HK1002870A1 - Process for the corrosion protection of copper or copper alloys - Google Patents
Process for the corrosion protection of copper or copper alloysInfo
- Publication number
- HK1002870A1 HK1002870A1 HK98102036A HK98102036A HK1002870A1 HK 1002870 A1 HK1002870 A1 HK 1002870A1 HK 98102036 A HK98102036 A HK 98102036A HK 98102036 A HK98102036 A HK 98102036A HK 1002870 A1 HK1002870 A1 HK 1002870A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- copper
- pct
- corrosion protection
- sec
- aryl
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Chemical Treatment Of Metals (AREA)
- ing And Chemical Polishing (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9426087.4A GB9426087D0 (en) | 1994-12-23 | 1994-12-23 | Process for the surface treatment of copper or copper alloys |
GBGB9507419.1A GB9507419D0 (en) | 1995-04-10 | 1995-04-10 | Process for the surface treatment of copper or copper alloys |
PCT/GB1995/002912 WO1996020295A1 (en) | 1994-12-23 | 1995-12-13 | Process for the corrosion protection of copper or copper alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1002870A1 true HK1002870A1 (en) | 1998-09-25 |
Family
ID=26306247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK98102036A HK1002870A1 (en) | 1994-12-23 | 1998-03-12 | Process for the corrosion protection of copper or copper alloys |
Country Status (12)
Country | Link |
---|---|
US (1) | US6158491A (ko) |
EP (1) | EP0799327B1 (ko) |
JP (1) | JPH10511431A (ko) |
KR (1) | KR100402899B1 (ko) |
CN (1) | CN1057350C (ko) |
AT (1) | ATE178953T1 (ko) |
AU (1) | AU4183896A (ko) |
DE (1) | DE69509124T2 (ko) |
FI (1) | FI972692A (ko) |
HK (1) | HK1002870A1 (ko) |
TW (1) | TW304208B (ko) |
WO (1) | WO1996020295A1 (ko) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1091173C (zh) * | 1999-09-01 | 2002-09-18 | 中国科学院金属研究所 | 一种清除铜及铜合金表面锈蚀的综合防护处理剂 |
DE10026010A1 (de) * | 2000-05-25 | 2001-11-29 | Basf Ag | Hydraulische Flüssigkeiten mit verbessertem Korrosionsschutz für Buntmetalle |
WO2002000965A1 (fr) * | 2000-06-28 | 2002-01-03 | Koito, Tatsuya | Agent anticorrosion |
JP4822652B2 (ja) * | 2000-11-22 | 2011-11-24 | エンド ファーマシューティカルズ インコーポレイテッド | 粘膜炎の治療 |
DE10117647A1 (de) * | 2001-04-09 | 2002-10-17 | Basf Ag | Hydraulische Flüssigkeiten mit verbessertem Korrosionsschutz |
US8349393B2 (en) | 2004-07-29 | 2013-01-08 | Enthone Inc. | Silver plating in electronics manufacture |
KR100668129B1 (ko) * | 2005-07-07 | 2007-01-11 | 백양케미칼(주) | 프리플럭스 조성물 |
CN1955341B (zh) * | 2005-10-25 | 2011-09-07 | 李碧洁 | 适用于多次高温无铅焊接的铜面防氧化剂 |
DE102006041292A1 (de) * | 2006-09-01 | 2008-03-06 | Henkel Kgaa | Wasserstoffperoxid-Aktivierung mit N-Heterocyclen |
CN101575704B (zh) * | 2009-06-12 | 2011-01-26 | 林原标 | 铜及铜合金表面处理剂 |
CN101824621A (zh) * | 2010-04-12 | 2010-09-08 | 海宁市科泰克金属表面技术有限公司 | 一种高性能铜、镍保护剂 |
US8961678B2 (en) * | 2012-12-20 | 2015-02-24 | Rohm And Haas Electronic Materials Llc | Organic solderability preservative and method |
WO2014151491A1 (en) * | 2013-03-16 | 2014-09-25 | Prc-Desoto International, Inc. | Metal complexing agents as corrosion inhibitors |
JP6829212B2 (ja) | 2015-05-28 | 2021-02-10 | エコラボ ユーエスエー インコーポレイティド | 腐食抑制剤としての水溶性ピラゾール誘導体 |
WO2016191667A2 (en) | 2015-05-28 | 2016-12-01 | Ecolab Usa Inc. | Novel corrosion inhibitors |
EP4234760A1 (en) | 2015-05-28 | 2023-08-30 | Ecolab USA Inc. | Formulation comprising 2-substituted benzimidazole or 2-substituted imidazole corrosion inhibitors |
ES2905443T3 (es) * | 2015-05-28 | 2022-04-08 | Ecolab Usa Inc | Inhibidores de la corrosión a base de purina |
KR102334425B1 (ko) * | 2019-11-21 | 2021-12-01 | 엘티씨 (주) | 디스플레이 제조용 포토레지스트 박리액 조성물 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5233583B2 (ko) * | 1972-06-15 | 1977-08-29 | ||
JPS537902B2 (ko) * | 1972-12-21 | 1978-03-23 | ||
JPS533975B2 (ko) * | 1973-10-17 | 1978-02-13 | Tokai Electro Chemical Co | |
US4740320A (en) * | 1985-07-22 | 1988-04-26 | The Dow Chemical Company | Process for preventing corrosion of a metal in contact with a well fluid |
-
1995
- 1995-12-13 DE DE69509124T patent/DE69509124T2/de not_active Expired - Fee Related
- 1995-12-13 EP EP95940369A patent/EP0799327B1/en not_active Expired - Lifetime
- 1995-12-13 US US08/860,074 patent/US6158491A/en not_active Expired - Lifetime
- 1995-12-13 WO PCT/GB1995/002912 patent/WO1996020295A1/en active IP Right Grant
- 1995-12-13 KR KR1019970704329A patent/KR100402899B1/ko not_active IP Right Cessation
- 1995-12-13 AU AU41838/96A patent/AU4183896A/en not_active Abandoned
- 1995-12-13 JP JP8520274A patent/JPH10511431A/ja active Pending
- 1995-12-13 AT AT95940369T patent/ATE178953T1/de not_active IP Right Cessation
- 1995-12-13 CN CN95197682A patent/CN1057350C/zh not_active Expired - Fee Related
- 1995-12-20 TW TW084113640A patent/TW304208B/zh not_active IP Right Cessation
-
1997
- 1997-06-23 FI FI972692A patent/FI972692A/fi unknown
-
1998
- 1998-03-12 HK HK98102036A patent/HK1002870A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
FI972692A0 (fi) | 1997-06-23 |
ATE178953T1 (de) | 1999-04-15 |
AU4183896A (en) | 1996-07-19 |
CN1057350C (zh) | 2000-10-11 |
US6158491A (en) | 2000-12-12 |
DE69509124D1 (de) | 1999-05-20 |
EP0799327A1 (en) | 1997-10-08 |
EP0799327B1 (en) | 1999-04-14 |
CN1175286A (zh) | 1998-03-04 |
JPH10511431A (ja) | 1998-11-04 |
WO1996020295A1 (en) | 1996-07-04 |
DE69509124T2 (de) | 1999-11-25 |
FI972692A (fi) | 1997-08-22 |
TW304208B (ko) | 1997-05-01 |
KR100402899B1 (ko) | 2004-06-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20031213 |
|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |