JPH02229669A - Soldering device - Google Patents

Abstract

PURPOSE:To entirely obviate the soldering defect generated by the excess or shortage of solder by allowing the feed rate of wire solder to be controlled by a press feeder, inserting the solder into a conduit and mounting a nozzle- shaped iron tip to the front end of the conduit. CONSTITUTION:A power source of a heater 5 is turned on and the feeding and discharging of water to and from a heat exchanger 6 are executed. The wire solder 1 in the conduit 2 turns to liquid solder 13 in a specific position 12 in the heat exchanger 6. A flux is blown from a flux nozzle 9 to a soldering part 11. The iron tip part 4 is brought into contact with the soldering part 11 to be preheated. A switch 3a is pulled to actuate the press feeder 3 and to push the wire solder 1 into the conduit 2. The liquid solder 13 is extruded from the front end of the iron tip part 4 to the soldering part 11 by as much as the solder is pushed by the press feeder 3, by which the soldering is completed. The suction of the solder from the iron tip part 4 by rotating rollers 3d backward is possible as well when the extruded amt. is excessive.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention is mainly applicable to printed wiring boards with high packaging density (
The present invention relates to a soldering device such as a soldering robot head or a soldering iron used when soldering electronic components to a substrate (hereinafter referred to as a board).

[Conventional technology]

Conventional soldering equipment includes soldering irons and heads for soldering robots that are equipped with thread solder supply devices that supply thread solder to the tips and heads. I started to solder while melting the thread solder.

On the other hand, in order to increase the mounting density of the board, the two-sided mounting method, in which electronic components are mounted on the front and back sides of the board, and the use of chip components are being adopted, and the spacing between each soldering point is becoming narrower. It's coming.

[Problem that the invention seeks to solve]

However, with the above-mentioned soldering device equipped with a thread solder supply device, it is not possible to precisely adjust the amount of thread solder that melts due to the heat of the iron tip or the tip of the head, so there is no There was a risk that the amount of solder attached would be too much or too little, which could cause a failure. For example, if the amount of solder is small, the bonding strength will be insufficient, and there is a risk that the wire will break due to a slight impact. Furthermore, if there is a large amount of solder, there is a risk of short circuiting with adjacent soldering points. This is becoming an increasingly important issue as packaging density increases. For this reason, a solder suction device was sometimes installed to suck out excess solder.

Furthermore, when aiming for higher density through the extensive use of chip components, the installation of laser soldering equipment and associated equipment, and the use of cream solder, lead to an increase in the scale of the equipment and a corresponding significant increase in costs. There was a problem with inviting people.

Therefore, the present invention has been made based on the above circumstances,
The purpose of the present invention is to provide a soldering device that can perform soldering work reliably and at low cost even when the spacing between soldering points is narrow by accurately supplying liquid solder to the soldering points in the correct quantity and quantity. shall be.

[Means to solve the problem]

In order to achieve the above object, the soldering device according to the present invention is provided with a conduit into which the thread solder is inserted so as to be extrudable, on the delivery side of a pressure feeder whose feeding amount is adjustable, which pumps the thread solder, and a nozzle at the tip of the conduit. In addition to attaching a shaped iron tip, a cooling heat exchanger is attached to the pressure feeder side of the conduit, and a heater for melting thread solder is attached to the iron tip side.

[For production]

In the soldering device according to the present invention, the thread solder is melted in the middle of the conduit, and the liquid solder is extruded from the nozzle-shaped iron tip to the soldering location, and the amount of extrusion is adjusted by a pressure feeder, and the melted location is heated. The exchanger and heater are installed at appropriate locations.

〔Example〕

Hereinafter, a soldering device according to the present invention will be specifically explained with reference to the drawings.

First, FIG. 1 shows a usage state diagram of a soldering iron 20, which is an embodiment of a soldering apparatus according to the present invention, and a pressure feeder 3 with an adjustable feed rate that pressure-feeds thread solder 1 to a conduit 2, which will be described later. and a conduit 2 into which the thread solder 1 is inserted in a state in which they are almost in close contact with each other.
, a nozzle-shaped iron tip 4 provided at the tip of the conduit 2, a heater 5 provided around the iron tip 4 side of the conduit 2, and a
The main component is a cooling heat exchanger 6 provided around the pumping machine 3 side. The pressure feeder 3 consists of a motor 3b operated by a switch 3a and a roller 3d interlocked with the motor 3b via a deceleration mechanism 3c.
The main body force bar 19 covers the entire body except for. The heat exchanger 6 is provided with a water supply hose 6a and a drainage hose 6b through which cooling water enters and exits, and these extend from the rear end of the main body force bar 19. Further, a guide pipe 21 is provided from the rear end of the main body force bar 19 toward the roller 3d. Further, a flux tank 8 is provided in the grip part 7 of the soldering iron 20, a flux injection nozzle 9 communicating with the flux tank 8 is provided close to the iron tip part 4, and a button (not shown) provided at an appropriate location is provided. When pressed, liquid flux is sprayed from the tip of the flux spray nozzle 9.

