CN104551294B - Solder unit and soft soldering method - Google Patents
Solder unit and soft soldering method Download PDFInfo
- Publication number
- CN104551294B CN104551294B CN201410433159.2A CN201410433159A CN104551294B CN 104551294 B CN104551294 B CN 104551294B CN 201410433159 A CN201410433159 A CN 201410433159A CN 104551294 B CN104551294 B CN 104551294B
- Authority
- CN
- China
- Prior art keywords
- metal derby
- mentioned
- scolding tin
- pipe
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/063—Solder feeding devices for wire feeding
Abstract
The simple solder unit of the structure of the invention that the second best in quality solder of function progress is provided.Solder unit (10) have metal derby (20), the ceramic tube (30) set to perforation metal derby (20) along the vertical direction, the heater (40) heated to metal derby (20), detection metal derby (20) temperature temperature sensor (50) and metal derby (20) is fixed on soft soldering apparatus base station heat insulating member (60).The insert scolding tin wire rod (31) in ceramic tube (30), and scolding tin wire rod (31) melts in ceramic tube (30).
Description
Technical field
The present invention relates to solder unit and soft soldering methods.
Background technology
As the method for solder electronic unit, probably it is divided into the type of flow and reflux type.Wherein, the type of flow be
Melting in advance, which has, impregnates substrate, the terminal of solder object to carry out the method for solder in the solder bath of scolding tin.Solder bath
Type has the jet flow for making scolding tin liquid level wave inception (wave founds て Ru) and the dipping formula for not making solder liquid level wave inception.
The soft soldering apparatus of jet flow is for example recorded in patent document 1.
In addition, the dipping formula soft soldering apparatus of small-sized solder bath is used for example to be documented in patent document 2,3.
Existing technical literature
Patent document 1：International Publication No. 2012/143966
Patent document 2：Japanese Unexamined Patent Publication 6-23533 bulletins
Patent document 3：Japanese Unexamined Patent Publication 2005-40823 bulletins
Invention content
The technical problems to be solved by the invention
However, the soft soldering apparatus of the eruption mode recorded in patent document 1 is other than solder bath, it is also necessary to motor,
Spray unit, so as to there is the shortcomings that apparatus structure enlargement.In addition, since solder bath is larger so fever is larger, so as to there is consumption
The shortcomings that electricity is also larger.
In the device recorded in patent document 2,3, with needing and make the solder bath split that scolding tin melts and to solder bath
Scolding tin feedway that is close and discretely supplying scolding tin wire rod to solder bath from solder bath, so as to there is apparatus structure enlargement
The shortcomings that.
Also, in previous soft soldering apparatus, also worry because the quality of scolding tin drops in the oxidation film generated in solder bath
Low situation.
The present invention considers the above and completes that the structure that offer can carry out the second best in quality solder is simple
Solder unit and soft soldering method.
One mode of the solder unit of the present invention is characterized in that having：
Metal derby；
Pipe is set, by the thermal conductivity substance smaller than above-mentioned metal derby and/or specific heat capacity with penetrating through above-mentioned metal derby
The substance bigger than above-mentioned metal derby is formed, and inserts scolding tin wire rod in hollow portion；And
Heater heats above-mentioned metal derby.
One mode of the soft soldering method of the present invention is to have used the soft soldering method of solder unit, the solder list
Member has：
Metal derby；
Pipe, set with penetrating through above-mentioned metal derby along the vertical direction, by the thermal conductivity substance smaller than above-mentioned metal derby and/
Or the substance composition that the above-mentioned metal derby of specific heat ratio is big, and insert scolding tin wire rod in hollow portion；And heater, to above-mentioned
Metal derby is heated,
Above-mentioned soft soldering method is characterised by comprising：
Above-mentioned metal derby is heated to the process of set point of temperature by above-mentioned heater；
Above-mentioned scolding tin wire rod and the process for generating melting scolding tin in the upper part of above-mentioned pipe are supplied from the lower end of above-mentioned pipe；
And
Installing component is made to contact the process to carry out solder with above-mentioned melting scolding tin.
The effect of invention is as follows.
According to the present invention, it can be achieved that the simple solder unit of the structure that the second best in quality solder can be carried out and soft
Method for welding.
Description of the drawings
Fig. 1 is the stereogram of the structure for the solder unit for representing embodiment.
