JP4413415B2 - Molding apparatus and molding method for electronic component mounted on hoop frame - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a molding apparatus for an electronic component such as a semiconductor chip mounted on a hoop frame, and an improvement of the molding method.
[0002]
[Prior art]
In general, an electronic component such as a semiconductor device includes a process for mounting a semiconductor chip on a lead frame, a wire bonding process for electrically connecting the semiconductor chip and the lead with a fine metal wire, and a mold for sealing the semiconductor chip with an epoxy resin or the like. It is manufactured through procedures such as processes.
[0003]
Even in a lead frame on which a semiconductor chip is mounted, in the manufacture of electronic components such as smaller semiconductor devices, a long, so-called hoop-shaped lead frame (hereinafter referred to as a hoop-like lead frame) formed by sequentially adding individual lead frames in the longitudinal direction by welding or the like. Often referred to herein as a hoop frame).
[0004]
3 is a block diagram of a molding apparatus for molding electronic components such as semiconductor chips mounted on a conventional hoop frame. FIG. 4A is an enlarged plan view of the hoop frame shown in FIG. ) Is a front view of the hoop frame shown in FIG.
[0005]
That is, as shown in FIGS. 3 and 4, the molding apparatus for electronic components mounted on a conventional hoop frame is shown in FIG. 3 is forwardly transferred in a fixed direction indicated by an arrow X, and a mold (sealing) press by a resin member of the electronic component 1 over a predetermined length L is sequentially performed by pressing the molds 41 and 42 in the molding means 4. .
[0006]
In the press operation in the mold means 4, if the joint 2 a of the hoop frame 2 is pressed between the upper and lower molds 41, 42 of the mold means 4, a raised portion such as welding protruding on the surface of the hoop frame 2 is formed. The parting line surfaces of the upper and lower molds 41 and 42 were damaged.
[0007]
Therefore, in the conventional molding apparatus, the detection means 5 for detecting the joint 2a in advance and the control means 6 for receiving the detection signal from the detection means 5 are installed in front of the molding means 4, and the detection means 5 is connected to the joint 2a. The control device 6 is configured to immediately stop the operations of the transfer means 31 and 32 and the mold means 4 and to issue an alarm by the alarm device 7 to notify the worker of the detection of the joint 2a. It had been.
[0008]
Therefore, when an alarm is issued by the alarm device 7, the operator manually operates the seam 2a position of the hoop frame 2 as shown in FIG. The mold press operation by the stopped mold means 4 and the transfer operation of the hoop frame 2 by the transfer means 31 and 32 were started to resume.
[0009]
As described above, when the joint 2a is detected by the detection means 5, the control device 6 automatically stops the transfer means 31, 32 and the molding means 4, and the worker uses the detected joint 2a due to the structure. Since the feed means 31 is sent out so as to be located outside the transfer means 31, when the transfer means 31, 32 and the molding means 4 are stopped, as shown in FIG. The mold press for the electronic component 1 was restarted in a state where the mold means 4 and the unmolded portion L2 up to the joint 2a were added (L1 + L2).
[0010]
3 and 5, for example, a thickness detector is used as the detection means 5, and one transfer means 31 is the same as the feed hole 2b provided in the lead frame 2 shown in FIG. 4 (a). A gear (spoke) having feed pitch projections of the pitch is driven by a servo motor, and the other transfer means 32 is configured as a driven gear of the transfer means 31.
[0011]
[Problems to be solved by the invention]
As described above, in the molding apparatus for electronic components mounted on the conventional hoop frame, when the detection means 5 detects the joint 2a, the operator manually operates the stopped transfer means 31 and 32, and the hoop frame. The operation is performed so that the position of the second seam 2a is located outside the transfer means 31 on the delivery side, and the mold operation is resumed.
[0012]
As described above, in the conventional electronic device molding apparatus using the hoop frame, when the detection unit 5 detects the joint 2a, the transfer units 31 and 32 and the molding unit 4 are temporarily stopped to transfer the joint 2a of the hoop frame 2. Since it was sent to the outside position of the means 31 and restarted afterwards, a reduction in work efficiency was unavoidable, and since the mold press was restarted with at least the unmolded portion of the hoop frame 2 remaining in advance, The mounted electronic component 1 is often wasted, and some improvement has been demanded.
