GB985671A - - Google Patents

Info

Publication number
GB985671A
GB985671A GB3518761A GB3518761A GB985671A GB 985671 A GB985671 A GB 985671A GB 3518761 A GB3518761 A GB 3518761A GB 3518761 A GB3518761 A GB 3518761A GB 985671 A GB985671 A GB 985671A
Authority
GB
United Kingdom
Prior art keywords
block
header
bore
oct
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3518761A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Patentverwertungs GmbH
Original Assignee
Telefunken Patentverwertungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefunken Patentverwertungs GmbH filed Critical Telefunken Patentverwertungs GmbH
Publication of GB985671A publication Critical patent/GB985671A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array

Abstract

985,671. Semi-conductor devices. TELEFUNKEN PATENTVERWERTUNGS G.m.b.H. Sept. 29, 1961 [Oct. 1, 1960; Oct. 14, 1960], No. 35187/61. Heading H1K. A semi-conductor device mounted on a header is disposed in a blind hole in a metal block of parallelipiped form with the header sealing off the hole, for example as illustrated in Fig. 8. In this case dissipation of heat from the transistor is facilitated by soldering the collector 6 (as shown) and/or the emitter to a massive cooling plate 17 and filling the remainder of the bore with a heat-conducting mixture of zinc oxide and silicon oil. The block is massive enough to resist distortion by pressures used in assembling the header therein. A threaded hole (as shown) or a slot is provided in the end of the block to allow it to be bolted to a chassis. In alternative devices using similar blocks, which may be of aluminium or tinned copper a metal cylinder or helix is provided surrounding the base plate to facilitate cooling. Another possibility is to make the base plate a tight fit in the bore, the edges of the plates being provided with a strip of ductile metal, e.g. indium to provide a better overall thermal contact with the bore walls. Several devices may be bolted side by side in tiers to form a block through which the temperature is sensibly constant.
GB3518761A 1960-10-01 1961-09-29 Expired GB985671A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE1960T0019070 DE1275690B (en) 1960-10-01 1960-10-01 Housing for semiconductor components
DET19128A DE1206089B (en) 1960-10-01 1960-10-14 Process for producing a transistor with alloyed electrodes and transistor produced according to this process
DET0020202 1961-05-25

Publications (1)

Publication Number Publication Date
GB985671A true GB985671A (en) 1965-03-10

Family

ID=27213060

Family Applications (2)

Application Number Title Priority Date Filing Date
GB2868163A Expired GB985672A (en) 1960-10-01 1961-09-29 A semiconductor transistor or rectifier
GB3518761A Expired GB985671A (en) 1960-10-01 1961-09-29

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB2868163A Expired GB985672A (en) 1960-10-01 1961-09-29 A semiconductor transistor or rectifier

Country Status (2)

Country Link
DE (2) DE1275690B (en)
GB (2) GB985672A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3388739A (en) * 1965-09-07 1968-06-18 Donald M. Olson Heat dissipator
US3648523A (en) * 1970-01-22 1972-03-14 Joseph Kaye & Co Uniform temperature reference apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3128418A1 (en) * 1981-07-17 1983-02-03 Siemens AG, 1000 Berlin und 8000 München Housing for electronic components, especially optoelectronic semiconductor components

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT180300B (en) * 1950-11-30 1954-11-25 Western Electric Co Semiconductor element for electrical signal conversion and process for its manufacture
NL238107A (en) * 1951-06-08 1900-01-01
DE896392C (en) * 1951-11-13 1953-11-12 Licentia Gmbh Housing for an electrically asymmetrically conductive system of the crystal type
US2725505A (en) * 1953-11-30 1955-11-29 Rca Corp Semiconductor power devices
DE1696510U (en) * 1954-09-09 1955-04-14 Licentia Gmbh ARRANGEMENT OF DRY EQUIPMENT.
DE1041599B (en) * 1956-09-27 1958-10-23 Siemens Ag Surface rectifier arrangement with a large number of p-n rectifier elements made of germanium or silicon
DE1051413B (en) * 1957-12-19 1959-02-26 Telefunken Gmbh Process for producing a vacuum-tight encapsulation of semiconductor arrangements
FR1205359A (en) * 1958-07-23 1960-02-02 Siemens Edison Swan Ltd Hermetically sealed semiconductor devices
DE1083438B (en) * 1959-05-23 1960-06-15 Elektronik M B H Transistor arrangement enclosed by a metal housing
DE1807989C3 (en) * 1968-11-06 1979-12-13 Ersa, Ernst Sachs Kg Gmbh & Co, 6980 Wertheim Device for soldering electrical connections, in particular printed circuits

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3388739A (en) * 1965-09-07 1968-06-18 Donald M. Olson Heat dissipator
US3648523A (en) * 1970-01-22 1972-03-14 Joseph Kaye & Co Uniform temperature reference apparatus

Also Published As

Publication number Publication date
DE1275690B (en) 1968-08-22
GB985672A (en) 1965-03-10
DE1206089B (en) 1965-12-02

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