Fig. 2 is the stereogram near the upper end of amplification expression pipe.
Fig. 3 A are the side views for illustrating the action of present embodiment.
Fig. 3 B are the side views for illustrating the action of present embodiment.
Fig. 4 is the stereogram for the other configuration examples for representing solder unit.
Fig. 5 is the sectional view for the other configuration examples for representing pipe.
The explanation of symbol
10-solder unit, 20-metal derby, 30,81,82-ceramic tube, 31-scolding tin wire rod, 40,90-heating
Device, 50-temperature sensor, 60-heat insulating member.
Specific embodiment
Hereinafter, embodiments of the present invention are described in detail with reference to attached drawing.
Fig. 1 is the stereogram of the structure for the solder unit for representing embodiments of the present invention.Solder unit 10 has
Metal derby 20, the along the vertical direction ceramic tube 30 of 20 ground of perforation metal derby setting, the heater 40 of heatable metal block 20, detection gold
The thermal insulation of the temperature sensor 50 for belonging to the temperature of block 20 and the base station (not shown) that metal derby 20 is fixed on to soft soldering apparatus
Component 60.
Metal derby 20 is made of iron.But metal derby 20 can also be made of the metal other than iron.
The upper end on the top of ceramic tube 30 is prominent slightly from the upper surface of metal derby 20.In contrast, under ceramic tube 30
Portion is significantly protruded from the lower surface of metal derby 20.Scolding tin wire rod 31 is inserted in ceramic tube 30.The hollow space of ceramic tube 30
Diameter it is more slightly larger than 31 diameter of scolding tin wire rod so that scolding tin wire rod 31 in ceramic tube 30 can on one side and ceramic tube 30 interior table
Face contact is dynamic up and down on one side.The 31 not shown handle part of scolding tin wire rod exposed downwards from ceramic tube 30 is held, the solder reduction
Material 31 is moved upward specified amount by the handle part with defined timing.
In addition, ceramic tube 30 is screwed on gold by screw element (Fig. 3 A, Fig. 3 B) 32 in a manner of it can freely remove
Belong to block 20.Ceramic tube 30 can remove from metal derby 20 and be cleaned or easily carry out changing size more as a result,
It changes.For example, can be according to solder object, and easily it is changed to the different ceramic tube 30 of hollow space diameter.
As heater 40, the cartridge heater with heating wire has been used.Heater 40 is located at metal with heating part
The mode of the inside of block 20 is installed on metal derby 20.If to 40 streaming current of heater, heating part fever, so as to heat gold
Belong to block 20.In addition, as heater 40, the heater in addition to cartridge heater such as ceramic heater can also be used.
Temperature sensor 50 is installed on metal derby 20 in a manner of the inside that sensing detection part is located at metal derby 20.By temperature
The control unit of temperature detection result to heater 40 transmission (not shown) that degree sensor 50 obtains, based on temperature detection result pair
Heater 40 is controlled such that the temperature of metal derby 20 becomes set point of temperature.The set point of temperature is to refer to make scolding tin wire rod 31
The temperature of melting.
Heat insulating member 60 is for example made of calcium silicates.It is solid via heat insulating member 60 in the base station (not shown) of soft soldering apparatus
Surely there is metal derby 20, the heat so as to prevent the metal derby 20 after heating is transmitted to base station (not shown).
Next, using Fig. 3 A and Fig. 3 B, the action of present embodiment is illustrated.
Metal derby 20 is heated to set point of temperature by solder unit 10 by heater 40 first.Next, as shown in Figure 3A,
Be inserted into scolding tin wire rod from the downside of ceramic tube 30, padding solder material 31 on handle part (not shown) until the scolding tin wire rod 31 it is upper
Show from the upper end of ceramic tube 30 at end.Then, the scolding tin wire rod 31 of the upper position of ceramic tube 30 is due to the warm of metal derby 20
Melting, from the upper end of ceramic tube 30, shows the scolding tin of melting.
