KR910012086A - 리이드 프레임 삽입용 수지재료와 그 성형부품 - Google Patents

리이드 프레임 삽입용 수지재료와 그 성형부품

Info

Publication number
KR910012086A
KR910012086A KR1019900021034A KR900021034A KR910012086A KR 910012086 A KR910012086 A KR 910012086A KR 1019900021034 A KR1019900021034 A KR 1019900021034A KR 900021034 A KR900021034 A KR 900021034A KR 910012086 A KR910012086 A KR 910012086A
Authority
KR
South Korea
Prior art keywords
resin material
parts
weight
lead frame
anhydride
Prior art date
Application number
KR1019900021034A
Other languages
English (en)
Other versions
KR940003263B1 (ko
Inventor
미끼오 나까이
Original Assignee
고니시 히꼬이찌
폴리 플라스틱스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고니시 히꼬이찌, 폴리 플라스틱스 가부시끼가이샤 filed Critical 고니시 히꼬이찌
Publication of KR910012086A publication Critical patent/KR910012086A/ko
Application granted granted Critical
Publication of KR940003263B1 publication Critical patent/KR940003263B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/04—Polysulfides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/251—Mica
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers

Landscapes

  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
  • Road Signs Or Road Markings (AREA)
  • Sawing (AREA)

Abstract

내용 없음.

Description

리이드 프레임 삽입용 수지재료와 그 성형부품
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. (A) 폴리아릴렌 설파이드 100중량부, (B) 불포화 카르복실산 또는 그 무수물을 가지고 그래프트 공중합한 α-올레핀 공중합체 0.1 내지 30중량부, (C) 섬유상충전재, 비섬유상무기 충전재 또는 그 혼합물 10 내지 300중량부로 이루어진 리이드 프레임 삽입용 수지재료.
  2. 청구범위 제1항에 있어서, 성분(B)를 구하는 불포화 카르복실산 또는 그 무수물이 무수 말레인산인 리이드 프레임 삽입용 수지재료.
  3. 청구범위 제1항에 있어서, 성분(B)를 구성하는 α-올레핀 공중합체가 에틸렌/에틸아크릴레이트 수지인 리이드 프레임 삽입용 수지재료.
  4. 청구범위 제1항에 있어서, 성분(C)가 유리섬유와 함께 분말 운모 탈크, 유리비드 1종이상이 결합하여 이루어진 리이드 프레임 삽입용 수지재료.
  5. 청구범위 제1항 내지 제4항중 어느 한항에 따른 수지재료와 삽입된 리이드 프레임으로 이루어진 성형부품.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900021034A 1989-12-27 1990-12-19 리이드 프레임 삽입용 수지재료와 그 성형부품 KR940003263B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP34468689 1989-12-27
JP01-344686 1989-12-27

Publications (2)

Publication Number Publication Date
KR910012086A true KR910012086A (ko) 1991-08-07
KR940003263B1 KR940003263B1 (ko) 1994-04-16

Family

ID=18371196

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900021034A KR940003263B1 (ko) 1989-12-27 1990-12-19 리이드 프레임 삽입용 수지재료와 그 성형부품

Country Status (10)

Country Link
US (1) US5160786A (ko)
EP (1) EP0435648B1 (ko)
JP (1) JPH0828444B2 (ko)
KR (1) KR940003263B1 (ko)
AT (1) ATE134071T1 (ko)
CA (1) CA2032962A1 (ko)
DE (1) DE69025303T2 (ko)
DK (1) DK0435648T3 (ko)
ES (1) ES2083440T3 (ko)
GR (1) GR3019723T3 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9200440A (nl) * 1992-03-10 1993-10-01 Gen Electric Polymeermengsel met polyaryleensulfide, elastomeer polymeer en metaalzout.
US5990225A (en) * 1995-05-17 1999-11-23 Mitsubishi Chemical Corporation Resin of polyphenylene sulfide, polyethylene graft and TFE for sliding member
US5998876A (en) * 1997-12-30 1999-12-07 International Business Machines Corporation Reworkable thermoplastic hyper-branched encapsulant
US6111323A (en) * 1997-12-30 2000-08-29 International Business Machines Corporation Reworkable thermoplastic encapsulant
JP2002301737A (ja) * 2001-04-06 2002-10-15 Idemitsu Petrochem Co Ltd 金属インサート樹脂成形体の製造方法及び半導体装置
JP6132669B2 (ja) * 2013-06-11 2017-05-24 ポリプラスチックス株式会社 金属樹脂複合成形体及びその製造方法
JPWO2020175390A1 (ko) * 2019-02-25 2020-09-03
US20220177700A1 (en) * 2019-02-25 2022-06-09 Kuraray Co., Ltd. Waterproof component, electronic equipment comprising same, waterproofing method using insert-molded body, and waterproofing method for electronic equipment

