HK1012605A1 - Process and apparatus for the wave soldering of circuit boards - Google Patents

Process and apparatus for the wave soldering of circuit boards

Info

Publication number
HK1012605A1
HK1012605A1 HK98113998A HK98113998A HK1012605A1 HK 1012605 A1 HK1012605 A1 HK 1012605A1 HK 98113998 A HK98113998 A HK 98113998A HK 98113998 A HK98113998 A HK 98113998A HK 1012605 A1 HK1012605 A1 HK 1012605A1
Authority
HK
Hong Kong
Prior art keywords
circuit boards
wave soldering
soldering
wave
boards
Prior art date
Application number
HK98113998A
Other languages
English (en)
Inventor
Robert W Connors
Frederick W Giacobbe
Benjamin J Jurcik
Frederic Rotman
Kevin P Mckean
Original Assignee
Air Liquide
Air Liquide American
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26897716&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1012605(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US08/202,489 external-priority patent/US5411200A/en
Application filed by Air Liquide, Air Liquide American filed Critical Air Liquide
Publication of HK1012605A1 publication Critical patent/HK1012605A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
HK98113998A 1994-02-28 1998-12-18 Process and apparatus for the wave soldering of circuit boards HK1012605A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/202,489 US5411200A (en) 1994-02-28 1994-02-28 Process and apparatus for the wave soldering of circuit boards
US08/253,248 US5409159A (en) 1994-02-28 1994-06-02 Apparatus and methods for inerting solder during wave soldering operations
PCT/EP1995/000628 WO1995023045A1 (en) 1994-02-28 1995-02-20 Process and apparatus for the wave soldering of circuit boards

Publications (1)

Publication Number Publication Date
HK1012605A1 true HK1012605A1 (en) 1999-08-06

Family

ID=26897716

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98113998A HK1012605A1 (en) 1994-02-28 1998-12-18 Process and apparatus for the wave soldering of circuit boards

Country Status (12)

Country Link
US (1) US5409159A (ko)
EP (2) EP0696240B1 (ko)
JP (1) JP2919075B2 (ko)
KR (1) KR100310756B1 (ko)
CN (1) CN1083685C (ko)
CA (1) CA2161770C (ko)
DE (1) DE69508490T2 (ko)
DK (1) DK0696240T3 (ko)
ES (1) ES2129808T3 (ko)
HK (1) HK1012605A1 (ko)
SG (1) SG70969A1 (ko)
WO (1) WO1995023045A1 (ko)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5520320A (en) * 1994-04-22 1996-05-28 Air Liquide America Corporation Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere
US5509598A (en) * 1994-05-31 1996-04-23 The Boc Group, Inc. Wave soldering apparatus and process
JP3311547B2 (ja) * 1995-08-02 2002-08-05 日本電熱計器株式会社 はんだ付け装置
FR2748410B1 (fr) 1996-05-07 1998-06-05 Air Liquide Procede et machine de brasage ou etamage a la vague
JP3638415B2 (ja) * 1997-01-20 2005-04-13 日本電熱計器株式会社 ガス雰囲気はんだ付け装置
DE19749185A1 (de) * 1997-11-07 1999-05-12 Messer Griesheim Gmbh Mit einer Gasversorgung verbindbare Gasverteilung
DE19749187A1 (de) * 1997-11-07 1999-05-12 Messer Griesheim Gmbh Lötvorrichtung
US6106281A (en) * 1997-12-12 2000-08-22 Materna; Peter A. Method of reducing the flow of gas needed for a chamber with controlled temperature and controlled composition of gas
US5979740A (en) * 1998-03-04 1999-11-09 Rooks; Bobby J. Solder wave height set-up gauge
US6234380B1 (en) * 1998-10-29 2001-05-22 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and method for inerting a wave soldering installation
JP2001251047A (ja) * 2000-03-07 2001-09-14 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法および自動はんだ付け装置
DE10061032A1 (de) * 2000-12-08 2002-06-27 Messer Griesheim Gmbh Verfahren und Vorrichtung zum Löten elektronischer Bauelemente auf Leiterplatten
JP4647150B2 (ja) * 2001-08-07 2011-03-09 千住金属工業株式会社 酸化物の分離装置
DE102004048474A1 (de) * 2004-10-05 2006-04-06 Linde Ag Vorrichtung zum Wellenlöten
ATE501805T1 (de) * 2006-05-23 2011-04-15 Linde Ag Vorrichtung und verfahren zum wellenlöten
DE102007002777A1 (de) * 2007-01-18 2008-07-24 Linde Ag Vorrichtung und Verfahren zum Selektivlöten
US20080302861A1 (en) * 2007-06-11 2008-12-11 Szymanowski Richard A Method and apparatus for wave soldering an electronic substrate
JP5410835B2 (ja) * 2009-05-14 2014-02-05 株式会社デンソー 噴流はんだ槽
KR101089648B1 (ko) 2009-12-24 2011-12-06 삼성전기주식회사 웨이브 솔더링장치
US8220699B2 (en) 2010-03-12 2012-07-17 Air Products And Chemicals, Inc. Apparatus and method for providing an inerting gas during soldering
TWI401131B (zh) * 2010-03-12 2013-07-11 Air Prod & Chem 於軟焊時提供惰性化氣體的設備及方法
DE102012022669B4 (de) * 2012-11-21 2022-10-13 Illinois Tool Works Inc. Selektiv-Lötanlage
DE102014110720A1 (de) * 2014-07-29 2016-02-04 Illinois Tool Works Inc. Lötmodul
CN104588814B (zh) * 2014-11-18 2016-08-31 北京三重华星电子科技有限公司 一种波峰焊夹具制作规范的方法
CN106513909A (zh) * 2016-11-18 2017-03-22 罗国武 一种波峰焊氮气保护设备
JP6593400B2 (ja) * 2017-08-04 2019-10-23 千住金属工業株式会社 噴流はんだ槽及び噴流はんだ付け装置
KR20190058228A (ko) 2017-11-20 2019-05-29 (주)케이티엔에프 웨이브 솔더링 공정에서 피씨비(pcb)의 과열을 방지할 수 있는 웨이브 지그 및 이를 이용한 웨이브 솔더링 방법
JP6508299B1 (ja) * 2017-11-29 2019-05-08 千住金属工業株式会社 噴流はんだ高さ確認治具及びその取り扱い方法
US10780516B2 (en) * 2018-06-14 2020-09-22 Illinois Tool Works Inc. Wave solder nozzle with automated adjustable sliding plate to vary solder wave width
US11389888B2 (en) 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing
DE202022101918U1 (de) 2022-04-08 2023-07-11 Ersa Gmbh Transparente Begasungskappe, Lötdüsenanordnung, Löttiegeleinheit und Selektivlötanlage mit einer solchen Begasungskappe

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3705457A (en) * 1970-11-02 1972-12-12 Electrovert Mfg Co Ltd Wave soldering using inert gas to protect pretinned and soldered surfaces of relatively flat workpieces
JPS49119433A (ko) * 1973-03-19 1974-11-14
JPS586250B2 (ja) * 1980-06-18 1983-02-03 株式会社フジクラ ブスバ−のモ−ルド絶縁方法
DE3309648A1 (de) * 1983-03-15 1984-09-20 Siemens AG, 1000 Berlin und 8000 München Verfahren zum loeten plattenfoermiger schaltungstraeger innerhalb einer schutzgasloeteinrichtung
US4538757A (en) * 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere
US4610391A (en) * 1984-12-18 1986-09-09 Union Carbide Corporation Process for wave soldering
FR2583064B1 (fr) * 1985-06-05 1987-08-14 Air Liquide Procede de traitement thermique, hotte pour la mise en oeuvre de ce procede et son utilisation dans les fours de traitement thermique
JPS61286058A (ja) * 1985-06-11 1986-12-16 Meisho Kk 噴流式半田槽
US4646958A (en) * 1985-10-31 1987-03-03 International Business Machines Corp. Fluxless soldering process using a silane atmosphere
DE3737563A1 (de) * 1987-11-05 1989-05-18 Ernst Hohnerlein Loetmaschine
US4821947A (en) * 1988-02-08 1989-04-18 Union Carbide Corporation Fluxless application of a metal-comprising coating
US5071058A (en) * 1988-09-30 1991-12-10 Union Carbide Industrial Gases Technology Corporation Process for joining/coating using an atmosphere having a controlled oxidation capability
US5044542A (en) * 1989-11-22 1991-09-03 Electrovert Ltd. Shield gas wave soldering
US5121874A (en) * 1989-11-22 1992-06-16 Electrovert Ltd. Shield gas wave soldering
US5048746A (en) * 1989-12-08 1991-09-17 Electrovert Ltd. Tunnel for fluxless soldering
US5228614A (en) * 1990-07-09 1993-07-20 Electrovert Ltd. Solder nozzle with gas knife jet
JP3187849B2 (ja) * 1991-01-28 2001-07-16 ソニー株式会社 噴流はんだ槽
US5121875A (en) * 1991-02-22 1992-06-16 Union Carbide Industrial Gases Technology Corporation Wave soldering in a protective atmosphere enclosure over a solder pot
NL9101383A (nl) * 1991-08-13 1993-03-01 Soltec Bv Soldeerinrichting met deken van zuurstofarm gas.
US5240169A (en) * 1991-12-06 1993-08-31 Electrovert Ltd. Gas shrouded wave soldering with gas knife
US5292055A (en) * 1991-12-06 1994-03-08 Electrovert Ltd. Gas shrouded wave improvement
US5203489A (en) * 1991-12-06 1993-04-20 Electrovert Ltd. Gas shrouded wave soldering

Also Published As

Publication number Publication date
CN1083685C (zh) 2002-04-24
DK0696240T3 (da) 1999-10-11
WO1995023045A1 (en) 1995-08-31
CN1124470A (zh) 1996-06-12
KR960701724A (ko) 1996-03-28
KR100310756B1 (ko) 2001-12-17
DE69508490T2 (de) 1999-11-18
US5409159A (en) 1995-04-25
SG70969A1 (en) 2000-03-21
EP0841117A1 (en) 1998-05-13
CA2161770A1 (en) 1995-08-31
CA2161770C (en) 2002-05-28
JP2919075B2 (ja) 1999-07-12
EP0696240A1 (en) 1996-02-14
ES2129808T3 (es) 1999-06-16
DE69508490D1 (de) 1999-04-29
JPH09500238A (ja) 1997-01-07
EP0696240B1 (en) 1999-03-24

Similar Documents

Publication Publication Date Title
SG70969A1 (en) Process and apparatus for the wave soldering of circuit boards
KR0146032B1 (en) Process and apparatus for wave soldering
GB2286656B (en) Treatment method and apparatus for printed circuit boards and the like
GB2288992B (en) Copper foil for printed circuits and method of treating the surface thereof
GB2292845B (en) Electronic apparatus
SG52900A1 (en) Mounting apparatus of electronic components and mounting methods of the same
GB9522047D0 (en) Method and apparatus for cleaning electronic parts
HUT76211A (en) Method and apparatus for manufacturing ceramic electronic components
GB9512101D0 (en) Circuit board test apparatus and method
EP0469788A3 (en) Method and apparatus for reflow-soldering of print circuit boards
EP0700008A3 (en) Method for modeling an electrical circuit and apparatus
IL125806A0 (en) Spray-cooling circuit board apparatus and method
ZA954134B (en) Wave soldering apparatus and process
GB2287331B (en) Electronic multiplying and adding apparatus and method
ZA943662B (en) Wave soldering method and apparatus
GB2288229B (en) Method and apparatus for perforating printed circuit board
EP0776151A4 (en) METHOD AND DEVICE FOR SOLDERING TESTING A CIRCUIT BOARD
GB9011020D0 (en) An electronic wave heating apparatus
GB9420320D0 (en) Electronic apparatus
EP0152600A3 (en) Method and apparatus for the treatment of printed circuit boards
GB2265101B (en) Soldering apparatus and method
AU5536394A (en) Method and apparatus for soldering circuit boards
EP0457339A3 (en) Method and apparatus for the production of circuit boards
DE69412175D1 (de) Lötverfahren und Apparat zum Verbinden elektronischer Schaltungsanordnungen
GB9401766D0 (en) Soldering apparatus

Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20100220