GB794971A - Improvements relating to the manufacture of printed electrical circuits - Google Patents
Improvements relating to the manufacture of printed electrical circuitsInfo
- Publication number
- GB794971A GB794971A GB2665153A GB2665153A GB794971A GB 794971 A GB794971 A GB 794971A GB 2665153 A GB2665153 A GB 2665153A GB 2665153 A GB2665153 A GB 2665153A GB 794971 A GB794971 A GB 794971A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conducting
- coating
- semi
- resistive
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
Abstract
794,971. Printed circuits. METROPOLITANVICKERS ELECTRICAL CO., Ltd. Sept. 28, 1954 [Sept. 28, 1953], No. 26651/53. Drawings to Specification. Class 37. A printed circuit comprising superimposed layers to constitute the components and connections is made by printing a negative mask of the desired pattern on an insulating backing, applying by vacuum deposition a conducting, resistive or semi-conducting coating over the whole, forming a subsequent layer by further printing and coating and removing the masking material and coatings superimposed thereon. A negative mask of the desired resistive or semiconducting areas may first be printed on the base and a coating of resistive or semi-conducting material applied after which the mask and overlying coating are removed. A negative mask of the desired conducting areas is then printed on the base and a conducting coating applied, after which the second mask and its overlying coating are removed. An alternative method comprises printing on the base a negative mask of the desired resistive or semi-conducting and conducting pattern, applying a coating of resistive or semi-conducting material, printing a second negative mask of the desired conducting pattern thereover, coating this with conductive material, which adheres to the exposed areas of the resistive or semi-conducting coating, then removing the masking layers and any superimposed material. Two or more successive layers of resistance material may be applied to obtain the desired resistivity. A nickel-chromium alloy may be used for the resistance material, selenium or germanium for semi-conductors and copper or silver for the conductors. The insulating base may comprise polyester-bonded glass laminates, glass, paperbased " Bakelite " board or " Araldite " (" Bakelite " and " Araldite " are Registered Trade Marks). The completed circuit may be rolled or folded and encased in plastic, wire leads being brought out for connection. Specification 794,973 is referred to.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2665153A GB794971A (en) | 1953-09-28 | 1953-09-28 | Improvements relating to the manufacture of printed electrical circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2665153A GB794971A (en) | 1953-09-28 | 1953-09-28 | Improvements relating to the manufacture of printed electrical circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
GB794971A true GB794971A (en) | 1958-05-14 |
Family
ID=10247022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2665153A Expired GB794971A (en) | 1953-09-28 | 1953-09-28 | Improvements relating to the manufacture of printed electrical circuits |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB794971A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008142206A1 (en) * | 2007-05-24 | 2008-11-27 | Pintavision Oy | Method for producing circuit boards comprising electronic, optical and functional features |
-
1953
- 1953-09-28 GB GB2665153A patent/GB794971A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008142206A1 (en) * | 2007-05-24 | 2008-11-27 | Pintavision Oy | Method for producing circuit boards comprising electronic, optical and functional features |
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