Specifically, as shown in Figure 3A, scolding tin wire rod 31 is in ceramic tube 30 and upper in the lower end than metal derby 20
As the state of melting, become the state not melted on the lower in the lower end than metal derby 20.This is because the heat transfer of ceramics
Property is very low.That is, for the ceramic tube 30 of the part protruded than 20 downward side of metal derby, due to ceramics heat conductivity compared with
It is low so be difficult to become high temperature, as a result, in the ceramic tube 30 of the part protruded in downward side, scolding tin wire rod 31, which is to maintain, not to be melted
Melt constant wire rod.As a result, the hollow space of the lower part of ceramic tube 30 is blocked by scolding tin wire rod 31, so in ceramic tube 30
Upper position melting scolding tin it is not sagging downwards from ceramic tube 30.In addition, the lower position due to ceramic tube 30
Scolding tin wire rod 31 is not melted so surface tension is not generated, so as to swimmingly be moved in pipe 30.As a result, do not generate by
Blockage caused by surface tension, from also being able to make caliber for path.
On the other hand, since the scolding tin melted in the ceramic tube 30 of embedment metal derby 20 by primary heating is by thermal conductivity
Relatively low ceramic tube 30 covers, so heat is difficult to spread.As a result, melting scolding tin is not easy to cool off, so as to keep molten state.
That is, the scolding tin near the upper end of ceramic tube 30 temporarily melted maintains melting state.In fact, as shown in Fig. 2, melting scolding tin because
Surface tension and showed with the state expanded upward from the front end of ceramic tube 30.
If in this way, the generation melting scolding tin in ceramic tube 30, as shown in Figure 3B, makes installation by handling device (not shown)
It moves to be immersed in pipe from the upper end of ceramic tube 30 in the terminal 72 of the electronic unit 71 of substrate 70.Scolding tin is attached to as a result,
Terminal 72 and substrate 70 and carry out solder.
If the solder of an electronic unit terminates, handling device makes the electronic unit be left from solder unit 10,
And it goes to take next electronic unit.At this point, the handle part of scolding tin wire rod 31 is held in the lower section of ceramic tube 30 by scolding tin wire rod 31
Specified amount is above pushed away upward.Pushing volume (length) is the amount of scolding tin consumed in a solder before supplementing on this, i.e., until melting
Scolding tin is showed from the front end of ceramic tube 30.But padding solder material 31 can also be gone up until melting scolding tin from the front end of ceramic tube 30
It overflows slightly.In such manner, it is possible to the oxidation film generated in a solder before removing completely.
If padding solder material 31 upper like this, the same for the previous, the scolding tin of the upper position of ceramic tube 30 becomes molten
Melt state, so terminal 72 is immersed in the upper end of ceramic tube 30 to carry out solder the same for the previously.In this way, by anti-
Carry out padding solder material 31 again and in the process of the upper position generation melting scolding tin of ceramic tube 30 and by next solder
Object is immersed in the process in melting scolding tin, to carry out solder successively to multiple solder objects.
As described above, according to the present embodiment, solder unit 10 has metal derby 20, penetrates through metal derby along the vertical direction
The ceramic tube 30 of 20 ground setting and the heater 40 of heatable metal block 20, so as to realize the second best in quality of solder
And solder unit 10 simple in structure.Specifically, structure according to the present embodiment can obtain following effect.
Due to being only a small amount of scolding tin of 30 front end of melting tube, for make scolding tin melt heat it is less.Cause
And the influence of heat will not be generated to surrounding.In addition, due to utilizing scolding tin wire rod 31, and only melt the front end of scolding tin wire rod 31,
So the structure of heating part can be made simple.Since heating, adiabatic number of components can be reduced, and reduce to peripheral device
The influence of heat, so being capable of the cost of restraining device entirety.
Due to being only sent into scolding tin wire rod 31 to pipe 30, so the device for supplying soldering tin material can be simplified.
Since the melting scolding tin contacted with air is only 30 front end of pipe, so can the generation of oxidation film be suppressed to irreducible minimum
Degree.In addition, due to supplying scolding tin by being pushed into scolding tin wire rod 31, so being always supplied with new scolding tin.As a result, without scolding tin
Deterioration, so as to improve the quality of solder.
During solder, since the scolding tin of melting is moved to 70 side of substrate, so only remaining a small amount of melt in the front end of pipe 30
Melt scolding tin.As a result, copper-based of substrate 70 is not moved to the melting scolding tin side of the front end of pipe 30.
Due to not using solder bath, so no oxidation film incorporates scolding tin or is mixed into the situation of impurity, so as to improve
The quality of solder.
