HK1001176A1 - Integrated semiconductor memory with redundancy arrangement - Google Patents

Integrated semiconductor memory with redundancy arrangement

Info

Publication number
HK1001176A1
HK1001176A1 HK98100230A HK98100230A HK1001176A1 HK 1001176 A1 HK1001176 A1 HK 1001176A1 HK 98100230 A HK98100230 A HK 98100230A HK 98100230 A HK98100230 A HK 98100230A HK 1001176 A1 HK1001176 A1 HK 1001176A1
Authority
HK
Hong Kong
Prior art keywords
semiconductor memory
integrated semiconductor
redundancy arrangement
redundancy
arrangement
Prior art date
Application number
HK98100230A
Other languages
English (en)
Inventor
Johannes Stecker
Johann Rieger
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of HK1001176A1 publication Critical patent/HK1001176A1/xx

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70—Masking faults in memories by using spares or by reconfiguring
    • G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
    • G11C29/781—Masking faults in memories by using spares or by reconfiguring using programmable devices combined in a redundant decoder
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70—Masking faults in memories by using spares or by reconfiguring
    • G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
    • G11C29/80—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout
    • G11C29/806—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout by reducing size of decoders
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70—Masking faults in memories by using spares or by reconfiguring
    • G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
    • G11C29/80—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout
    • G11C29/808—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout using a flexible replacement scheme
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70—Masking faults in memories by using spares or by reconfiguring
    • G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
    • G11C29/84—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved access time or stability
    • G11C29/846—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved access time or stability by choosing redundant lines at an output stage
HK98100230A 1992-04-16 1998-01-12 Integrated semiconductor memory with redundancy arrangement HK1001176A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE1992/000316 WO1993021578A1 (de) 1992-04-16 1992-04-16 Integrierter halbleiterspeicher mit redundanzeinrichtung

Publications (1)

Publication Number Publication Date
HK1001176A1 true HK1001176A1 (en) 1998-05-29

Family

ID=6874978

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98100230A HK1001176A1 (en) 1992-04-16 1998-01-12 Integrated semiconductor memory with redundancy arrangement

Country Status (8)

Country Link
US (1) US5459690A (ko)
EP (1) EP0636258B1 (ko)
JP (1) JP3129440B2 (ko)
KR (1) KR100248165B1 (ko)
DE (1) DE59205881D1 (ko)
HK (1) HK1001176A1 (ko)
TW (1) TW223685B (ko)
WO (1) WO1993021578A1 (ko)

