GB985671A - - Google Patents
Info
- Publication number
- GB985671A GB985671A GB3518761A GB3518761A GB985671A GB 985671 A GB985671 A GB 985671A GB 3518761 A GB3518761 A GB 3518761A GB 3518761 A GB3518761 A GB 3518761A GB 985671 A GB985671 A GB 985671A
- Authority
- GB
- United Kingdom
- Prior art keywords
- block
- header
- bore
- oct
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 239000003921 oil Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000011787 zinc oxide Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
- Bipolar Transistors (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1960T0019070 DE1275690B (de) | 1960-10-01 | 1960-10-01 | Gehaeuse fuer Halbleiterbauelemente |
| DET19128A DE1206089B (de) | 1960-10-01 | 1960-10-14 | Verfahren zum Herstellen eines Transistors mit einlegierten Elektroden und nach diesem Verfahren hergestellter Transistor |
| DET0020202 | 1961-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB985671A true GB985671A (enrdf_load_stackoverflow) | 1965-03-10 |
Family
ID=27213060
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2868163A Expired GB985672A (en) | 1960-10-01 | 1961-09-29 | A semiconductor transistor or rectifier |
| GB3518761A Expired GB985671A (enrdf_load_stackoverflow) | 1960-10-01 | 1961-09-29 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2868163A Expired GB985672A (en) | 1960-10-01 | 1961-09-29 | A semiconductor transistor or rectifier |
Country Status (2)
| Country | Link |
|---|---|
| DE (2) | DE1275690B (enrdf_load_stackoverflow) |
| GB (2) | GB985672A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3388739A (en) * | 1965-09-07 | 1968-06-18 | Donald M. Olson | Heat dissipator |
| US3648523A (en) * | 1970-01-22 | 1972-03-14 | Joseph Kaye & Co | Uniform temperature reference apparatus |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2919404C2 (de) * | 1979-05-14 | 1986-04-03 | Siemens AG, 1000 Berlin und 8000 München | Gehäuse für Halbleiterbauelement |
| DE3128418A1 (de) * | 1981-07-17 | 1983-02-03 | Siemens AG, 1000 Berlin und 8000 München | Gehaeuse fuer elektronische bauelemente, insbesondere optoelektronische halbleiterbauelemente |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT180300B (de) * | 1950-11-30 | 1954-11-25 | Western Electric Co | Halbleiterelement für die elektrische Signalumsetzung und Verfahren zu seiner Herstellung |
| BE554903A (enrdf_load_stackoverflow) * | 1951-06-08 | 1900-01-01 | ||
| DE896392C (de) * | 1951-11-13 | 1953-11-12 | Licentia Gmbh | Gehaeuse fuer ein elektrisch unsymmetrisch leitendes System vom Kristalltyp |
| US2725505A (en) * | 1953-11-30 | 1955-11-29 | Rca Corp | Semiconductor power devices |
| DE1696510U (de) * | 1954-09-09 | 1955-04-14 | Licentia Gmbh | Anordnung von trockengleichrichtern. |
| DE1041599B (de) * | 1956-09-27 | 1958-10-23 | Siemens Ag | Flaechengleichrichteranordnung mit einer Vielzahl von p-n-Gleichrichter-elementen aus Germanium oder Silizium |
| DE1051413B (de) * | 1957-12-19 | 1959-02-26 | Telefunken Gmbh | Verfahren zur Herstellung einer vakuumdichten Kapselung von Halbleiteranordnungen |
| FR1205359A (fr) * | 1958-07-23 | 1960-02-02 | Siemens Edison Swan Ltd | Dispositifs semi-conducteurs hermétiquement fermés |
| DE1083438B (de) * | 1959-05-23 | 1960-06-15 | Elektronik M B H | Von einem Metallgehaeuse umschlossene Transistoranordnung |
| DE1807989C3 (de) * | 1968-11-06 | 1979-12-13 | Ersa, Ernst Sachs Kg Gmbh & Co, 6980 Wertheim | Vorrichtung zur Lötung elektrischer Verbindungen, insbesondere gedruckter Schaltungen |
-
1960
- 1960-10-01 DE DE1960T0019070 patent/DE1275690B/de active Pending
- 1960-10-14 DE DET19128A patent/DE1206089B/de active Pending
-
1961
- 1961-09-29 GB GB2868163A patent/GB985672A/en not_active Expired
- 1961-09-29 GB GB3518761A patent/GB985671A/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3388739A (en) * | 1965-09-07 | 1968-06-18 | Donald M. Olson | Heat dissipator |
| US3648523A (en) * | 1970-01-22 | 1972-03-14 | Joseph Kaye & Co | Uniform temperature reference apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1275690B (de) | 1968-08-22 |
| GB985672A (en) | 1965-03-10 |
| DE1206089B (de) | 1965-12-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1029171A (en) | A semiconductor arrangement | |
| GB1271576A (en) | Improvements in and relating to semiconductor devices | |
| GB749392A (en) | Semiconductor devices | |
| GB1333190A (en) | Semiconductor devices | |
| GB1090628A (en) | Improvements in or relating to a heat sink for the mounting of temperature-sensitive electrical components | |
| GB1207728A (en) | Housing assembly for an electric circuit | |
| GB890841A (en) | Semi-conductor device | |
| ES495391A0 (es) | Perfeccionamientos en dispositivos de calefaccion con un disco conductor de coeficiente de temperatura negativo como elemento de calefaccion | |
| GB914592A (en) | Electrical semi-conductor device | |
| GB985671A (enrdf_load_stackoverflow) | ||
| GB1079382A (en) | Heat sink structure and method of making the same | |
| GB1455001A (en) | Heat sink assembly | |
| GB1301190A (en) | Electrical connector assembly having cooling capability | |
| GB817746A (en) | Improvements in or relating to coolers for semi-conductor cells | |
| GB1295775A (enrdf_load_stackoverflow) | ||
| GB855382A (en) | Method of producing a p-n junction in a crystalline semiconductor | |
| GB1516709A (en) | Fusible transcalent electrical device | |
| GB1395840A (en) | Internal cooling for photocathodes | |
| GB1154793A (en) | Improvements in Low Temperature Heat Exchangers | |
| JPS643497A (en) | Heat pipe | |
| EP0224141A3 (en) | Improved semiconductor power devices | |
| FR2337483A1 (fr) | Composants a forte puissance de dissipation admissible par transfert de chaleur | |
| GB886451A (en) | Improvements in or relating to semi-conductors | |
| GB989370A (en) | Improvements in or relating to semiconductor devices | |
| RU2466U1 (ru) | Корпус полупроводникового прибора |