[0013]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a molding apparatus and a molding method for an electronic component mounted on a hoop frame, which can eliminate the waste of the electronic component mounted as well as the hoop frame and can efficiently mold press the electronic component. And
[0014]
[Means for Solving the Problems]
The first invention is a molding apparatus for electronic components mounted on hoop frame, a transfer means for transferring the forward hoop frame directed, detects a seam of the hoop frame to be transferred to a constant direction by the transport means detection means for the mold section in which the said hoop frame transferred by the transfer means to sequentially mold the electronic component mounted on the hoop frame by synchronized pressing operation to the forward transfer operation, the by the detection means When a seam is detected, the transfer means and the molding means are controlled to mold press an unmolded portion between the seam position and a position recently molded by the molding means, and the unmolded portion of the unmolded portion is controlled . After the mold press is finished, the seam is the mold means. Characterized by comprising a control means for controlling said moving means so as to be positioned outside of the delivery side.
[0015]
According to a second aspect of the present invention, there is provided a method for molding an electronic component mounted on a hoop frame, wherein a seam of the hoop frame transferred in a fixed direction is detected, and the hoop frame position recently molded from the detected seam position. After detecting the length of the unmolded part up to and performing mold pressing by the molding means within the detected length of the unmolded part, the seam position is outside the feeding side of the mold means The mold press is restarted after the hoop frame is moved so as to be positioned at the position.
[0016]
As described above, according to the molding apparatus and the molding method of the electronic component mounted on the hoop frame according to the present invention, the unmolded portion between the joint position and the recently molded position is subjected to mold pressing, and the joint position. Since the hoop frame is sent out so as to be positioned outside the sending side of the mold means, the mold press work efficiency can be improved and the waste of the hoop frame and electronic parts can be greatly reduced.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of an electronic component molding apparatus and molding method using a hoop frame according to the present invention will be described in detail with reference to FIGS. The same components as those in the conventional configuration shown in FIGS. 3 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted.
[0018]
FIG. 1 is a block diagram showing an embodiment of a molding apparatus for electronic parts using a hoop frame according to the present invention. FIG. 2 shows the position of a seam after the seam of the hoop frame is detected by the apparatus shown in FIG. It is the block diagram which showed the state which transfers to and restarts mold operation.
[0019]
That is, as shown in FIG. 1, the hoop frame 2 on which the electronic component 1 such as a semiconductor chip is mounted is transferred to the hoop frame 2 of the present embodiment by the transfer means 31 and 32, as shown in FIG. In a single press operation in the mold means 4, a mold press using a resin member such as an epoxy resin is performed over a predetermined length L.
[0020]
Therefore, the detection means 5 is provided in the previous process of the molding means 4, and when the detection means 5 detects the joint 2 a in advance, the detection signal is supplied to the unmolded length detection circuit 81 of the control device 8.
[0021]
The unmolded length detection circuit 81 is supplied with a signal from a control circuit 82 that controls the pressing operation of the molding means 4, and is recently molded by the detected seam 2 a position of the hoop frame 2 and the molding means 4. A so-called unmolded length L1 up to the hoop frame position is detected.
[0022]
That is, when the detecting means 5 detects the joint 2a, if the hoop frame 2 between the upper and lower molds 41 and 42 is not yet molded by the control circuit 82, the unmolded length is L1 as shown in the figure. . When the detection means 5 detects the joint 2a, the unmolded length is (L1-L) when the hoop frame 2 already between the upper and lower molds 41, 42 is mold-pressed.
[0023]
Therefore, the unmolded length data detected by the unmolded length detection circuit 81, that is, L1 or (L1-L) is supplied to the arithmetic circuit 83, where the length ( L1 or (L1-L)) and the reference data set in the reference length (L) setting circuit 84, that is, the predetermined length (L) of the hoop frame molded by one press operation by the molding means 4. The number of mold lengths L that can be included in the length (L1 or (L1-L)) is calculated. That is, the arithmetic circuit 83 calculates the maximum number of times the mold can be pressed by the length (L1 or (L1-L)) of the unmolded portion.