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
US4482665A (en) * 1982-09-14 1984-11-13 Phillips Petroleum Company Encapsulation of electronic components with calcium silicate-containing poly(arylene sulfide) compositions
JPS59207921A (ja) * 1983-05-13 1984-11-26 Dainippon Ink & Chem Inc 熱可塑性樹脂組成物
US4748169A (en) * 1985-01-16 1988-05-31 Dainippon Ink And Chemicals, Inc. Polyarylene sulfide resin composition
JPH0713186B2 (ja) * 1985-03-26 1995-02-15 大日本インキ化学工業株式会社 電子部品封止用樹脂組成物
JP2615550B2 (ja) * 1985-09-17 1997-05-28 大日本インキ化学工業株式会社 樹脂封止電子部品
JPH0739546B2 (ja) * 1986-04-14 1995-05-01 大日本インキ化学工業株式会社 成形用ポリフエニレンスルフイド樹脂組成物
JPS62253656A (ja) * 1986-04-28 1987-11-05 Kureha Chem Ind Co Ltd ポリアリ−レンチオエ−テル成形物

Also Published As

Publication number Publication date
ATE134071T1 (de) 1996-02-15
JPH0828444B2 (ja) 1996-03-21
EP0435648A3 (en) 1991-09-11
US5160786A (en) 1992-11-03
ES2083440T3 (es) 1996-04-16
DE69025303D1 (de) 1996-03-21
JPH04123461A (ja) 1992-04-23
GR3019723T3 (en) 1996-07-31
CA2032962A1 (en) 1991-06-28
EP0435648A2 (en) 1991-07-03
DE69025303T2 (de) 1996-07-11
EP0435648B1 (en) 1996-02-07
KR940003263B1 (ko) 1994-04-16
DK0435648T3 (da) 1996-06-10

Similar Documents

Publication Publication Date Title
FR2641540B1 (ko)
BR9205258A (pt) Composicao polimerica biodegradavel baseada em amido e polimeros termoplasticos
MX170059B (es) Composiciones elastomericas termoplasticas
CA1272328C (en) POLY(ARYLENE SULFIDE) TERNARY RESIN BLENDS
DE3789147T3 (de) Ungesättigte Äthylenpolymere.
FI832013A0 (fi) Etylenpolymerblandningar avsedda foer framstaellning av filmer
KR910012086A (ko) 리이드 프레임 삽입용 수지재료와 그 성형부품
KR890006736A (ko) 열접착성이 우수한 열가소성 엘라스토머(Elastomer)조성물
ATE40830T1 (de) Thermoplastische, flexible polymermischung.
KR900003273A (ko) 개선된 굴곡 특성을 갖는 도장성 열가소성 폴리올레핀 조성물
KR900006440A (ko) 폴리아릴렌 설파이드 수지 조성물 및 금속과 결합된 이의 성형품
KR890014666A (ko) 난연성 폴리부틸렌 테레프탈레이트 수지 조성물 및 전기 부품용 성형품
KR940009265A (ko) 유리-강화 수지 조성물
FR2347417A1 (fr) Charges au blanc de craie pour compositions a base de polymeres, telles que matieres plastiques et caoutchoucs
ES2078227T3 (es) Procedimiento para injertar polimeros estereorregulares de alfa-olefinas superiores ramificadas y sus composiciones.
ATE143683T1 (de) Verbesserte thermoplastenzusammensetzung, die ein styren-copolymerharz enthält
KR900001772A (ko) 난연성수지 조성물 및 난연성절연전선
KR920002703A (ko) 폴리(아릴렌 설피드)성형 조성물
KR900016351A (ko) 열가소성 성형물질
KR960001031A (ko) 무기물 강화 폴리아미드 수지 조성물
KR870008953A (ko) 유동성이 증진된 폴리에스테르조성물
KR910020120A (ko) 열가소성 중합체의 가공 방법
KR940014671A (ko) 폴리페닐렌 설파이드 수지조성물
KR950026895A (ko) 접착성이 우수한 열가소성수지
KR970006393A (ko) 열가소성 수지 조성물

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19990402

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee