GB945018A - Process of chemical metal plating and baths therefor - Google Patents

Process of chemical metal plating and baths therefor

Info

Publication number
GB945018A
GB945018A GB3857/62A GB385762A GB945018A GB 945018 A GB945018 A GB 945018A GB 3857/62 A GB3857/62 A GB 3857/62A GB 385762 A GB385762 A GB 385762A GB 945018 A GB945018 A GB 945018A
Authority
GB
United Kingdom
Prior art keywords
solution
metals
compounds
sulphur
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3857/62A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Publication of GB945018A publication Critical patent/GB945018A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
    • D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles

Abstract

A chemical plating bath for coating metals or plastics with metal comprises a solution containing a salt of the plating metal, a boron compound with 1-4 hydrogen atoms selected from alkali metal borohydrides, alkylamino boranes, alkylamino borines and borozoles as reducing agents, and at least one soluble organic sulphur compound having a CSC grouping. The solution may additionally contain one or more compounds of the metals of Group IIb, IIIb, IVb, Vb and VIb of the Periodic System, buffers such as sodium acetate, citrate or tartrate and complex formers such as ethylene diamine, ethanolamine, tetramethylene diamine, diethylene triamine, triethylene tetramine, ethylenediamino tetraacetic acid and nitrilotriacetic acid. The plating metals specified are Ni, Co, Fe and Zn and the materials coated may be Ni, Cu, brasses, Al, Fe and plastics such as acetyl cellulose, cellulose acetobutyrate, P.V.C., polyamides, polyurethanes, polystyrene, polycarbonates, polyacrylates, polyethylene and polypropylene. In the case of plastics they are first pretreated in a solution of NaOH and a wetting agent followed by a solution of stanuous chloride hydrochloric acid and a wetting agent and then a solution of palladium chloride and hydrochloric acid. The salts of the plating metals may be the nitrates, formates, chlorides, sulphates or acetates and the organic sulphur compounds may be sulphur containing aliphatic carboxylic acids, alcohols and their derivatives, sulphur containing aromatic/aliphatic carboxylic acids, sulphur containing acetylenic compounds, aromatic sulphides, thiophenes and thionaphthenes, and thiazoles. Many examples of these sulphur compounds are given. The preferred coating solution contains 0.1-10 g/1. of the boron compound, 0.02-0.5 mol/1. of the plating metal salt, 0.001-5 g/1. of the organic sulphur compound, 0.001-1 g/1. of compounds of the other metals, 5-200 g/1. buffers and 0.2-5 mol/1. of complex formers.
GB3857/62A 1961-02-04 1962-02-01 Process of chemical metal plating and baths therefor Expired GB945018A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEF33143A DE1243493B (en) 1961-02-04 1961-02-04 Aqueous bath for chemical deposition of boron-containing metal coatings

Publications (1)

Publication Number Publication Date
GB945018A true GB945018A (en) 1963-12-18

Family

ID=7094965

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3857/62A Expired GB945018A (en) 1961-02-04 1962-02-01 Process of chemical metal plating and baths therefor

Country Status (5)

Country Link
US (1) US3234031A (en)
BE (1) BE613430A (en)
CH (1) CH412513A (en)
DE (1) DE1243493B (en)
GB (1) GB945018A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1266099B (en) * 1965-02-20 1968-04-11 Schering Ag Bath for the reductive copper deposition

