GB9613789D0 - Method for analyzing failure in semiconductor device - Google Patents

Method for analyzing failure in semiconductor device

Info

Publication number
GB9613789D0
GB9613789D0 GBGB9613789.8A GB9613789A GB9613789D0 GB 9613789 D0 GB9613789 D0 GB 9613789D0 GB 9613789 A GB9613789 A GB 9613789A GB 9613789 D0 GB9613789 D0 GB 9613789D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor device
analyzing failure
analyzing
failure
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB9613789.8A
Other versions
GB2302987A (en
GB2302987B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd
Publication of GB9613789D0 publication Critical patent/GB9613789D0/en
Publication of GB2302987A publication Critical patent/GB2302987A/en
Application granted granted Critical
Publication of GB2302987B publication Critical patent/GB2302987B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
  • Weting (AREA)
GB9613789A 1995-06-30 1996-07-01 Method for analyzing failure in semiconductor device Expired - Fee Related GB2302987B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950019151A KR100216674B1 (en) 1995-06-30 1995-06-30 Deprocessing method of defect analysis of polysilicon contact

Publications (3)

Publication Number Publication Date
GB9613789D0 true GB9613789D0 (en) 1996-09-04
GB2302987A GB2302987A (en) 1997-02-05
GB2302987B GB2302987B (en) 1999-09-15

Family

ID=19419494

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9613789A Expired - Fee Related GB2302987B (en) 1995-06-30 1996-07-01 Method for analyzing failure in semiconductor device

Country Status (6)

Country Link
JP (1) JPH0922932A (en)
KR (1) KR100216674B1 (en)
CN (1) CN1147146A (en)
DE (1) DE19626026A1 (en)
GB (1) GB2302987B (en)
TW (1) TW318950B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6033994A (en) * 1997-05-16 2000-03-07 Sony Corporation Apparatus and method for deprocessing a multi-layer semiconductor device
KR100533387B1 (en) * 1998-06-10 2006-01-27 매그나칩 반도체 유한회사 Reverse process method of semiconductor device
AT409429B (en) 1999-07-15 2002-08-26 Sez Semiconduct Equip Zubehoer METHOD FOR ETCH TREATING SEMICONDUCTOR SUBSTRATES FOR THE EXPLOSION OF A METAL LAYER
CN100340851C (en) * 2003-02-18 2007-10-03 华为技术有限公司 Miniature device and component dissection method
CN101769876B (en) * 2008-12-29 2015-10-14 中芯国际集成电路制造(上海)有限公司 Carry out the method for failure analysis in the semiconductor device
CN102253325B (en) * 2010-05-21 2013-07-31 中芯国际集成电路制造(上海)有限公司 Method for analyzing chip failure
CN102254844B (en) * 2010-05-21 2013-06-19 武汉新芯集成电路制造有限公司 Memory chip bit line failure analysis method
CN102565680B (en) * 2010-12-27 2016-09-14 无锡华润上华半导体有限公司 The failure analysis method of semiconductor device
CN103776668B (en) * 2012-10-26 2016-03-09 中芯国际集成电路制造(上海)有限公司 The preparation method of semiconductor devices active region failure analysis sample
CN105092620B (en) * 2015-06-02 2018-06-26 武汉新芯集成电路制造有限公司 A kind of semiconductor device failure analysis method
CN106876296A (en) * 2017-01-03 2017-06-20 航天科工防御技术研究试验中心 A kind of semiconductor device failure localization method
CN108037431B (en) * 2017-11-16 2020-02-14 长江存储科技有限责任公司 Method for calibrating bit line short-circuit defects of 3D NAND product
TWI738568B (en) * 2020-11-18 2021-09-01 汎銓科技股份有限公司 A method of preparing a semiconductor specimen for failure analysis

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4836883A (en) * 1988-06-07 1989-06-06 Advanced Micro Devices, Inc. Method of performing electrical reject selection
US5214283A (en) * 1991-07-23 1993-05-25 Sgs-Thomson Microelectronics, Inc. Method of determining the cause of open-via failures in an integrated circuit

Also Published As

Publication number Publication date
TW318950B (en) 1997-11-01
GB2302987A (en) 1997-02-05
CN1147146A (en) 1997-04-09
KR970003748A (en) 1997-01-28
DE19626026A1 (en) 1997-01-23
KR100216674B1 (en) 1999-09-01
GB2302987B (en) 1999-09-15
JPH0922932A (en) 1997-01-21

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20090701