JPS643497A - Heat pipe - Google Patents

Heat pipe

Info

Publication number
JPS643497A
JPS643497A JP15703687A JP15703687A JPS643497A JP S643497 A JPS643497 A JP S643497A JP 15703687 A JP15703687 A JP 15703687A JP 15703687 A JP15703687 A JP 15703687A JP S643497 A JPS643497 A JP S643497A
Authority
JP
Japan
Prior art keywords
heat
heat pipe
input part
diameter
reduced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15703687A
Other languages
Japanese (ja)
Inventor
Shigeji Konno
Kyosuke Nagata
Kenichi Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP15703687A priority Critical patent/JPS643497A/en
Publication of JPS643497A publication Critical patent/JPS643497A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores

Abstract

PURPOSE:To provide a compact heat pipe which is suitable for cooling an electronic equipment, a semiconductor element, etc., without decreasing a thermal performance in a group wick type heat pipe to be used in a horizontal condition by a method wherein a heat input part of which diameter is reduced (evaporation part ) is arranged. CONSTITUTION:A heat pipe 3 is of a rectangular group wick type 7, and a container is composed of a steel cylinder body and working liquid of pure water is filled into it and installed in a horizontal state. An input part of heat 6 is reduced in its diameter by a swaging work and buried in a steel thermal conducting block 11 through soldering and then a generated heat of a semiconductor element 2 is transmitted to the heat pipe 3 so as to make a compact system. A heat discharging part 4 is provided with plate fins made of aluminum. In this way, the heat input part of the heat pipe is reduced in its diameter to reduce the width of groove; thereby, the capillary action of the heat input part is improved and a compact size can be attained without reducing the thermal performance.
JP15703687A 1987-06-24 1987-06-24 Heat pipe Pending JPS643497A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15703687A JPS643497A (en) 1987-06-24 1987-06-24 Heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15703687A JPS643497A (en) 1987-06-24 1987-06-24 Heat pipe

Publications (1)

Publication Number Publication Date
JPS643497A true JPS643497A (en) 1989-01-09

Family

ID=15640791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15703687A Pending JPS643497A (en) 1987-06-24 1987-06-24 Heat pipe

Country Status (1)

Country Link
JP (1) JPS643497A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0417299A1 (en) * 1989-02-06 1991-03-20 The Furukawa Electric Co., Ltd. Electrically insulated heat pipe-type semiconductor cooling device
KR20000056978A (en) * 1999-02-05 2000-09-15 로버트 제이. 에드워드 Elliptical Heat Pipe with Carbon Steel Fins and Bonded with Zinc Galvanizing
KR100338810B1 (en) * 1999-11-08 2002-05-31 윤종용 cooling device
CN103512414A (en) * 2012-06-15 2014-01-15 奇鋐科技股份有限公司 Heat tube structure, heat dissipation module and electronic device
WO2019031449A1 (en) * 2017-08-09 2019-02-14 ダイキン工業株式会社 Outdoor unit for refrigeration device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0417299A1 (en) * 1989-02-06 1991-03-20 The Furukawa Electric Co., Ltd. Electrically insulated heat pipe-type semiconductor cooling device
KR20000056978A (en) * 1999-02-05 2000-09-15 로버트 제이. 에드워드 Elliptical Heat Pipe with Carbon Steel Fins and Bonded with Zinc Galvanizing
KR100338810B1 (en) * 1999-11-08 2002-05-31 윤종용 cooling device
CN103512414A (en) * 2012-06-15 2014-01-15 奇鋐科技股份有限公司 Heat tube structure, heat dissipation module and electronic device
WO2019031449A1 (en) * 2017-08-09 2019-02-14 ダイキン工業株式会社 Outdoor unit for refrigeration device
JP2019032142A (en) * 2017-08-09 2019-02-28 ダイキン工業株式会社 Outdoor unit of freezer

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