CN104551294A - Soldering unit and soldering method - Google Patents
Soldering unit and soldering method Download PDFInfo
- Publication number
- CN104551294A CN104551294A CN201410433159.2A CN201410433159A CN104551294A CN 104551294 A CN104551294 A CN 104551294A CN 201410433159 A CN201410433159 A CN 201410433159A CN 104551294 A CN104551294 A CN 104551294A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- metal derby
- scolding tin
- solder
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/063—Solder feeding devices for wire feeding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Ceramic Products (AREA)
Abstract
The invention provides a soldering unit of soldering with a simple structure and fine quality and functions. The soldering unit (10) is provided with a metal block (20), a ceramic tube (30) communicating through the metal block (20) in an up-down direction, a heater (40) used for heating the metal block (20), a temperature sensor (50) used for detecting temperature of the metal block (20) and a heat insulation part (60) enabling the metal block (20) to be fixed at a base station of a soldering device. A solder wire material (31) is plugged and connected into the ceramic tube (30) and fused into the ceramic tube (30).
Description
Technical field
The present invention relates to solder unit and soft soldering method.
Background technology
As the method for solder electronic unit, be probably divided into the type of flow and reflux type.Wherein, the type of flow be melting in advance have soak solder object in the solder bath of scolding tin substrate, terminal to be to carry out the method for solder.The type of solder bath has the jet flow making scolding tin liquid level wave inception (ripple founds て Ru) and the dipping formula not making solder liquid level wave inception.
The soft soldering apparatus of jet flow is such as documented in patent document 1.
In addition, the dipping formula soft soldering apparatus employing small-sized solder bath is such as documented in patent document 2,3.
Prior art document
Patent document 1: No. 2012/143966th, International Publication
Patent document 2: Japanese Unexamined Patent Publication 6-23533 publication
Patent document 3: Japanese Unexamined Patent Publication 2005-40823 publication
Summary of the invention
Invent technical problem to be solved
But the soft soldering apparatus of the eruption mode described in patent document 1, except solder bath, also needs motor, spray unit, thus the shortcoming having apparatus structure to maximize.In addition, because solder bath is comparatively large so heating is comparatively large, thus the shortcoming that power consumption is also larger is had.
In the device described in patent document 2,3, need with make the solder bath split of scolding tin melting ground and to solder bath close to and supply the scolding tin feedway of scolding tin wire rod discretely to solder bath from solder bath, thus the shortcoming having apparatus structure to maximize.
Further, in soft soldering apparatus in the past, the situation because the oxide-film produced at solder bath makes the quality of scolding tin reduce also is worried.
The present invention considers above aspect and completes, and it provides the simple solder unit of the structure can carrying out the second best in quality solder and soft soldering method.
The feature of a mode of solder unit of the present invention is to possess:
Metal derby;
Pipe, its through above-mentioned metal derby ground is arranged, and the material less than above-mentioned metal derby by thermal conductivity and/or the large material of the above-mentioned metal derby of specific heat ratio are formed, and insert scolding tin wire rod at hollow bulb; And
Heater, it heats above-mentioned metal derby.
A mode of soft soldering method of the present invention is the use of the soft soldering method of solder unit, and this solder unit possesses:
Metal derby;
Pipe, its through along the vertical direction above-mentioned metal derby ground is arranged, and the material less than above-mentioned metal derby by thermal conductivity and/or the large material of the above-mentioned metal derby of specific heat ratio are formed, and insert scolding tin wire rod at hollow bulb; And heater, it heats above-mentioned metal derby,
The feature of above-mentioned soft soldering method is, comprising:
By above-mentioned heater, above-mentioned metal derby is heated to the operation of set point of temperature;
Supply above-mentioned scolding tin wire rod from the lower end of above-mentioned pipe and generate the operation of melting scolding tin in the upper part of above-mentioned pipe; And
Installing component is made to contact the operation of carrying out solder with above-mentioned melting scolding tin.
The effect of invention is as follows.
According to the present invention, the simple solder unit of structure and the soft soldering method that can carry out the second best in quality solder can be realized.