[0024]
As is clear from the above description, when the detecting means 5 detects the joint 2a, at least one mold press is performed in a state where the hoop frame 2 between the upper and lower molds 41 and 42 is not molded. The unmolded length corresponding to the minute (L1> L) remains, and whether an unmolded length longer than that (for example, L1> 2L) remains is determined by the distance between the detecting means 5 and the mold means 4 ( L1-L).
[0025]
That is, after the joint 2a is detected from the arithmetic circuit 83, the mold means 4 supplies the control circuit 82 with the number of times the mold can be pressed without pressing the joint 2a. The mold unit 4 controls the mold unit 4 and the transfer units 31 and 32 so as to perform the mold press for the maximum number of times.
[0026]
The control circuit 82 also drives the transfer means 31 and 32 after the mold means 4 performs mold pressing as many times as the mold means 4 can mold press without pressing the joint 2a, as shown in FIG. Further, the position of the seam 2a of the hoop frame 2 is controlled so as to be positioned at the tip of the mold means 4, preferably immediately after the mold means 4.
[0027]
As described above, according to the molding apparatus and the molding method according to the present embodiment, the control circuit 82 uses the molding unit 4 and the molding unit 4 based on the number of mold presses included in the length of the unmolded portion L1 calculated by the arithmetic circuit 83. Since the transfer means 31 is controlled, waste of the hoop frame 2 can be minimized, and the mold means 4 and the transfer means 31 are similarly controlled so that the seam 2a is positioned outside the feed side of the mold means 4. Therefore, the mold press of the electronic component 1 can be automated, and it is not necessary for the worker to manually advance the hoop frame 2 one by one. Can be planned.
[0028]
【The invention's effect】
As described above, according to the molding apparatus and molding method for electronic components mounted on the hoop frame according to the present invention, waste of the hoop frame can be eliminated, and at the same time, the work efficiency of the mold press can be greatly improved. It can exert a remarkable effect in practical use.
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing an embodiment of a molding apparatus for electronic components mounted on a hoop frame according to the present invention.
FIG. 2 is a configuration diagram showing a state in which the apparatus shown in FIG. 1 has sent the hoop frame to the tip of the mode means where the seam position of the hoop frame is sent.
FIG. 3 is a configuration diagram showing a molding apparatus for electronic components mounted on a conventional hoop frame.
4 (a) is a plan view of a hoop frame of the apparatus shown in FIG. 3, and FIG. 4 (b) is a front view of FIG. 4 (a).
5 is a configuration diagram showing a state in which the hoop frame is sent out to the outside of the transfer means by the hoop frame in the apparatus shown in FIG. 3;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component 2 Hoop frame 2a Joint 31, 32 Transfer means 4 Mold means 41 Upper mold 42 Lower mold 4 Resin tablet 5 Joint detection means 6 Controller 7 Alarm device 8 Control means 81 Unmolded length detection circuit 82 Control circuit 83 Arithmetic circuit 84 Reference length setting circuit

Claims (3)

Transfer means for transferring the hoop frame in a forward direction in a forward direction;
Detecting means for detecting the seam of the hoop frame to be transferred to a constant direction by the transport means,
The mold means for sequentially molding the electronic component mounted on the hoop frame by a press operation of the hoop frames transferred, synchronized with the forward feed of the transfer operation by said transfer means,
When the seam is detected by the detection means, the transfer means and the molding means are controlled so as to mold press an unmolded portion between the seam position and a position recently molded by the molding means , and And a control means for controlling the transfer means so that the seam is located on the outer side of the mold means on the delivery side after the mold press of the unmolded portion is completed. Molding device for electronic parts. The control means detects a length of an unmolded portion between the seam position and a position recently molded by the mold means, and the mold means can mold-press the detected unmolded portion. by calculating the number of times, the molding apparatus of an electronic component mounted on the hoop frame according to claim 1, characterized in that to control the transfer means and the mold means so as to perform press molding of the maximum number of times. Detect the seam of the hoop frame transferred in a fixed direction,
Detecting the length of the unmolded portion from the detected seam position to the position on the recently molded hoop frame,
After the mold press of the detected unmolded portion is performed by the mold means, the hoop frame is transferred so that the joint position is located outside the feeding side of the mold means, and then the mold press is restarted. A method for molding an electronic component mounted on a hoop frame.

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