GR860771B - Dielectric compositions - Google Patents

Dielectric compositions

Info

Publication number
GR860771B
GR860771B GR860771A GR860100771A GR860771B GR 860771 B GR860771 B GR 860771B GR 860771 A GR860771 A GR 860771A GR 860100771 A GR860100771 A GR 860100771A GR 860771 B GR860771 B GR 860771B
Authority
GR
Greece
Prior art keywords
dielectric compositions
dielectric
compositions
Prior art date
Application number
GR860771A
Other languages
English (en)
Inventor
Steinberg Irwin Jerry
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of GR860771B publication Critical patent/GR860771B/el

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C12/00—Powdered glass; Bead compositions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/102—Glass compositions containing silica with 40% to 90% silica, by weight containing lead
    • C03C3/105—Glass compositions containing silica with 40% to 90% silica, by weight containing lead containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/102—Glass compositions containing silica with 40% to 90% silica, by weight containing lead
    • C03C3/108—Glass compositions containing silica with 40% to 90% silica, by weight containing lead containing boron
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Insulating Materials (AREA)
  • Glass Compositions (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GR860771A 1985-03-25 1986-03-21 Dielectric compositions GR860771B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/715,971 US4654095A (en) 1985-03-25 1985-03-25 Dielectric composition

Publications (1)

Publication Number Publication Date
GR860771B true GR860771B (en) 1986-07-21

Family

ID=24876207

Family Applications (1)

Application Number Title Priority Date Filing Date
GR860771A GR860771B (en) 1985-03-25 1986-03-21 Dielectric compositions

Country Status (9)

Country Link
US (1) US4654095A (el)
EP (1) EP0196035B1 (el)
JP (1) JPH0697565B2 (el)
KR (1) KR940005417B1 (el)
CN (1) CN1006424B (el)
CA (1) CA1278182C (el)
DE (1) DE3676726D1 (el)
DK (1) DK162127C (el)
GR (1) GR860771B (el)

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US4806188A (en) * 1988-03-04 1989-02-21 E. I. Du Pont De Nemours And Company Method for fabricating multilayer circuits
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US5258335A (en) * 1988-10-14 1993-11-02 Ferro Corporation Low dielectric, low temperature fired glass ceramics
US5164342A (en) * 1988-10-14 1992-11-17 Ferro Corporation Low dielectric, low temperature fired glass ceramics
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JP3860336B2 (ja) 1998-04-28 2006-12-20 日本特殊陶業株式会社 ガラスセラミック複合体
US6174829B1 (en) 1999-01-07 2001-01-16 Advanced Ceramic X Corp. Ceramic dielectric compositions
US6159883A (en) * 1999-01-07 2000-12-12 Advanced Ceramic X Corp. Ceramic dielectric compositions
US6218005B1 (en) * 1999-04-01 2001-04-17 3M Innovative Properties Company Tapes for heat sealing substrates
US6194124B1 (en) 1999-08-12 2001-02-27 E. I. Du Pont De Nemours And Company Photosensitive ceramic compositions containing polycarbonate polymers
US6639508B1 (en) 1999-09-22 2003-10-28 Aptek Williams, Inc. Electrical switch device and process for manufacturing same
JP4160901B2 (ja) 2001-10-01 2008-10-08 ヘラエウス インコーポレイテッド マイクロエレクトロニクス用自己拘束型非焼結低温ガラスセラミックテープ及びその製法ならびに用途
US6615931B2 (en) * 2002-01-07 2003-09-09 Boart Longyear Co. Continuous feed drilling system
US7381283B2 (en) * 2002-03-07 2008-06-03 Yageo Corporation Method for reducing shrinkage during sintering low-temperature-cofired ceramics
US6827800B2 (en) * 2003-01-30 2004-12-07 E. I. Du Pont De Nemours And Company Process for the constrained sintering of asymmetrically configured dielectric layers
US6893710B2 (en) * 2003-04-18 2005-05-17 Yageo Corporation Multilayer ceramic composition
US7261841B2 (en) * 2003-11-19 2007-08-28 E. I. Du Pont De Nemours And Company Thick film conductor case compositions for LTCC tape
JP2005213058A (ja) * 2004-01-27 2005-08-11 Lintec Corp 誘電体層用組成物、グリーンシート、誘電体層形成基板およびその製造方法
KR100670595B1 (ko) * 2004-03-24 2007-01-17 삼성광주전자 주식회사 업라이트 청소기
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US20060027307A1 (en) * 2004-08-03 2006-02-09 Bidwell Larry A Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein
US7731812B2 (en) * 2004-10-19 2010-06-08 E.I. Du Pont De Nemours And Company Thick film conductor case compositions for LTCC tape
US7175724B2 (en) * 2004-11-22 2007-02-13 E. I. Du Pont De Nemours And Company Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure
US7068492B2 (en) * 2004-11-22 2006-06-27 E. I. Du Pont De Nemours And Company Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure
US7067026B2 (en) * 2004-11-22 2006-06-27 E. I. Du Pont De Nemours And Company Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure
US20060110602A1 (en) * 2004-11-22 2006-05-25 Wang Carl B Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure
US20060162844A1 (en) 2005-01-26 2006-07-27 Needes Christopher R Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof
US20060163768A1 (en) * 2005-01-26 2006-07-27 Needes Christopher R Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof
US7326367B2 (en) * 2005-04-25 2008-02-05 E.I. Du Pont De Nemours And Company Thick film conductor paste compositions for LTCC tape in microwave applications
US7611645B2 (en) 2005-04-25 2009-11-03 E. I. Du Pont De Nemours And Company Thick film conductor compositions and the use thereof in LTCC circuits and devices
US20070023388A1 (en) * 2005-07-28 2007-02-01 Nair Kumaran M Conductor composition for use in LTCC photosensitive tape on substrate applications
US7550319B2 (en) * 2005-09-01 2009-06-23 E. I. Du Pont De Nemours And Company Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
US20070060970A1 (en) 2005-09-15 2007-03-15 Burdon Jeremy W Miniaturized co-fired electrical interconnects for implantable medical devices
US7740725B2 (en) * 2006-04-05 2010-06-22 E.I. Du Pont De Nemours And Company Thick film conductor paste composition for LTCC tape in microwave applications
JP2009540608A (ja) * 2006-06-16 2009-11-19 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 表面回路パターンを備えた低温同時焼成セラミックの無加圧拘束焼結のための改善プロセス
US20080079779A1 (en) * 2006-09-28 2008-04-03 Robert Lee Cornell Method for Improving Thermal Conductivity in Micro-Fluid Ejection Heads
CN101740160B (zh) * 2009-11-20 2011-06-08 湖南利德电子浆料有限公司 金属铝基板厚膜电路用介质浆料及其制备方法
WO2011082213A1 (en) * 2009-12-31 2011-07-07 E.I. Du Pont De Nemours And Company Mixed-metal system conductors for use in low-temperature co-fired ceramic circuits and devices
US20130052433A1 (en) 2011-08-29 2013-02-28 E I Du Pont De Nemours And Company Compositions for low k, low temperature co-fired composite (ltcc) tapes and low shrinkage, multi-layer ltcc structures formed therefrom
CN104253884A (zh) * 2013-06-28 2014-12-31 深圳富泰宏精密工业有限公司 外壳及其制造方法

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Also Published As

Publication number Publication date
JPH0697565B2 (ja) 1994-11-30
US4654095A (en) 1987-03-31
EP0196035B1 (en) 1991-01-09
EP0196035A3 (en) 1988-08-17
EP0196035A2 (en) 1986-10-01
CA1278182C (en) 1990-12-27
DE3676726D1 (de) 1991-02-14
DK135086A (da) 1986-09-26
DK162127C (da) 1992-02-17
JPS61220203A (ja) 1986-09-30
KR940005417B1 (ko) 1994-06-18
CN86101812A (zh) 1986-10-01
CN1006424B (zh) 1990-01-10
KR860007344A (ko) 1986-10-10
DK162127B (da) 1991-09-16
DK135086D0 (da) 1986-03-24

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