Accompanying drawing explanation
Fig. 1 is the stereogram of the structure of the solder unit representing embodiment.
Fig. 2 amplifies the stereogram near the upper end representing pipe.
Fig. 3 A is the side view of the action for illustration of present embodiment.
Fig. 3 B is the side view of the action for illustration of present embodiment.
Fig. 4 is the stereogram of other configuration example representing solder unit.
Fig. 5 is the sectional view of other configuration example representing pipe.
The explanation of symbol
10-solder unit, 20-metal derby, 30,81,82-earthenware, 31-scolding tin wire rod, 40,90-heater, 50-temperature sensor, 60-heat insulating member.
Detailed description of the invention
Below, with reference to accompanying drawing, embodiments of the present invention are described in detail.
Fig. 1 is the stereogram of the structure of the solder unit representing embodiments of the present invention.Solder unit 10 have metal derby 20, earthenware 30 that through along the vertical direction metal derby 20 ground is arranged, heatable metal block 20 heater 40, detect the temperature sensor 50 of the temperature of metal derby 20 and metal derby 20 be fixed on the heat insulating member 60 of base station (not shown) of soft soldering apparatus.
Metal derby 20 is made up of iron.But metal derby 20 also can be made up of the metal beyond iron.
The upper end on the top of earthenware 30 is outstanding slightly from the upper surface of metal derby 20.On the other hand, the bottom of earthenware 30 is given prominence to significantly from the lower surface of metal derby 20.Scolding tin wire rod 31 is inserted in earthenware 30.The diameter of the hollow space of earthenware 30 is slightly larger than scolding tin wire rod 31 diameter, can contact move up and down on one side to make scolding tin wire rod 31 in earthenware 30 with the inner surface of earthenware 30.The scolding tin wire rod 31 exposed downwards from earthenware 30 is held by not shown handle part, and scolding tin wire rod 31 is moved upward ormal weight by this handle part with the timing of regulation.
In addition, earthenware 30 is screwed on metal derby 20 by screw element (Fig. 3 A, Fig. 3 B) 32 in the mode that can freely pull down.Thus, earthenware 30 can be pulled down from metal derby 20 and carry out the replacing of cleaning or easily carrying out for changing size.Such as, according to solder object, and the different earthenware of hollow space diameter 30 can easily be changed to.
As heater 40, employ the cartridge heater with heating wire.Heater 40 is positioned at the inside of metal derby 20 mode with heating part is installed on metal derby 20.If to heater 40 streaming current, then heating part heating, thus heatable metal block 20.In addition, as heater 40, the heater except cartridge heater such as ceramic heater can also be used.
Temperature sensor 50 is positioned at the inside of metal derby 20 mode with sensing detection part is installed on metal derby 20.The temperature detection result obtained by temperature sensor 50 sends to the control part (not shown) of heater 40, controls to make the temperature of metal derby 20 become set point of temperature to heater 40 based on temperature detection result.This set point of temperature refers to the temperature that can make scolding tin wire rod 31 melting.
Heat insulating member 60 is such as made up of calcium silicates.Be fixed with metal derby 20 at the base station (not shown) of soft soldering apparatus via heat insulating member 60, thus the heat trnasfer of the metal derby 20 after heating can be prevented to base station (not shown).
Next, use Fig. 3 A and Fig. 3 B, the action of present embodiment is described.
First metal derby 20 is heated to set point of temperature by heater 40 by solder unit 10.Next, as shown in Figure 3A, insert scolding tin wire rod from the downside of earthenware 30, the upper padding solder material 31 of handle part (not shown) is until the upper end of this scolding tin wire rod 31 is showed from the upper end of earthenware 30.So scolding tin wire rod 31 melting because of the heat of metal derby 20 of the upper position of earthenware 30, from the upper end of earthenware 30, shows the scolding tin of melting.
Specifically, as shown in Figure 3A, scolding tin wire rod 31 in the state becoming melting than top side, the lower end of metal derby 20, becomes the state of not melting on the lower in earthenware 30 in the lower end than metal derby 20.This is because the heat conductivity of pottery is very low.That is, for for metal derby 20 earthenware 30 of part that downwards side is given prominence to, the heat conductivity due to pottery is lower so be difficult to become high temperature, its result, and in the earthenware 30 of the part of giving prominence in downward side, scolding tin wire rod 31 is the wire rods keeping non-melting constant.Its result, the hollow space of the bottom of earthenware 30 is blocked by scolding tin wire rod 31, so the scolding tin of upper position melting in earthenware 30 is not sagging downwards from earthenware 30.In addition, because the non-melting of scolding tin wire rod 31 of the lower position of earthenware 30 is not so produce surface tension, thus can move swimmingly in pipe 30.Its result, does not produce the blockage caused by surface tension, is path from making caliber.
On the other hand, because in the earthenware 30 imbedding metal derby 20, by once heating, the scolding tin of melting is covered by the earthenware 30 that thermal conductivity is lower, so heat is difficult to diffusion.Its result, melting scolding tin is not easy to cool off, thus keeps molten state.That is, the scolding tin near the upper end of the earthenware 30 of temporary transient melting maintains melting state.In fact, as shown in Figure 2, melting scolding tin exposes with the state table expanded upward from the front end of earthenware 30 because of surface tension.
Like this, if generate melting scolding tin in earthenware 30, then as shown in Figure 3 B, the terminal 72 of the electronic unit 71 being installed on substrate 70 is made to move to be immersed in pipe from the upper end of earthenware 30 by Handling device (not shown).Thus, scolding tin is attached to terminal 72 and substrate 70 and carries out solder.
If the solder of an electronic unit terminates, then Handling device makes this electronic unit leave from solder unit 10, and goes to get next electronic unit.Now, the handle part holding scolding tin wire rod 31 in the below of earthenware 30 by scolding tin wire rod 31 upward on push away ormal weight.On this, pushing volume (length) is the amount of the scolding tin consumed in a supplementary front solder, namely until melting scolding tin exposes from the front-end table of earthenware 30.But also can above padding solder material 31 until melting scolding tin overflows slightly from the front end of earthenware 30.Like this, the oxide-film produced in a front solder can be removed completely.
If go up padding solder material 31 like this, then the same for the previous, the scolding tin of the upper position of earthenware 30 becomes molten condition, carries out solder so be immersed in by terminal 72 in the upper end of earthenware 30 the same for the previously.Like this, the operation generating melting scolding tin at the upper position of earthenware 30 by repeatedly carrying out upper padding solder material 31 and the operation be immersed in by next solder object in melting scolding tin, carry out solder successively to multiple solder object ground.
As mentioned above, according to the present embodiment, solder unit 10 has metal derby 20, the earthenware 30 of through along the vertical direction metal derby 20 ground setting and the heater 40 of heatable metal block 20, thus can realize the second best in quality of solder and the simple solder unit 10 of structure.Specifically, structure according to the present embodiment, can obtain following effect.
Owing to being only a small amount of scolding tin of melting tube 30 front end, for making the heat of scolding tin melting less.Thus, can not on the impact producing heat around.The structure of heating part in addition, owing to utilizing scolding tin wire rod 31, and only makes the front end melting of scolding tin wire rod 31, so can be made simple.Due to heating, adiabatic parts number of packages can be reduced, and reduce the impact on the heat of peripheral device, so can the cost of restraining device entirety.
Owing to only sending into scolding tin wire rod 31 to pipe 30, so the device for supplying soldering tin material can be simplified.
Because the melting scolding tin contacted with air is only pipe 30 front end, so the generation of oxide-film can be suppressed for Min..In addition, owing to supplying scolding tin by pushing scolding tin wire rod 31, so always supply new scolding tin.Its result, does not have the deterioration of scolding tin, thus can improve the quality of solder.
During solder, because the scolding tin of melting moves to substrate 70 side, so the melting scolding tin only residual a small amount of in the front end of pipe 30.Its result, the copper of substrate 70 does not move to the melting scolding tin side of the front end of pipe 30 substantially.
Owing to not using solder bath, so do not have oxide-film to incorporate scolding tin or be mixed into the situation of impurity, thus the quality of solder can be improved.