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
US3497394A (en) * 1963-11-29 1970-02-24 Mc Donnell Douglas Corp Inorganic permselective membranes and method of making same
US3454473A (en) * 1963-12-07 1969-07-08 Matsushita Electric Ind Co Ltd Method for the manufacture of titanium anodic oxidation film capacitors having non-electrolytically plated cathode
GB1129984A (en) * 1964-10-30 1968-10-09 Usa Electroless deposition of nickel-phosphorus alloys
GB1054359A (en) * 1964-12-21
US3372037A (en) * 1965-06-30 1968-03-05 Ibm Magnetic materials
US3420680A (en) * 1966-04-08 1969-01-07 Shipley Co Compositions and processes for electroless nickel plating
US3507681A (en) * 1967-06-02 1970-04-21 Mine Safety Appliances Co Metal plating of plastics
US3532541A (en) * 1967-06-19 1970-10-06 Ibm Boron containing composite metallic films and plating baths for their electroless deposition
US3515564A (en) * 1968-05-27 1970-06-02 Allied Res Prod Inc Stabilization of electroless plating solutions
CH533172A (en) * 1969-05-22 1973-01-31 Schering Ag Stabilized reductive nickel bath
US4059217A (en) * 1975-12-30 1977-11-22 Rohr Industries, Incorporated Superalloy liquid interface diffusion bonding
DE3117247A1 (en) * 1981-04-30 1982-11-18 Bayer Ag, 5090 Leverkusen METALLIZED TEXTILE AREAS WITH ELECTRICAL LEAD CONTACTS AND THEIR PRODUCTION
US4368223A (en) * 1981-06-01 1983-01-11 Asahi Glass Company, Ltd. Process for preparing nickel layer
US4484988A (en) * 1981-12-09 1984-11-27 Richmond Metal Finishers, Inc. Process for providing metallic articles and the like with wear-resistant coatings
EP0084300A3 (en) * 1982-01-19 1983-08-03 Axel Emil Bergström A method for metal covering of textile materials
EP0092971B1 (en) * 1982-04-27 1989-08-16 Richardson Chemical Company Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby
DE3622090C1 (en) * 1986-07-02 1990-02-15 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De
US4983428A (en) * 1988-06-09 1991-01-08 United Technologies Corporation Ethylenethiourea wear resistant electroless nickel-boron coating compositions
DE69205415T2 (en) * 1992-04-06 1996-05-30 Ibm Process for the production of catalytically highly effective coatings consisting of a metal from the group of platinum metals.
JP3115095B2 (en) * 1992-04-20 2000-12-04 ディップソール株式会社 Electroless plating solution and plating method using the same
US5624479A (en) * 1993-04-02 1997-04-29 International Business Machines Corporation Solution for providing catalytically active platinum metal layers
US6045680A (en) * 1996-05-30 2000-04-04 E. I. Du Pont De Nemours And Company Process for making thermally stable metal coated polymeric monofilament or yarn
DE69709094T2 (en) * 1996-05-30 2002-07-18 Du Pont PROCESS FOR PRODUCING A THERMALLY STABLE, METAL-COATED POLYMER MONOFILAMENT
US6554877B2 (en) * 2001-01-03 2003-04-29 More Energy Ltd. Liquid fuel compositions for electrochemical fuel cells
US7332193B2 (en) * 2004-10-18 2008-02-19 Enthone, Inc. Cobalt and nickel electroless plating in microelectronic devices
KR100859259B1 (en) * 2005-12-29 2008-09-18 주식회사 엘지화학 Cobalt-base alloy electroless-plating solution and electroless-plating by using the same
US20110192316A1 (en) * 2010-02-05 2011-08-11 E-Chem Enterprise Corp. Electroless plating solution for providing solar cell electrode
US10294569B2 (en) * 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10655227B2 (en) * 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE472031A (en) * 1946-03-22
US2528902A (en) * 1947-06-12 1950-11-07 Harshaw Chem Corp Bright nickel plating
US2762723A (en) * 1953-06-03 1956-09-11 Gen American Transporation Cor Processes of chemical nickel plating and baths therefor
GB836480A (en) * 1957-01-15 1960-06-01 Du Pont Improvements in or relating to alloy plate
DE1068970B (en) * 1957-02-15 1959-11-12 Mond Nickel Co Ltd Electroplating of black nickel coatings and pretreatment of the workpieces to be coated
GB842826A (en) * 1957-11-15 1960-07-27 Du Pont Improvements in or relating to chemical plating
US3096182A (en) * 1958-10-01 1963-07-02 Du Pont Chemical plating solution and process for plating therewith
US3062666A (en) * 1958-11-26 1962-11-06 Du Pont Bath compositions for the chemical reductive plating of nickel-boron and cobalt-boron alloys
US2994369A (en) * 1959-04-02 1961-08-01 Pittsburgh Plate Glass Co Nickel plating chemical composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1266099B (en) * 1965-02-20 1968-04-11 Schering Ag Bath for the reductive copper deposition

Also Published As

Publication number Publication date
DE1243493B (en) 1967-06-29
BE613430A (en) 1962-05-29
US3234031A (en) 1966-02-08
CH412513A (en) 1966-04-30

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