Next, a method of using the soldering iron 20 according to the present invention will be explained. First, the heater 5 is turned on, and the heat exchanger 6 is supplied with water. Then, the thread solder 1 in the conduit 2 is remelted into liquid solder 13 at a tip end side of a specific position (remelting position) 12 in the heat exchanger 6. While holding the grip part 7, bring the tip of the iron tip 4 close to the soldering part 11 of the board 10, and from the flux injection nozzle 9 to the soldering part 11
Spray flags on. Subsequently, the tip of the soldering iron tip 4 is brought into contact with the soldering part 11 and preheated. Then, the trigger-like switch 3a is pulled to operate the pressure feeder 3.

Then, the thread solder 1 is pushed into the conduit 2 little by little, so that the liquid solder 13 in the conduit 2 and the soldering iron tip 4 on the distal side of the remelting position 12 is pushed from the tip of the soldering iron tip 4. The non-soldering work is completed by solidifying the liquid solder 13. This amount of extrusion can be accurately adjusted by controlling the switch 3a.

Furthermore, if the amount of extrusion is a little excessive, it is also possible to suction it from the tip portion 4 by reversing the roller 3d. The soldering iron 20 of the present invention is thus used to solder each soldering part 11 in sequence and accurately.

Next, a head 16 for a soldering robot, which is another embodiment of the present invention, will be described. Figure 2 shows the head 1 of the present invention.
6, in which a soldering iron 16 consisting of a pressure feeder 3, a cooling heat exchanger 6, a heater 5, and an iron tip portion 4 is attached to the tip of an arm 15 of a soldering robot 14. ing. This head 16 has the same basic configuration as the soldering iron 20 described above, and although not shown in the figure, a heat exchanger 6
It has a conduit 2 passing through the heater 5 and the heater 5, and a nozzle-shaped soldering iron tip 4 is attached to the tip of the conduit 2. Also this robot 14
The controller 17 controls the position of the head 16 on the substrate 10.
Of course, it can be moved in accordance with the soldering part 11 of
In addition to controlling the supply and drainage of cooling water to the heat exchanger 6 and the supply of electricity to the heater 5, the amount of liquid solder 13 extruded to each soldering part 11 is strictly managed by controlling the operation of the pressure feeder 3.
Also, the flux is sprayed before soldering. The reference numeral 18 in the figure is a thread solder drum for supplying the thread solder 1 to the head 1B. Here, a feeding device for the thread solder 1 may be provided in the middle of the feeding system for the thread solder 1, and the feeding device and the pressure feeder 3 may be synchronized to smooth the supply of the thread solder 1.

〔Effect of the invention〕

As described above, the soldering device according to the present invention feeds thread solder into a conduit using a pressure feeder whose feed rate can be adjusted, converts the thread solder into liquid solder with a heater in the middle of the conduit, and uses a nozzle provided at the tip of the conduit. Since the liquid solder is extruded from the tip of the soldering iron to the soldering area, the amount of liquid solder extruded can be accurately adjusted to a very small amount by adjusting the feed rate of the pressure feeder. Therefore, by using the device of the present invention, it is possible to completely eliminate soldering defects that have conventionally occurred due to excess or deficiency of solder. This is particularly effective in the case of high-density mounting boards or double-sided mounting boards in which many soldering points are close to each other, making it possible to further increase the density and greatly increase the yield of products. In addition, the device of the present invention has a simple structure and uses inexpensive thread solder, which has been widely used in the past.
Compared to laser soldering equipment that uses cream solder, which is considered promising for soldering high-density mounting boards, equipment costs and material costs can be kept low.

As described above, the apparatus of the present invention can accurately perform soldering work on high-density mounting boards at low cost, and can greatly improve productivity.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway usage state diagram showing one embodiment of the soldering device according to the present invention, FIG. 2 is a usage state diagram showing another embodiment of the present invention device, and FIG. 3 is the basics of the present invention. It is a conceptual diagram.

Claims (1)

[Claims] 1. A conduit (2) into which the thread solder (1) is inserted so as to be extrudable is provided on the delivery side of a pressure feeding machine (3) which is capable of feeding the thread solder (1) under pressure, and the tip of the pipe (2) is At the same time, a cooling heat exchanger (6) is attached to the pressure feeder (3) side of the conduit (2), and a nozzle-shaped iron tip (4) is attached to the iron tip (4).
A soldering device characterized in that a heater (5) for melting thread solder is attached to the side.