DE3676726D1 - Dielektrische zusammensetzung. - Google Patents
Dielektrische zusammensetzung.Info
- Publication number
- DE3676726D1 DE3676726D1 DE8686103951T DE3676726T DE3676726D1 DE 3676726 D1 DE3676726 D1 DE 3676726D1 DE 8686103951 T DE8686103951 T DE 8686103951T DE 3676726 T DE3676726 T DE 3676726T DE 3676726 D1 DE3676726 D1 DE 3676726D1
- Authority
- DE
- Germany
- Prior art keywords
- dielectric composition
- dielectric
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C12/00—Powdered glass; Bead compositions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/102—Glass compositions containing silica with 40% to 90% silica, by weight containing lead
- C03C3/105—Glass compositions containing silica with 40% to 90% silica, by weight containing lead containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/102—Glass compositions containing silica with 40% to 90% silica, by weight containing lead
- C03C3/108—Glass compositions containing silica with 40% to 90% silica, by weight containing lead containing boron
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Insulating Materials (AREA)
- Glass Compositions (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/715,971 US4654095A (en) | 1985-03-25 | 1985-03-25 | Dielectric composition |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3676726D1 true DE3676726D1 (de) | 1991-02-14 |
Family
ID=24876207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686103951T Expired - Lifetime DE3676726D1 (de) | 1985-03-25 | 1986-03-22 | Dielektrische zusammensetzung. |
Country Status (9)
Country | Link |
---|---|
US (1) | US4654095A (de) |
EP (1) | EP0196035B1 (de) |
JP (1) | JPH0697565B2 (de) |
KR (1) | KR940005417B1 (de) |
CN (1) | CN1006424B (de) |
CA (1) | CA1278182C (de) |
DE (1) | DE3676726D1 (de) |
DK (1) | DK162127C (de) |
GR (1) | GR860771B (de) |
Families Citing this family (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS628512A (ja) * | 1985-07-04 | 1987-01-16 | 株式会社村田製作所 | Lc複合部品 |
US4766671A (en) * | 1985-10-29 | 1988-08-30 | Nec Corporation | Method of manufacturing ceramic electronic device |
US4795512A (en) * | 1986-02-26 | 1989-01-03 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a multilayer ceramic body |
US5068210A (en) * | 1986-04-18 | 1991-11-26 | Tektronix, Inc. | Low dielectric constant ceramic materials |
US4808673A (en) * | 1986-10-02 | 1989-02-28 | General Electric Company | Dielectric inks for multilayer copper circuits |
JPS63107095A (ja) * | 1986-10-23 | 1988-05-12 | 富士通株式会社 | 多層セラミツク回路基板 |
US4935844A (en) * | 1987-01-13 | 1990-06-19 | Ian Burn | Low dielectric constant compositions |
US4879261A (en) * | 1987-01-13 | 1989-11-07 | E. I. Du Pont De Nemours And Company | Low Dielectric constant compositions |
JPS63181400A (ja) * | 1987-01-22 | 1988-07-26 | 松下電器産業株式会社 | セラミツク多層基板 |
WO1989001461A1 (en) * | 1987-08-13 | 1989-02-23 | Ceramics Process Systems Corporation | Co-sinterable metal-ceramic packages and materials therefor |
US4799984A (en) * | 1987-09-18 | 1989-01-24 | E. I. Du Pont De Nemours And Company | Method for fabricating multilayer circuits |
US4849379A (en) * | 1988-01-28 | 1989-07-18 | E. I. Du Pont De Nemours And Company | Dielectric composition |
US4806188A (en) * | 1988-03-04 | 1989-02-21 | E. I. Du Pont De Nemours And Company | Method for fabricating multilayer circuits |
US5120579A (en) * | 1988-07-19 | 1992-06-09 | Ferro Corporation | Dielectric compositions |
US5070047A (en) * | 1988-07-19 | 1991-12-03 | Ferro Corporation | Dielectric compositions |
US4961998A (en) * | 1988-09-23 | 1990-10-09 | National Starch And Chemical Investment Holding Corporation | Dielectric composition having controlled thermal expansion |
US5258335A (en) * | 1988-10-14 | 1993-11-02 | Ferro Corporation | Low dielectric, low temperature fired glass ceramics |
US5164342A (en) * | 1988-10-14 | 1992-11-17 | Ferro Corporation | Low dielectric, low temperature fired glass ceramics |
US5002903A (en) * | 1988-12-01 | 1991-03-26 | Ferro Corporation | Porcelain enameled metal substrates |
US4953751A (en) * | 1989-03-30 | 1990-09-04 | Abc/Sebrn Techcorp. | Overflow prevention for soft drink dispensers |
US5071794A (en) * | 1989-08-04 | 1991-12-10 | Ferro Corporation | Porous dielectric compositions |
US5024975A (en) * | 1989-10-19 | 1991-06-18 | E. I. Du Pont De Nemours And Co., Inc. | Crystallizable, low dielectric constant, low dielectric loss composition |
US5006182A (en) * | 1989-11-17 | 1991-04-09 | E. I. Du Pont De Nemours And Company | Method for fabricating multilayer circuits |
US5254191A (en) * | 1990-10-04 | 1993-10-19 | E. I. Du Pont De Nemours And Company | Method for reducing shrinkage during firing of ceramic bodies |
US5137848A (en) * | 1990-12-13 | 1992-08-11 | E. I. Du Pont De Nemours And Company | Dielectric composition containing kerf additive |
JPH05254923A (ja) * | 1992-03-10 | 1993-10-05 | Hitachi Ltd | セラミック組成物及びセラミック回路基板 |
US5270268A (en) * | 1992-09-23 | 1993-12-14 | Aluminum Company Of America | Aluminum borate devitrification inhibitor in low dielectric borosilicate glass |
JP2822846B2 (ja) * | 1992-10-29 | 1998-11-11 | 関西日本電気株式会社 | ガラス−セラミック複合体を用いた水晶振動子用フラットパッケージおよびこれを用いた水晶振動子 |
US5468694A (en) * | 1992-11-21 | 1995-11-21 | Yamamura Glass Co. Ltd. | Composition for producing low temperature co-fired substrate |
US5780375A (en) * | 1993-10-19 | 1998-07-14 | E. I. Du Pont De Nemours And Company | Thick film composition for modifying the electrical properties of a dielectric layer |
US5431718A (en) * | 1994-07-05 | 1995-07-11 | Motorola, Inc. | High adhesion, solderable, metallization materials |
US5821181A (en) * | 1996-04-08 | 1998-10-13 | Motorola Inc. | Ceramic composition |
DE19630883A1 (de) * | 1996-07-31 | 1998-02-05 | Philips Patentverwaltung | Bauteil mit einem Kondensator |
JP3904102B2 (ja) * | 1997-08-06 | 2007-04-11 | 日本電気硝子株式会社 | プラズマディスプレーパネル用誘電体形成材料 |
JP3860336B2 (ja) * | 1998-04-28 | 2006-12-20 | 日本特殊陶業株式会社 | ガラスセラミック複合体 |
US6174829B1 (en) | 1999-01-07 | 2001-01-16 | Advanced Ceramic X Corp. | Ceramic dielectric compositions |
US6159883A (en) * | 1999-01-07 | 2000-12-12 | Advanced Ceramic X Corp. | Ceramic dielectric compositions |
US6218005B1 (en) * | 1999-04-01 | 2001-04-17 | 3M Innovative Properties Company | Tapes for heat sealing substrates |
US6194124B1 (en) | 1999-08-12 | 2001-02-27 | E. I. Du Pont De Nemours And Company | Photosensitive ceramic compositions containing polycarbonate polymers |
US6639508B1 (en) | 1999-09-22 | 2003-10-28 | Aptek Williams, Inc. | Electrical switch device and process for manufacturing same |
EP1432664B1 (de) | 2001-10-01 | 2007-06-13 | Heraeus, Incorporated | Ungesintertes niedertemperaturglaskeramikband für elektronische mikrobauteile, verfahren zur herstellung und verwendung |
US6615931B2 (en) * | 2002-01-07 | 2003-09-09 | Boart Longyear Co. | Continuous feed drilling system |
US7381283B2 (en) * | 2002-03-07 | 2008-06-03 | Yageo Corporation | Method for reducing shrinkage during sintering low-temperature-cofired ceramics |
US6827800B2 (en) * | 2003-01-30 | 2004-12-07 | E. I. Du Pont De Nemours And Company | Process for the constrained sintering of asymmetrically configured dielectric layers |
US6893710B2 (en) * | 2003-04-18 | 2005-05-17 | Yageo Corporation | Multilayer ceramic composition |
US7303698B2 (en) * | 2003-11-19 | 2007-12-04 | E.I. Du Pont De Nemours And Company | Thick film conductor case compositions for LTCC tape |
JP2005213058A (ja) * | 2004-01-27 | 2005-08-11 | Lintec Corp | 誘電体層用組成物、グリーンシート、誘電体層形成基板およびその製造方法 |
KR100670595B1 (ko) * | 2004-03-24 | 2007-01-17 | 삼성광주전자 주식회사 | 업라이트 청소기 |
US20060009036A1 (en) * | 2004-07-12 | 2006-01-12 | Bacher Rudolph J | High thermal cycle conductor system |
US20060027307A1 (en) * | 2004-08-03 | 2006-02-09 | Bidwell Larry A | Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein |
US7731812B2 (en) * | 2004-10-19 | 2010-06-08 | E.I. Du Pont De Nemours And Company | Thick film conductor case compositions for LTCC tape |
US20060110602A1 (en) * | 2004-11-22 | 2006-05-25 | Wang Carl B | Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure |
US7068492B2 (en) * | 2004-11-22 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure |
US7067026B2 (en) * | 2004-11-22 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure |
US7175724B2 (en) * | 2004-11-22 | 2007-02-13 | E. I. Du Pont De Nemours And Company | Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure |
US20060163768A1 (en) | 2005-01-26 | 2006-07-27 | Needes Christopher R | Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof |
US20060162844A1 (en) * | 2005-01-26 | 2006-07-27 | Needes Christopher R | Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof |
US7326367B2 (en) * | 2005-04-25 | 2008-02-05 | E.I. Du Pont De Nemours And Company | Thick film conductor paste compositions for LTCC tape in microwave applications |
US7611645B2 (en) * | 2005-04-25 | 2009-11-03 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions and the use thereof in LTCC circuits and devices |
US20070023388A1 (en) * | 2005-07-28 | 2007-02-01 | Nair Kumaran M | Conductor composition for use in LTCC photosensitive tape on substrate applications |
US7550319B2 (en) * | 2005-09-01 | 2009-06-23 | E. I. Du Pont De Nemours And Company | Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
US20070060970A1 (en) | 2005-09-15 | 2007-03-15 | Burdon Jeremy W | Miniaturized co-fired electrical interconnects for implantable medical devices |
US7740725B2 (en) * | 2006-04-05 | 2010-06-22 | E.I. Du Pont De Nemours And Company | Thick film conductor paste composition for LTCC tape in microwave applications |
US20110027539A1 (en) * | 2006-06-16 | 2011-02-03 | E.I. Du Pont De Nemours And Company | Improved process for pressureless constrained sintering of low temperature co-fired ceramic with surface circuit patterns |
US20080079779A1 (en) * | 2006-09-28 | 2008-04-03 | Robert Lee Cornell | Method for Improving Thermal Conductivity in Micro-Fluid Ejection Heads |
CN101740160B (zh) * | 2009-11-20 | 2011-06-08 | 湖南利德电子浆料有限公司 | 金属铝基板厚膜电路用介质浆料及其制备方法 |
JP2013516771A (ja) | 2009-12-31 | 2013-05-13 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 低温同時焼成セラミックの回路およびデバイスで使用するための混合金属システム導体 |
US20130052433A1 (en) | 2011-08-29 | 2013-02-28 | E I Du Pont De Nemours And Company | Compositions for low k, low temperature co-fired composite (ltcc) tapes and low shrinkage, multi-layer ltcc structures formed therefrom |