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KR100320605B1 (ko) * 1992-07-02 2002-04-22 페레고스 조지, 마이크 로스 방해없이임의로주소지정가능한메모리시스템
EP0675440B1 (en) * 1994-03-29 1998-08-05 STMicroelectronics S.r.l. Redundancy circuitry for a semiconductor memory device
KR0140177B1 (ko) * 1994-12-29 1998-07-15 김광호 반도체메모리소자의 메모리셀어레이의 배열방법
US5523975A (en) * 1995-02-08 1996-06-04 Alliance Semiconductor Corporation Redundancy scheme for monolithic memories
JP2629645B2 (ja) * 1995-04-20 1997-07-09 日本電気株式会社 半導体記憶装置
EP0766175B1 (de) * 1995-08-09 2002-07-17 Infineon Technologies AG Integrierter Halbleiterspeicher mit Redundanzspeicherzellen
US5699307A (en) * 1996-06-28 1997-12-16 Intel Corporation Method and apparatus for providing redundant memory in an integrated circuit utilizing a subarray shuffle replacement scheme
KR100247920B1 (ko) 1996-12-31 2000-03-15 윤종용 반도체메모리장치의로우리던던시구조및불량셀구제방법
US5831913A (en) * 1997-03-31 1998-11-03 International Business Machines Corporation Method of making a memory fault-tolerant using a variable size redundancy replacement configuration
US5831914A (en) * 1997-03-31 1998-11-03 International Business Machines Corporation Variable size redundancy replacement architecture to make a memory fault-tolerant
DE19729579C2 (de) * 1997-07-10 2000-12-07 Siemens Ag Verfahren zum Aktivieren einer redundanten Wortleitung bei Inter-Segment-Redundanz bei einem Halbleiterspeicher mit in Segmenten organisierten Wortleitungen
US5881003A (en) * 1997-07-16 1999-03-09 International Business Machines Corporation Method of making a memory device fault tolerant using a variable domain redundancy replacement configuration
US5978931A (en) * 1997-07-16 1999-11-02 International Business Machines Corporation Variable domain redundancy replacement configuration for a memory device
US5986950A (en) * 1997-10-15 1999-11-16 International Business Machines Corporation Use of redundant circuits to improve the reliability of an integrated circuit
US5970000A (en) * 1998-02-02 1999-10-19 International Business Machines Corporation Repairable semiconductor integrated circuit memory by selective assignment of groups of redundancy elements to domains
TW582041B (en) * 1998-04-17 2004-04-01 Siemens Ag Memory-arrangement with redundant memory-cells and method to access on the redundant memory-cells
US6072735A (en) * 1998-06-22 2000-06-06 Lucent Technologies, Inc. Built-in redundancy architecture for computer memories
DE19836578C2 (de) * 1998-08-12 2000-08-17 Siemens Ag Integrierter Speicher mit Interblockredundanz
US5978291A (en) * 1998-09-30 1999-11-02 International Business Machines Corporation Sub-block redundancy replacement for a giga-bit scale DRAM
US6144593A (en) * 1999-09-01 2000-11-07 Micron Technology, Inc. Circuit and method for a multiplexed redundancy scheme in a memory device
JP2001273788A (ja) * 2000-03-29 2001-10-05 Hitachi Ltd 半導体記憶装置
US6941528B2 (en) 2003-08-28 2005-09-06 International Business Machines Corporation Use of a layout-optimization tool to increase the yield and reliability of VLSI designs
US20050048677A1 (en) * 2003-08-29 2005-03-03 International Business Machines Corporation The use of a layout-optimization tool to increase the yield and reliability of vlsi designs
US8407428B2 (en) 2010-05-20 2013-03-26 Hicamp Systems, Inc. Structured memory coprocessor
TWI499909B (zh) * 2007-01-26 2015-09-11 Cheriton David 階層式不可改變的內容可定址的記憶體處理器
US9601199B2 (en) 2007-01-26 2017-03-21 Intel Corporation Iterator register for structured memory
US8504791B2 (en) 2007-01-26 2013-08-06 Hicamp Systems, Inc. Hierarchical immutable content-addressable memory coprocessor
US7916540B2 (en) * 2007-05-17 2011-03-29 Samsung Electronics Co., Ltd. Non-volatile memory devices and systems including bad blocks address re-mapped and methods of operating the same
US11024352B2 (en) 2012-04-10 2021-06-01 Samsung Electronics Co., Ltd. Memory system for access concentration decrease management and access concentration decrease method
US9694934B2 (en) * 2015-07-31 2017-07-04 Inteplast Group Corporation Bulk bin

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58102395A (ja) * 1981-12-12 1983-06-17 Nippon Telegr & Teleph Corp <Ntt> 半導体記憶装置
US4538247A (en) * 1983-01-14 1985-08-27 Fairchild Research Center Redundant rows in integrated circuit memories
JPH0670880B2 (ja) * 1983-01-21 1994-09-07 株式会社日立マイコンシステム 半導体記憶装置
JPS59203299A (ja) * 1983-05-06 1984-11-17 Nec Corp 冗長ビット付メモリ
DE3588121T2 (de) * 1984-05-31 1997-01-16 Fujitsu Ltd Halbleiterintegrierte Schaltung mit einer Ersatzredundanzschaltung
JPS62264496A (ja) * 1986-05-09 1987-11-17 Matsushita Electronics Corp 半導体集積記憶回路
JPH02208897A (ja) * 1989-02-08 1990-08-20 Seiko Epson Corp 半導体記憶装置
JPH03252998A (ja) * 1990-02-28 1991-11-12 Sharp Corp 半導体記憶装置
US5153880A (en) * 1990-03-12 1992-10-06 Xicor, Inc. Field-programmable redundancy apparatus for memory arrays

Also Published As

Publication number Publication date
WO1993021578A1 (de) 1993-10-28
KR100248165B1 (ko) 2000-03-15
EP0636258B1 (de) 1996-03-27
US5459690A (en) 1995-10-17
KR950701125A (ko) 1995-02-20
TW223685B (ko) 1994-05-11
EP0636258A1 (de) 1995-02-01
JP3129440B2 (ja) 2001-01-29
JPH07502361A (ja) 1995-03-09
DE59205881D1 (de) 1996-05-02

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)