GR3019723T3 - Resin material for inserting a lead frame and a molded component thereof - Google Patents

Resin material for inserting a lead frame and a molded component thereof

Info

Publication number
GR3019723T3
GR3019723T3 GR960401108T GR960401108T GR3019723T3 GR 3019723 T3 GR3019723 T3 GR 3019723T3 GR 960401108 T GR960401108 T GR 960401108T GR 960401108 T GR960401108 T GR 960401108T GR 3019723 T3 GR3019723 T3 GR 3019723T3
Authority
GR
Greece
Prior art keywords
lead frame
resin material
weight
parts
molded component
Prior art date
Application number
GR960401108T
Other languages
English (en)
Inventor
Mikio Nakai
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Publication of GR3019723T3 publication Critical patent/GR3019723T3/el

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/04—Polysulfides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/251—Mica
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers

Landscapes

  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Details Of Resistors (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
  • Road Signs Or Road Markings (AREA)
  • Sawing (AREA)
GR960401108T 1989-12-27 1996-04-23 Resin material for inserting a lead frame and a molded component thereof GR3019723T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34468689 1989-12-27

Publications (1)

Publication Number Publication Date
GR3019723T3 true GR3019723T3 (en) 1996-07-31

Family

ID=18371196

Family Applications (1)

Application Number Title Priority Date Filing Date
GR960401108T GR3019723T3 (en) 1989-12-27 1996-04-23 Resin material for inserting a lead frame and a molded component thereof

Country Status (10)

Country Link
US (1) US5160786A (el)
EP (1) EP0435648B1 (el)
JP (1) JPH0828444B2 (el)
KR (1) KR940003263B1 (el)
AT (1) ATE134071T1 (el)
CA (1) CA2032962A1 (el)
DE (1) DE69025303T2 (el)
DK (1) DK0435648T3 (el)
ES (1) ES2083440T3 (el)
GR (1) GR3019723T3 (el)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9200440A (nl) * 1992-03-10 1993-10-01 Gen Electric Polymeermengsel met polyaryleensulfide, elastomeer polymeer en metaalzout.
US5990225A (en) * 1995-05-17 1999-11-23 Mitsubishi Chemical Corporation Resin of polyphenylene sulfide, polyethylene graft and TFE for sliding member
US5998876A (en) * 1997-12-30 1999-12-07 International Business Machines Corporation Reworkable thermoplastic hyper-branched encapsulant
US6111323A (en) 1997-12-30 2000-08-29 International Business Machines Corporation Reworkable thermoplastic encapsulant
JP2002301737A (ja) * 2001-04-06 2002-10-15 Idemitsu Petrochem Co Ltd 金属インサート樹脂成形体の製造方法及び半導体装置
JP6132669B2 (ja) * 2013-06-11 2017-05-24 ポリプラスチックス株式会社 金属樹脂複合成形体及びその製造方法
EP3932979A4 (en) * 2019-02-25 2022-12-28 Kuraray Co., Ltd. WATERPROOF ELEMENT, ELECTRONIC EQUIPMENT COMPRISING SUCH WATERPROOF ELEMENT, METHOD OF SEALING BY MEANS OF AN INSERT MOLDED BODY, AND METHOD OF SEALING FOR ELECTRONIC EQUIPMENT
WO2020175389A1 (ja) * 2019-02-25 2020-09-03 株式会社クラレ 防水部品およびそれを備えた電子機器、インサート成形体を用いる防水方法ならびに電子機器の防水方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
US4482665A (en) * 1982-09-14 1984-11-13 Phillips Petroleum Company Encapsulation of electronic components with calcium silicate-containing poly(arylene sulfide) compositions
JPS59207921A (ja) * 1983-05-13 1984-11-26 Dainippon Ink & Chem Inc 熱可塑性樹脂組成物
US4748169A (en) * 1985-01-16 1988-05-31 Dainippon Ink And Chemicals, Inc. Polyarylene sulfide resin composition
JPH0713186B2 (ja) * 1985-03-26 1995-02-15 大日本インキ化学工業株式会社 電子部品封止用樹脂組成物
JP2615550B2 (ja) * 1985-09-17 1997-05-28 大日本インキ化学工業株式会社 樹脂封止電子部品
JPH0739546B2 (ja) * 1986-04-14 1995-05-01 大日本インキ化学工業株式会社 成形用ポリフエニレンスルフイド樹脂組成物
JPS62253656A (ja) * 1986-04-28 1987-11-05 Kureha Chem Ind Co Ltd ポリアリ−レンチオエ−テル成形物

Also Published As

Publication number Publication date
DK0435648T3 (da) 1996-06-10
KR910012086A (ko) 1991-08-07
JPH04123461A (ja) 1992-04-23
ATE134071T1 (de) 1996-02-15
EP0435648A2 (en) 1991-07-03
ES2083440T3 (es) 1996-04-16
DE69025303T2 (de) 1996-07-11
DE69025303D1 (de) 1996-03-21
US5160786A (en) 1992-11-03
EP0435648B1 (en) 1996-02-07
JPH0828444B2 (ja) 1996-03-21
EP0435648A3 (en) 1991-09-11
KR940003263B1 (ko) 1994-04-16
CA2032962A1 (en) 1991-06-28

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