GB809877A - Materials for and methods of manufacturing semiconductor devices - Google Patents

Materials for and methods of manufacturing semiconductor devices

Info

Publication number
GB809877A
GB809877A GB35783/56A GB3578356A GB809877A GB 809877 A GB809877 A GB 809877A GB 35783/56 A GB35783/56 A GB 35783/56A GB 3578356 A GB3578356 A GB 3578356A GB 809877 A GB809877 A GB 809877A
Authority
GB
United Kingdom
Prior art keywords
per cent
gold
gallium
antimony
aluminium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB35783/56A
Other languages
English (en)
Inventor
Boyd Cornelison
Morton Edward Jones
James Taylor Lineback
Elmer Albert Wolff Jr
Frank Adolph Horak
Norman Shirley Ince
Samuel Wright Barcus Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of GB809877A publication Critical patent/GB809877A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3013—Au as the principal constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
GB35783/56A 1955-03-10 1956-11-22 Materials for and methods of manufacturing semiconductor devices Expired GB809877A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US493478A US3076253A (en) 1955-03-10 1955-03-10 Materials for and methods of manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
GB809877A true GB809877A (en) 1959-03-04

Family

ID=23960371

Family Applications (1)

Application Number Title Priority Date Filing Date
GB35783/56A Expired GB809877A (en) 1955-03-10 1956-11-22 Materials for and methods of manufacturing semiconductor devices

Country Status (6)

Country Link
US (1) US3076253A (enExample)
BE (1) BE553205A (enExample)
CH (1) CH349346A (enExample)
FR (1) FR1172558A (enExample)
GB (1) GB809877A (enExample)
NL (2) NL110588C (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3086281A (en) * 1957-05-06 1963-04-23 Shockley William Semiconductor leads and method of attaching
DE1159740B (de) * 1959-10-20 1963-12-19 Rca Corp Lot zum vakuumdichten Verloeten von Metall- und/oder Isolierteilen und Verfahren dazu
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
DE1207769B (de) * 1962-02-13 1965-12-23 Telefunken Patent Ternaeres Hartlot auf Silber-Kupfer-Basis
DE1235714B (de) * 1963-10-23 1967-03-02 Telefunken Patent Vakuumdichte Metall-Keramik-Loetverbindung an einer elektrischen Entladungsanordnung

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3212159A (en) * 1959-08-26 1965-10-19 Grassl Ludwig Method of producing miniature semiconductor structures
US3158788A (en) * 1960-08-15 1964-11-24 Fairchild Camera Instr Co Solid-state circuitry having discrete regions of semi-conductor material isolated by an insulating material
NL284623A (enExample) * 1961-10-24
BE624958A (enExample) * 1961-11-20
NL298354A (enExample) * 1963-03-29
US3235937A (en) * 1963-05-10 1966-02-22 Gen Electric Low cost transistor
US3387192A (en) * 1965-05-19 1968-06-04 Irc Inc Four layer planar semiconductor switch and method of making the same
DE1614364C3 (de) * 1966-06-01 1979-04-05 Rca Corp., New York, N.Y. (V.St.A.) Verfahren zur Montage eines Halbleiter-Kristallelementes
US3824679A (en) * 1967-04-08 1974-07-23 Siemens Ag Method of making semiconductor component with sheet metal connector leads
US3490141A (en) * 1967-10-02 1970-01-20 Motorola Inc High voltage rectifier stack and method for making same
AU2788671A (en) * 1970-05-13 1972-10-26 Itt Industries, Inc Bridge rectifiers
US4106184A (en) * 1977-05-16 1978-08-15 Sprague Electric Company Method for making fused solid electrolyte capacitor assemblages and a fused capacitor made thereby
WO2010046825A1 (en) * 2008-10-20 2010-04-29 Nxp B.V. Method for manufacturing a microelectronic package comprising at least one microelectronic device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1731212A (en) * 1926-06-10 1929-10-08 Gen Plate Co Gold alloy
US2137831A (en) * 1936-06-13 1938-11-22 Gen Electric Method of producing dry plate elements for selenium rectifiers and the like
US2400003A (en) * 1943-04-16 1946-05-07 Mallory & Co Inc P R Electric contact
NL82014C (enExample) * 1949-11-30
BE506280A (enExample) * 1950-10-10
GB728244A (en) * 1951-10-19 1955-04-13 Gen Electric Improvements in and relating to germanium photocells
BE517459A (enExample) * 1952-02-07
US2711511A (en) * 1952-05-23 1955-06-21 Bell Telephone Labor Inc Electrical hygrometer
US2765245A (en) * 1952-08-22 1956-10-02 Gen Electric Method of making p-n junction semiconductor units
NL182156B (nl) * 1952-10-20 Flamemaster Corp Zelfdovende brandwerende samenstelling en voorwerpen daarmee bekleed.
BE524376A (enExample) * 1952-11-18
US2705767A (en) * 1952-11-18 1955-04-05 Gen Electric P-n junction transistor
US2697052A (en) * 1953-07-24 1954-12-14 Bell Telephone Labor Inc Fabricating of semiconductor translating devices
GB774388A (en) * 1954-01-28 1957-05-08 Marconi Wireless Telegraph Co Improvements in or relating to semi-conducting amplifiers
US2736847A (en) * 1954-05-10 1956-02-28 Hughes Aircraft Co Fused-junction silicon diodes
BE546710A (enExample) * 1955-06-08 1900-01-01
DE1048358B (enExample) * 1955-08-12 1959-01-08
US2814853A (en) * 1956-06-14 1957-12-03 Power Equipment Company Manufacturing transistors

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3086281A (en) * 1957-05-06 1963-04-23 Shockley William Semiconductor leads and method of attaching
DE1159740B (de) * 1959-10-20 1963-12-19 Rca Corp Lot zum vakuumdichten Verloeten von Metall- und/oder Isolierteilen und Verfahren dazu
DE1207769B (de) * 1962-02-13 1965-12-23 Telefunken Patent Ternaeres Hartlot auf Silber-Kupfer-Basis
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
DE1235714B (de) * 1963-10-23 1967-03-02 Telefunken Patent Vakuumdichte Metall-Keramik-Loetverbindung an einer elektrischen Entladungsanordnung

Also Published As

Publication number Publication date
FR1172558A (fr) 1959-02-12
US3076253A (en) 1963-02-05
NL212855A (enExample)
NL110588C (enExample)
CH349346A (de) 1960-10-15
BE553205A (enExample)

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