Due to buying scolding tin wire rod 31 with being consistent with the production quantity for carrying out solder, so can be by initial cost
It is suppressed to less.
For cleaning, can just it be carried out due to removing ceramic tube 30 from metal derby 20, so simply.
In addition, in above-mentioned embodiment, the situation for using ceramic tube 30 is illustrated, but the material of pipe and unlimited
In ceramics, in a word using the big substance of the thermal conductivity substance smaller than metal derby 20 and/or specific heat ratio metal derby 20.
Simply illustrate.Specific heat capacity refers to the thermal capacity of the unit mass relative to substance, once improves unit matter
The required heat of temperature of the substance of amount.Thermal conductivity refer to heat transfer by the vertical unit area of flowing with heat and
The heat divided by the value of the temperature difference (temperature gradient) of per unit length flowed in unit interval.Thermal conductivity represents the heat transfer of substance
Easness, the also referred to as coefficient of heat conduction.
The specific heat capacity and thermal conductivity of the substance represented are represented in table 1.
Table 1
In the case where using iron as metal derby 20, the material of pipe 30 is preferably silica, silicon nitride, silicon carbide, stone
Any one in English glass.Particularly, the mechanical strength of aluminium oxide, insulating properties, high-frequency loss, thermal conductivity, heat resistance, wear-resisting
Damage property, corrosion resistance are good, so as to preferably.
In addition, the pipe 30 for being installed on metal derby 20 is not limited to one, can set as shown in Figure 4 two ceramic tubes 81,
82, the pipe of three or more can also be set.In the case where metal derby 20 is equipped with multiple pipes, their diameter can be identical,
It can also be different.In addition, in Fig. 4, the heater 90 with temperature adjustment function for being built-in with temperature sensor is installed on metal derby
20。
Also, pipe 30 is not limited to cylindrical shape, can also the use of front end be as shown in Figure 5 horn-like pipe.If use this
Terminal even if then the thickness of the terminal 72 of solder object is thicker than caliber, can be also immersed in the front end of pipe 30 by the pipe 30 of sample.
In addition, in above-mentioned embodiment, move 70 side of substrate, but since the solder unit of the present invention is very small
Type, so 10 side of solder unit can also moved.
Above-mentioned embodiment only illustrates an example of materialization when implementing the present invention, not by above-mentioned
Embodiment to limit explains the technical scope of the present invention.That is, the present invention is without departing from its purport or its main spy
Sign, it will be able to implement in various ways.
Industrial utilizability
The present invention can be suitable for having used the solder unit and soft soldering method of scolding tin wire rod.
Claims (5)
1. a kind of solder unit, which is characterized in that have：
Metal derby；
Pipe, is set with penetrating through above-mentioned metal derby along the vertical direction, and the upper end on the top of the pipe is from the upper surface of above-mentioned metal derby
Prominent slightly, lower part is significantly protruded from the lower surface of above-mentioned metal derby, by the thermal conductivity substance smaller than above-mentioned metal derby and/
Or the substance composition that the above-mentioned metal derby of specific heat ratio is big, and insert scolding tin wire rod in hollow portion；And
Heater heats above-mentioned metal derby,
Above-mentioned scolding tin wire rod conveys from bottom to top in above-mentioned pipe.
2. solder unit according to claim 1, which is characterized in that
Above-mentioned pipe is ceramics.
3. solder unit according to claim 2, which is characterized in that
Above-mentioned pipe is aluminium oxide.
4. solder unit according to any one of claims 1 to 3, which is characterized in that
It is also equipped with detecting the sensor of the temperature of above-mentioned metal derby or above-mentioned heater,
The heating of above-mentioned heater is controlled based on the testing result of the sensor.
