GB772231A - Improvements relating to hermetically sealed electric circuit elements - Google Patents

Improvements relating to hermetically sealed electric circuit elements

Info

Publication number
GB772231A
GB772231A GB2142752A GB2142752A GB772231A GB 772231 A GB772231 A GB 772231A GB 2142752 A GB2142752 A GB 2142752A GB 2142752 A GB2142752 A GB 2142752A GB 772231 A GB772231 A GB 772231A
Authority
GB
United Kingdom
Prior art keywords
glass
tube
lead
wire
crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2142752A
Inventor
William Joseph Scott
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Thomson Houston Co Ltd
Original Assignee
British Thomson Houston Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Thomson Houston Co Ltd filed Critical British Thomson Houston Co Ltd
Priority to GB2142752A priority Critical patent/GB772231A/en
Priority to GB2420356A priority patent/GB772232A/en
Priority to FR1082396D priority patent/FR1082396A/en
Publication of GB772231A publication Critical patent/GB772231A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/32—Seals for leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Details Of Resistors (AREA)

Abstract

772,231. Rectifiers; glass to metal seals. BRITISH THOMSON-HOUSTON CO., Ltd. Aug. 18, 1953 [Aug. 26, 1952], No. 21427/52. Classes 36 and 37. An electric circuit element such as a crystal diode or thermistor is enclosed in a glass tubular envelope, and the glass at the region where the final seal is made to a lead-in conductor, is thicker than the wall of the tube, so as to resist the expansive effect of the trapped air in the envelope. In Fig. 3, the lead-in wire 7 of electrode 6 is sealed in one end of a glass tube 1. Crystal 3 is supported on lead-in wire 5 which is surrounded by a thick glass tube portion 8. Heat is applied to seal tube 8 to tube 1, and wire 5 to tube 8. The additional strength provided by tube 8 prevents the glass, even when plastic, from being deformed by the pressure due to expansion of the air in the cavity. To avoid heat damage to the crystal, the lead-in wires may consist of a low heat conductivity alloy such as iron-nickel cobalt, or iron-nickel, which may be partly copper coated, and borated or glass covered to aid sealing. A getter may be included in the assembly.
GB2142752A 1952-08-26 1952-08-26 Improvements relating to hermetically sealed electric circuit elements Expired GB772231A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB2142752A GB772231A (en) 1952-08-26 1952-08-26 Improvements relating to hermetically sealed electric circuit elements
GB2420356A GB772232A (en) 1952-08-26 1952-08-26 Improvements relating to hermetically sealed electric circuit elements
FR1082396D FR1082396A (en) 1952-08-26 1953-08-25 Sealed enclosure devices incorporating an electrical circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2142752A GB772231A (en) 1952-08-26 1952-08-26 Improvements relating to hermetically sealed electric circuit elements

Publications (1)

Publication Number Publication Date
GB772231A true GB772231A (en) 1957-04-10

Family

ID=10162770

Family Applications (2)

Application Number Title Priority Date Filing Date
GB2142752A Expired GB772231A (en) 1952-08-26 1952-08-26 Improvements relating to hermetically sealed electric circuit elements
GB2420356A Expired GB772232A (en) 1952-08-26 1952-08-26 Improvements relating to hermetically sealed electric circuit elements

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB2420356A Expired GB772232A (en) 1952-08-26 1952-08-26 Improvements relating to hermetically sealed electric circuit elements

Country Status (2)

Country Link
FR (1) FR1082396A (en)
GB (2) GB772231A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3325586A (en) * 1963-03-05 1967-06-13 Fairchild Camera Instr Co Circuit element totally encapsulated in glass

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3325586A (en) * 1963-03-05 1967-06-13 Fairchild Camera Instr Co Circuit element totally encapsulated in glass

Also Published As

Publication number Publication date
FR1082396A (en) 1954-12-29
GB772232A (en) 1957-04-10

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