GB942232A - Improvements in semi-conductor devices - Google Patents
Improvements in semi-conductor devicesInfo
- Publication number
- GB942232A GB942232A GB5266/62A GB526662A GB942232A GB 942232 A GB942232 A GB 942232A GB 5266/62 A GB5266/62 A GB 5266/62A GB 526662 A GB526662 A GB 526662A GB 942232 A GB942232 A GB 942232A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semi
- spacers
- conductor
- solder
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/00—
-
- H10W72/20—
-
- H10W72/30—
-
- H10W72/073—
-
- H10W72/07327—
-
- H10W72/07336—
-
- H10W72/07353—
-
- H10W72/325—
-
- H10W72/334—
-
- H10W72/351—
-
- H10W72/352—
-
- H10W72/931—
Landscapes
- Die Bonding (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP26593A DE1226715B (de) | 1961-02-15 | 1961-02-15 | Halbleiterbauelement mit einem flaechenhaft an Stromzufuehrungen angeloeteten Halbleiterelement und Verfahren zu seiner Herstellung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB942232A true GB942232A (en) | 1963-11-20 |
Family
ID=7370506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB5266/62A Expired GB942232A (en) | 1961-02-15 | 1962-02-12 | Improvements in semi-conductor devices |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE1226715B (cg-RX-API-DMAC10.html) |
| GB (1) | GB942232A (cg-RX-API-DMAC10.html) |
| NL (1) | NL274757A (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106488663A (zh) * | 2015-08-31 | 2017-03-08 | 英飞凌科技股份有限公司 | 使用间距保持器将第一焊接件焊接在第二焊接件上的方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2228703A1 (de) * | 1972-06-13 | 1974-01-10 | Licentia Gmbh | Verfahren zum herstellen einer vorgegebenen lotschichtstaerke bei der fertigung von halbleiterbauelementen |
| FR2452786A1 (fr) * | 1979-03-30 | 1980-10-24 | Silicium Semiconducteur Ssc | Procede de montage par soudage d'une pastille semi-conductrice sur un radiateur et dispositif obtenu |
| DE19546285A1 (de) * | 1995-12-12 | 1997-06-19 | Telefunken Microelectron | Elektronisches Modul |
| DE102013110812B3 (de) | 2013-09-30 | 2014-10-09 | Semikron Elektronik Gmbh & Co. Kg | Verfahren zur Herstellung eines weitergebildeten Metallformkörpers und Verfahren zur Herstellung einer Leistungshalbleitereinrichtung mit einer Lotverbindung diesen weitergebildeten Metallformkörper verwendend. |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL85899C (cg-RX-API-DMAC10.html) * | 1950-10-06 | |||
| NL110715C (cg-RX-API-DMAC10.html) * | 1954-12-16 | 1900-01-01 | ||
| FR1172000A (fr) * | 1955-08-10 | 1959-02-04 | Ibm | Structure semi-conductrice à jonction |
| FR1213484A (fr) * | 1958-08-04 | 1960-04-01 | Thomson Houston Comp Francaise | Milieu conducteur non isotrope pour flux thermique intense |
-
0
- NL NL274757D patent/NL274757A/xx unknown
-
1961
- 1961-02-15 DE DEP26593A patent/DE1226715B/de active Pending
-
1962
- 1962-02-12 GB GB5266/62A patent/GB942232A/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106488663A (zh) * | 2015-08-31 | 2017-03-08 | 英飞凌科技股份有限公司 | 使用间距保持器将第一焊接件焊接在第二焊接件上的方法 |
| CN106488663B (zh) * | 2015-08-31 | 2019-08-23 | 英飞凌科技股份有限公司 | 使用间距保持器将第一焊接件焊接在第二焊接件上的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| NL274757A (cg-RX-API-DMAC10.html) | 1900-01-01 |
| DE1226715B (de) | 1966-10-13 |
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