Owing to buying scolding tin wire rod 31 with conforming to the production quantity of carrying out solder, so initial cost can be suppressed for less.
For clean, just can carry out, so simply owing to pulling down earthenware 30 from metal derby 20.
In addition, in above-mentioned embodiment, to using the situation of earthenware 30 to be illustrated, but the material of pipe is not limited to pottery, uses the material that thermal conductivity is less than metal derby 20 and/or the large material of specific heat ratio metal derby 20 in a word.
Simply be described.Specific heat capacity refers to the thermal capacity of the unit mass relative to material, namely once improves the heat required for temperature of the material of unit mass.Thermal conductivity refer to heat transfer by the unit are vertical with the flowing of heat and the heat flowed within the unit interval divided by the value of the temperature difference (thermograde) of per unit length.Thermal conductivity represents the heat conducting easness of material, is also referred to as the coefficient of heat conduction.
Specific heat capacity and the thermal conductivity of the material of representative is represented in table 1.
Table 1
When use iron as metal derby 20, the material of pipe 30 is preferably any one in silica, silicon nitride, carborundum, quartz glass.Particularly, the mechanical strength of aluminium oxide, insulating properties, high-frequency loss, thermal conductivity, heat resistance, mar proof, corrosion resistance are good, thus preferably.
In addition, the pipe 30 being installed on metal derby 20 is not limited to one, can arrange two earthenwares 81,82 as shown in Figure 4, also can arrange the pipe of more than three.When metal derby 20 is provided with multiple pipe, their diameter can be identical, also can be different.In addition, in Fig. 4, the heater 90 being built-in with the band temperature adjustment function of temperature sensor is installed on metal derby 20.
Further, pipe 30 is not limited to cylindrical shape, and front end also can be used as shown in Figure 5 to be trumpet-shaped pipe.If use such pipe 30, even if then the thickness of the terminal 72 of solder object is thicker than caliber, also terminal can be immersed in the front end of pipe 30.
In addition, in above-mentioned embodiment, substrate 70 side is moved, but due to solder unit of the present invention very small-sized, so solder unit 10 side also can be made to move.
Above-mentioned embodiment only illustrates the example specialized when implementing of the present invention, explains technical scope of the present invention with limiting not by above-mentioned embodiment.That is, the present invention only otherwise depart from its purport or its main feature, just can implement in every way.
Industrial utilizability
The present invention can be applicable to the solder unit and the soft soldering method that employ scolding tin wire rod.
Claims (6)
1. a solder unit, is characterized in that, possesses:
Metal derby;
Pipe, its through above-mentioned metal derby ground is arranged, and the material less than above-mentioned metal derby by thermal conductivity and/or the large material of the above-mentioned metal derby of specific heat ratio are formed, and insert scolding tin wire rod at hollow bulb; And
Heater, it heats above-mentioned metal derby.
2. solder unit according to claim 1, is characterized in that,
Above-mentioned pipe is pottery.
3. solder unit according to claim 2, is characterized in that,
Above-mentioned pipe is aluminium oxide.
4. solder unit according to claim 1, is characterized in that,
The through along the vertical direction above-mentioned metal derby of above-mentioned pipe,
Above-mentioned scolding tin wire rod is carried from bottom to top in above-mentioned pipe.
5., according to the solder unit described in any one of Claims 1 to 4, it is characterized in that,
Also possess the sensor of the temperature detecting above-mentioned metal derby or above-mentioned heater,
Testing result based on the sensor controls the heating of above-mentioned heater.
6. a soft soldering method, it uses solder unit, and this solder unit possesses:
Metal derby;
Pipe, its through along the vertical direction above-mentioned metal derby ground is arranged, and the material less than above-mentioned metal derby by thermal conductivity and/or the large material of the above-mentioned metal derby of specific heat ratio are formed, and insert scolding tin wire rod at hollow bulb; And
Heater, it heats above-mentioned metal derby,
The feature of above-mentioned soft soldering method is, comprising:
By above-mentioned heater, above-mentioned metal derby is heated to the operation of set point of temperature;
Supply above-mentioned scolding tin wire rod from the lower end of above-mentioned pipe and generate the operation of melting scolding tin in the upper part of above-mentioned pipe; And
Installing component is made to contact the operation of carrying out solder with above-mentioned melting scolding tin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-219233 | 2013-10-22 | ||
| JP2013219233A JP6146257B2 (en) | 2013-10-22 | 2013-10-22 | Soldering unit and soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104551294A true CN104551294A (en) | 2015-04-29 |
| CN104551294B CN104551294B (en) | 2018-06-22 |
Family
ID=53011694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410433159.2A Expired - Fee Related CN104551294B (en) | 2013-10-22 | 2014-08-28 | Solder unit and soft soldering method |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6146257B2 (en) |
| CN (1) | CN104551294B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB528120A (en) * | 1939-04-19 | 1940-10-23 | Peter Bogner | Improvements in or relating to soldering devices |
| CN2115852U (en) * | 1992-02-21 | 1992-09-16 | 吴泽民 | Tin soldering bit for quick welding electronic device |
| JPH05343842A (en) * | 1992-06-08 | 1993-12-24 | Shigenaga Nagata | Method and apparatus for soldering |
| CN1443622A (en) * | 2002-03-08 | 2003-09-24 | Esec贸易公司 | Method and device for distributing welding flux on base |
| JP2004209506A (en) * | 2002-12-27 | 2004-07-29 | Nec Machinery Corp | Nozzle for supplying brazing filler metal |
| CN201565692U (en) * | 2009-11-10 | 2010-09-01 | 鞍钢房地产开发集团有限公司 | Tin heating pipe for soldering tin for electrical lead |
| CN202377634U (en) * | 2010-08-12 | 2012-08-15 | 赵一帆 | Injection-type soldering iron tip used for supplying tin |
| CN202498281U (en) * | 2012-01-09 | 2012-10-24 | 广东益翔自动化科技有限公司 | Preheating device of soldering robot |
| CN102935534A (en) * | 2012-11-22 | 2013-02-20 | 王峰 | Practical electric soldering iron |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4949159A (en) * | 1972-09-19 | 1974-05-13 | ||
| JPH02229669A (en) * | 1989-03-01 | 1990-09-12 | Arumetsuku Hongo:Kk | Soldering device |
| JPH11342466A (en) * | 1998-05-29 | 1999-12-14 | Kyocera Corp | Solder jetting device |
-
2013
- 2013-10-22 JP JP2013219233A patent/JP6146257B2/en not_active Expired - Fee Related
-
2014
- 2014-08-28 CN CN201410433159.2A patent/CN104551294B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB528120A (en) * | 1939-04-19 | 1940-10-23 | Peter Bogner | Improvements in or relating to soldering devices |
| CN2115852U (en) * | 1992-02-21 | 1992-09-16 | 吴泽民 | Tin soldering bit for quick welding electronic device |
| JPH05343842A (en) * | 1992-06-08 | 1993-12-24 | Shigenaga Nagata | Method and apparatus for soldering |
| CN1443622A (en) * | 2002-03-08 | 2003-09-24 | Esec贸易公司 | Method and device for distributing welding flux on base |
| JP2004209506A (en) * | 2002-12-27 | 2004-07-29 | Nec Machinery Corp | Nozzle for supplying brazing filler metal |
| CN201565692U (en) * | 2009-11-10 | 2010-09-01 | 鞍钢房地产开发集团有限公司 | Tin heating pipe for soldering tin for electrical lead |
| CN202377634U (en) * | 2010-08-12 | 2012-08-15 | 赵一帆 | Injection-type soldering iron tip used for supplying tin |
| CN202498281U (en) * | 2012-01-09 | 2012-10-24 | 广东益翔自动化科技有限公司 | Preheating device of soldering robot |
| CN102935534A (en) * | 2012-11-22 | 2013-02-20 | 王峰 | Practical electric soldering iron |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104551294B (en) | 2018-06-22 |
| JP2015080795A (en) | 2015-04-27 |
| JP6146257B2 (en) | 2017-06-14 |
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| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180622 Termination date: 20190828 |