GB528120A - Improvements in or relating to soldering devices - Google Patents

Abstract

528,120. Soldering. BOGNER, P. April 19, 1939, No. 11827. [Class 83 (iv)] In closing a small aperture through which a rip-wire in a can closure protrudes solder is applied over the aperture from an upwardly directed surface of a solderapplying member, the solder being fed upwardly through a passage in the member at least partly by capillary action. In one form a block 1 placed on an electrically or gas heated hot plate 2 has a reservoir 3 for molten solder which communicates by a hole 8 and a capillary hole 7 with a tip 4 having its upper surface 5 slightly above the solder level in the reservoir and provided with a groove 6 forming the solder applying surface on which the closure is placed. The hole 21 in the closure through which the rip wire is passed as described in Specification 527,010 is thus soldered. In conjunction with a capillary bore pressure may be applied to the surface of the solder by a plunger or air compressor. The supply of solder to the surface 6 may also be maintained by raising the reservoir relatively to the tip in which case a construction such as Fig. 8 may be used in which a separately heated solder reservoir 3 is connected by a flexible pipe 40 to an electrically-heated soldering tip 38. In a modification of Fig. 1, the tip may be detachable and consist of carbon. In another form the tip may be carried by a perforated block partially immersed in a bath of molten solder. A portion of the tip may be heat insulated from the rest and provided with a passage for supply of flux. In another form, Fig. 6, solder 16 may be fed in wire or strip form through an electrically heated block 17, the tip having two capillary solder passages 7, 28 and an insulated portion 29 having a passage 15 for flux. The hole 21 may be soldered at the same time as the loop 32 is soldered at 33 to the top of the closure by a device having a pair of tips 4, 35, Fig. 7. Specification 123,553, [Class 83 (iv)], also is referred to.