DE69025303D1 - Harzmaterial zum Einfügen eines Leiterrahmens und damit vergossenes Bauelement - Google Patents

Harzmaterial zum Einfügen eines Leiterrahmens und damit vergossenes Bauelement

Info

Publication number
DE69025303D1
DE69025303D1 DE69025303T DE69025303T DE69025303D1 DE 69025303 D1 DE69025303 D1 DE 69025303D1 DE 69025303 T DE69025303 T DE 69025303T DE 69025303 T DE69025303 T DE 69025303T DE 69025303 D1 DE69025303 D1 DE 69025303D1
Authority
DE
Germany
Prior art keywords
lead frame
resin material
weight
parts
potted component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69025303T
Other languages
English (en)
Other versions
DE69025303T2 (de
Inventor
Mikio Nakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyplastics Co Ltd
Original Assignee
Polyplastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co Ltd filed Critical Polyplastics Co Ltd
Publication of DE69025303D1 publication Critical patent/DE69025303D1/de
Application granted granted Critical
Publication of DE69025303T2 publication Critical patent/DE69025303T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/04—Polysulfides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/251—Mica
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers

Landscapes

  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
  • Road Signs Or Road Markings (AREA)
  • Sawing (AREA)
DE69025303T 1989-12-27 1990-12-24 Harzmaterial zum Einfügen eines Leiterrahmens und damit vergossenes Bauelement Expired - Fee Related DE69025303T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34468689 1989-12-27

Publications (2)

Publication Number Publication Date
DE69025303D1 true DE69025303D1 (de) 1996-03-21
DE69025303T2 DE69025303T2 (de) 1996-07-11

Family

ID=18371196

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69025303T Expired - Fee Related DE69025303T2 (de) 1989-12-27 1990-12-24 Harzmaterial zum Einfügen eines Leiterrahmens und damit vergossenes Bauelement

Country Status (10)

Country Link
US (1) US5160786A (de)
EP (1) EP0435648B1 (de)
JP (1) JPH0828444B2 (de)
KR (1) KR940003263B1 (de)
AT (1) ATE134071T1 (de)
CA (1) CA2032962A1 (de)
DE (1) DE69025303T2 (de)
DK (1) DK0435648T3 (de)
ES (1) ES2083440T3 (de)
GR (1) GR3019723T3 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9200440A (nl) * 1992-03-10 1993-10-01 Gen Electric Polymeermengsel met polyaryleensulfide, elastomeer polymeer en metaalzout.
US5990225A (en) * 1995-05-17 1999-11-23 Mitsubishi Chemical Corporation Resin of polyphenylene sulfide, polyethylene graft and TFE for sliding member
US5998876A (en) * 1997-12-30 1999-12-07 International Business Machines Corporation Reworkable thermoplastic hyper-branched encapsulant
US6111323A (en) * 1997-12-30 2000-08-29 International Business Machines Corporation Reworkable thermoplastic encapsulant
JP2002301737A (ja) * 2001-04-06 2002-10-15 Idemitsu Petrochem Co Ltd 金属インサート樹脂成形体の製造方法及び半導体装置
JP6132669B2 (ja) * 2013-06-11 2017-05-24 ポリプラスチックス株式会社 金属樹脂複合成形体及びその製造方法
JPWO2020175390A1 (de) * 2019-02-25 2020-09-03
US20220177700A1 (en) * 2019-02-25 2022-06-09 Kuraray Co., Ltd. Waterproof component, electronic equipment comprising same, waterproofing method using insert-molded body, and waterproofing method for electronic equipment

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
US4482665A (en) * 1982-09-14 1984-11-13 Phillips Petroleum Company Encapsulation of electronic components with calcium silicate-containing poly(arylene sulfide) compositions
JPS59207921A (ja) * 1983-05-13 1984-11-26 Dainippon Ink & Chem Inc 熱可塑性樹脂組成物
US4748169A (en) * 1985-01-16 1988-05-31 Dainippon Ink And Chemicals, Inc. Polyarylene sulfide resin composition
JPH0713186B2 (ja) * 1985-03-26 1995-02-15 大日本インキ化学工業株式会社 電子部品封止用樹脂組成物
JP2615550B2 (ja) * 1985-09-17 1997-05-28 大日本インキ化学工業株式会社 樹脂封止電子部品
JPH0739546B2 (ja) * 1986-04-14 1995-05-01 大日本インキ化学工業株式会社 成形用ポリフエニレンスルフイド樹脂組成物
JPS62253656A (ja) * 1986-04-28 1987-11-05 Kureha Chem Ind Co Ltd ポリアリ−レンチオエ−テル成形物

Also Published As

Publication number Publication date
ATE134071T1 (de) 1996-02-15
JPH0828444B2 (ja) 1996-03-21
EP0435648A3 (en) 1991-09-11
US5160786A (en) 1992-11-03
ES2083440T3 (es) 1996-04-16
JPH04123461A (ja) 1992-04-23
GR3019723T3 (en) 1996-07-31
CA2032962A1 (en) 1991-06-28
EP0435648A2 (de) 1991-07-03
DE69025303T2 (de) 1996-07-11
EP0435648B1 (de) 1996-02-07
KR940003263B1 (ko) 1994-04-16
KR910012086A (ko) 1991-08-07
DK0435648T3 (da) 1996-06-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee