) * 1979-03-06 1980-09-11 Toshiba Corp Method of dicing semiconductor wafer
DE3137301A1 (de) * 1981-09-18 1983-04-14 Presco Inc., Beverly Hills, Calif. "verfahren und vorrichtung zur handhabung kleiner teile in der fertigung"
US4484417A (en) * 1982-11-22 1984-11-27 W. J. Savage Company Sawing apparatus
US4578203A (en) * 1983-04-01 1986-03-25 Ppg Industries, Inc. Polymer solution working fluid for finishing processes
NZ213316A (en) * 1985-08-30 1988-10-28 Trigon Packaging Systems Forming arrays of evacuated packages on independent magazines which packages are separated after sealing
JPS62249446A (ja) 1986-04-23 1987-10-30 Hitachi Ltd 保持装置およびその使用方法
JPH01188308A (ja) 1988-01-22 1989-07-27 Nec Corp 半導体ウェハのダイシング装置
US4920947A (en) * 1988-04-14 1990-05-01 Blount, Inc. Chain saw components and system for cutting masonry and the like
US4872381A (en) * 1988-07-13 1989-10-10 International Business Machines Corp. Programmable magnetic repulsion punching apparatus
JPH02102559A (ja) 1988-10-11 1990-04-16 Rohm Co Ltd 半導体製造装置
JPH0348443A (ja) 1989-06-23 1991-03-01 Nec Kansai Ltd 半導体ウェーハ切断方法
JPH03198363A (ja) * 1989-12-27 1991-08-29 Ricoh Co Ltd 半導体ユニットのダイシング方法
US5074178A (en) * 1990-05-04 1991-12-24 Cad Futures Corporation Apparatus and method for cutting drawings from a web of sheet material
US5062334A (en) * 1990-05-21 1991-11-05 Killilea Timothy R Apparatus for cleaning cutting table support surface
JPH0435846A (ja) 1990-05-31 1992-02-06 Toshiba Corp 半導体ウエハの位置合せ方法
JPH04147622A (ja) * 1990-10-11 1992-05-21 Nec Kyushu Ltd 水中加工用ウエハチャッキングテーブル
DE4309134C2 (de) * 1993-03-22 1999-03-04 Wilfried Wahl Verfahren zur Schmierung und Kühlung von Schneiden und/oder Werkstücken bei zerspanenden Arbeitsprozessen
JPH06275712A (ja) 1993-03-24 1994-09-30 Nec Kansai Ltd ダイシング装置
ES2111786T5 (es) * 1993-03-26 2000-12-16 Alfons Haar Maschb Gmbh & Co Prensa con un sistema de alimentacion de tablas y de avance.
JPH06326185A (ja) * 1993-05-17 1994-11-25 Hitachi Ltd ダイシング装置およびダイシング用ブレード
US5790402A (en) * 1994-09-16 1998-08-04 E-Z Max Apparel Systems, Inc. Spreading table with electronic splice zone display
US5839337A (en) * 1995-04-28 1998-11-24 Neu; H. Karl Semiconductor carrier strip trimming apparatus
JPH0917752A (ja) * 1995-06-28 1997-01-17 Sony Corp 偏平な被切削物の切断方法及びその装置
KR100475524B1 (ko) * 1996-11-27 2005-05-17 삼성전자주식회사 기판의절단방법
KR100225909B1 (ko) * 1997-05-29 1999-10-15 윤종용 웨이퍼 소잉 장치

Also Published As

Publication number Publication date
EP1022779A1 (en) 2000-07-26
NL1011077C2 (nl) 2000-07-20
KR100366922B1 (ko) 2003-01-06
US6588308B2 (en) 2003-07-08
KR20000052404A (ko) 2000-08-25
ID24404A (id) 2000-07-20
US20010029820A1 (en) 2001-10-18
CA2295421A1 (en) 2000-07-19
CN1155994C (zh) 2004-06-30
JP2000216113A (ja) 2000-08-04
CN1261204A (zh) 2000-07-26
TW437003B (en) 2001-05-28
SG85684A1 (en) 2002-01-15
JP3641646B2 (ja) 2005-04-27
MY124915A (en) 2006-07-31

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Legal Events

Date Code Title Description
CHPA Change of a particular in the register (except of change of ownership)
AS Change of ownership

Owner name: BESI SINGULATION B.V.

Free format text: FORMER OWNER(S): BESI PLATING B.V

PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20090117