5. a kind of soft soldering method, it uses solder unit, which has：
Metal derby；
Pipe, is set with penetrating through above-mentioned metal derby along the vertical direction, and the upper end on the top of the pipe is from the upper surface of above-mentioned metal derby
Prominent slightly, lower part is significantly protruded from the lower surface of above-mentioned metal derby, by the thermal conductivity substance smaller than above-mentioned metal derby and/
Or the substance composition that the above-mentioned metal derby of specific heat ratio is big, and insert scolding tin wire rod in hollow portion；And
Heater heats above-mentioned metal derby,
Above-mentioned scolding tin wire rod conveys from bottom to top in above-mentioned pipe,
Above-mentioned soft soldering method is characterised by comprising：
Above-mentioned metal derby is heated to the process of set point of temperature by above-mentioned heater；
Above-mentioned scolding tin wire rod and the process for generating melting scolding tin in the upper part of above-mentioned pipe are supplied from the lower end of above-mentioned pipe；And
Installing component is made to contact the process to carry out solder with above-mentioned melting scolding tin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-219233 | 2013-10-22 | ||
| JP2013219233A JP6146257B2 (en) | 2013-10-22 | 2013-10-22 | Soldering unit and soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104551294A CN104551294A (en) | 2015-04-29 |
| CN104551294B true CN104551294B (en) | 2018-06-22 |
Family
ID=53011694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410433159.2A Expired - Fee Related CN104551294B (en) | 2013-10-22 | 2014-08-28 | Solder unit and soft soldering method |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6146257B2 (en) |
| CN (1) | CN104551294B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB528120A (en) * | 1939-04-19 | 1940-10-23 | Peter Bogner | Improvements in or relating to soldering devices |
| CN2115852U (en) * | 1992-02-21 | 1992-09-16 | 吴泽民 | Tin soldering bit for quick welding electronic device |
| JPH05343842A (en) * | 1992-06-08 | 1993-12-24 | Shigenaga Nagata | Method and apparatus for soldering |
| CN1443622A (en) * | 2002-03-08 | 2003-09-24 | Esec贸易公司 | Method and device for distributing welding flux on base |
| JP2004209506A (en) * | 2002-12-27 | 2004-07-29 | Nec Machinery Corp | Nozzle for supplying brazing filler metal |
| CN201565692U (en) * | 2009-11-10 | 2010-09-01 | 鞍钢房地产开发集团有限公司 | Tin heating pipe for soldering tin for electrical lead |
| CN202377634U (en) * | 2010-08-12 | 2012-08-15 | 赵一帆 | Injection-type soldering iron tip used for supplying tin |
| CN202498281U (en) * | 2012-01-09 | 2012-10-24 | 广东益翔自动化科技有限公司 | Preheating device of soldering robot |
| CN102935534A (en) * | 2012-11-22 | 2013-02-20 | 王峰 | Practical electric soldering iron |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4949159A (en) * | 1972-09-19 | 1974-05-13 | ||
| JPH02229669A (en) * | 1989-03-01 | 1990-09-12 | Arumetsuku Hongo:Kk | Soldering device |
| JPH11342466A (en) * | 1998-05-29 | 1999-12-14 | Kyocera Corp | Solder jetting device |
-
2013
- 2013-10-22 JP JP2013219233A patent/JP6146257B2/en not_active Expired - Fee Related
-
2014
- 2014-08-28 CN CN201410433159.2A patent/CN104551294B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB528120A (en) * | 1939-04-19 | 1940-10-23 | Peter Bogner | Improvements in or relating to soldering devices |
| CN2115852U (en) * | 1992-02-21 | 1992-09-16 | 吴泽民 | Tin soldering bit for quick welding electronic device |
| JPH05343842A (en) * | 1992-06-08 | 1993-12-24 | Shigenaga Nagata | Method and apparatus for soldering |
| CN1443622A (en) * | 2002-03-08 | 2003-09-24 | Esec贸易公司 | Method and device for distributing welding flux on base |
| JP2004209506A (en) * | 2002-12-27 | 2004-07-29 | Nec Machinery Corp | Nozzle for supplying brazing filler metal |
| CN201565692U (en) * | 2009-11-10 | 2010-09-01 | 鞍钢房地产开发集团有限公司 | Tin heating pipe for soldering tin for electrical lead |
| CN202377634U (en) * | 2010-08-12 | 2012-08-15 | 赵一帆 | Injection-type soldering iron tip used for supplying tin |
| CN202498281U (en) * | 2012-01-09 | 2012-10-24 | 广东益翔自动化科技有限公司 | Preheating device of soldering robot |
| CN102935534A (en) * | 2012-11-22 | 2013-02-20 | 王峰 | Practical electric soldering iron |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6146257B2 (en) | 2017-06-14 |
| CN104551294A (en) | 2015-04-29 |
| JP2015080795A (en) | 2015-04-27 |
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