CN104253884A (zh) * | 2013-06-28 | 2014-12-31 | 深圳富泰宏精密工业有限公司 | 外壳及其制造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3089787A (en) * | 1959-12-07 | 1963-05-14 | Westinghouse Electric Corp | Electrical insulating coating composition, method, and coated article |
US3540894A (en) * | 1967-03-29 | 1970-11-17 | Ibm | Eutectic lead bisilicate ceramic compositions and fired ceramic bodies |
US3832192A (en) * | 1969-09-05 | 1974-08-27 | Ibm | Ceramic dielectric porcelains |
US3717487A (en) * | 1970-06-17 | 1973-02-20 | Sprague Electric Co | Ceramic slip composition |
US3988405A (en) * | 1971-04-07 | 1976-10-26 | Smith Robert D | Process for forming thin walled articles or thin sheets |
GB1341513A (de) * | 1971-06-30 | 1973-12-25 | ||
US3857923A (en) * | 1972-06-20 | 1974-12-31 | Ibm | Mullite package for integrated circuit devices |
US4039338A (en) * | 1972-12-29 | 1977-08-02 | International Business Machines Corporation | Accelerated sintering for a green ceramic sheet |
US3975201A (en) * | 1973-11-15 | 1976-08-17 | Owens-Illinois, Inc. | Vehicle and printing pastes for use in the manufacture of microelectronic packages |
US3962162A (en) * | 1974-02-19 | 1976-06-08 | Minnesota Mining And Manufacturing Company | Rigidly bonded green ceramics and processes |
DE2517743C3 (de) * | 1975-04-22 | 1980-03-06 | Jenaer Glaswerk Schott & Gen., 6500 Mainz | Passivierender Schutzüberzug für Siliziumhalbleiterbauelemente |
US4104345A (en) * | 1975-06-23 | 1978-08-01 | International Business Machines Corporation | Ceramic dielectrics |
US4183991A (en) * | 1977-05-02 | 1980-01-15 | Rohm And Haas Company | Process for preparing highly filled acrylic articles |
JPS6054721B2 (ja) * | 1977-12-15 | 1985-12-02 | 日本電気株式会社 | 絶縁体形成用ペースト組成物 |
US4301324A (en) * | 1978-02-06 | 1981-11-17 | International Business Machines Corporation | Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper |
US4272500A (en) * | 1978-05-08 | 1981-06-09 | International Business Machines Corporation | Process for forming mullite |
US4405722A (en) * | 1979-01-23 | 1983-09-20 | Asahi Glass Company Ltd. | Sealing glass compositions |
CA1165336A (en) * | 1980-07-31 | 1984-04-10 | Robert A. Rita | Non-crystallizing sealing glass composition |
JPS60221358A (ja) * | 1984-04-13 | 1985-11-06 | 日本碍子株式会社 | 電気絶縁体用セラミック組成物 |
-
1985
- 1985-03-25 US US06/715,971 patent/US4654095A/en not_active Expired - Lifetime
-
1986
- 1986-03-20 CN CN86101812A patent/CN1006424B/zh not_active Expired
- 1986-03-20 CA CA000504599A patent/CA1278182C/en not_active Expired - Lifetime
- 1986-03-21 GR GR860771A patent/GR860771B/el unknown
- 1986-03-22 EP EP86103951A patent/EP0196035B1/de not_active Expired - Lifetime
- 1986-03-22 DE DE8686103951T patent/DE3676726D1/de not_active Expired - Lifetime
- 1986-03-24 JP JP61064268A patent/JPH0697565B2/ja not_active Expired - Lifetime
- 1986-03-24 KR KR1019860002161A patent/KR940005417B1/ko not_active IP Right Cessation
- 1986-03-24 DK DK135086A patent/DK162127C/da not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DK162127B (da) | 1991-09-16 |
CA1278182C (en) | 1990-12-27 |
EP0196035B1 (de) | 1991-01-09 |
EP0196035A3 (en) | 1988-08-17 |
US4654095A (en) | 1987-03-31 |
EP0196035A2 (de) | 1986-10-01 |
GR860771B (en) | 1986-07-21 |
CN1006424B (zh) | 1990-01-10 |
KR860007344A (ko) | 1986-10-10 |
DK135086A (da) | 1986-09-26 |
JPS61220203A (ja) | 1986-09-30 |
JPH0697565B2 (ja) | 1994-11-30 |
CN86101812A (zh) | 1986-10-01 |
DK135086D0 (da) | 1986-03-24 |
DK162127C (da) | 1992-02-17 |
KR940005417B1 (ko) | 1994-06-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |