GB2444775B - Chip mounting - Google Patents

Chip mounting

Info

Publication number
GB2444775B
GB2444775B GB0624888A GB0624888A GB2444775B GB 2444775 B GB2444775 B GB 2444775B GB 0624888 A GB0624888 A GB 0624888A GB 0624888 A GB0624888 A GB 0624888A GB 2444775 B GB2444775 B GB 2444775B
Authority
GB
United Kingdom
Prior art keywords
chip
chip mounting
circuit board
printed circuit
solder elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB0624888A
Other languages
English (en)
Other versions
GB0624888D0 (en
GB2444775A (en
Inventor
Simon Jonathan Stacey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Technologies International Ltd
Original Assignee
Cambridge Silicon Radio Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cambridge Silicon Radio Ltd filed Critical Cambridge Silicon Radio Ltd
Priority to GB0624888A priority Critical patent/GB2444775B/en
Publication of GB0624888D0 publication Critical patent/GB0624888D0/en
Priority to TW096143013A priority patent/TWI475621B/zh
Priority to PCT/GB2007/004500 priority patent/WO2008071905A1/en
Priority to JP2009540834A priority patent/JP5623080B2/ja
Priority to US12/518,262 priority patent/US9177885B2/en
Publication of GB2444775A publication Critical patent/GB2444775A/en
Application granted granted Critical
Publication of GB2444775B publication Critical patent/GB2444775B/en
Priority to JP2013273446A priority patent/JP5806286B2/ja
Priority to US14/837,426 priority patent/US9659894B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H01L23/3114—
    • H01L23/3192—
    • H01L23/485—
    • H01L23/498—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/147—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being multilayered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB0624888A 2006-12-13 2006-12-13 Chip mounting Active GB2444775B (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB0624888A GB2444775B (en) 2006-12-13 2006-12-13 Chip mounting
TW096143013A TWI475621B (zh) 2006-12-13 2007-11-14 晶片安裝技術
PCT/GB2007/004500 WO2008071905A1 (en) 2006-12-13 2007-11-26 Chip mounting
JP2009540834A JP5623080B2 (ja) 2006-12-13 2007-11-26 チップ実装
US12/518,262 US9177885B2 (en) 2006-12-13 2007-11-26 Chip mounting
JP2013273446A JP5806286B2 (ja) 2006-12-13 2013-12-27 チップ実装
US14/837,426 US9659894B2 (en) 2006-12-13 2015-08-27 Chip mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0624888A GB2444775B (en) 2006-12-13 2006-12-13 Chip mounting

Publications (3)

Publication Number Publication Date
GB0624888D0 GB0624888D0 (en) 2007-01-24
GB2444775A GB2444775A (en) 2008-06-18
GB2444775B true GB2444775B (en) 2011-06-08

Family

ID=37712074

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0624888A Active GB2444775B (en) 2006-12-13 2006-12-13 Chip mounting

Country Status (5)

Country Link
US (2) US9177885B2 (https=)
JP (2) JP5623080B2 (https=)
GB (1) GB2444775B (https=)
TW (1) TWI475621B (https=)
WO (1) WO2008071905A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2444775B (en) * 2006-12-13 2011-06-08 Cambridge Silicon Radio Ltd Chip mounting
GB2482894B (en) 2010-08-18 2014-11-12 Cambridge Silicon Radio Ltd Interconnection structure
US9935038B2 (en) 2012-04-11 2018-04-03 Taiwan Semiconductor Manufacturing Company Semiconductor device packages and methods
US11189538B2 (en) * 2018-09-28 2021-11-30 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor structure with polyimide packaging and manufacturing method

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10321750A (ja) * 1997-05-16 1998-12-04 Citizen Watch Co Ltd 半導体装置および半導体チップを搭載する配線基板の製造方法
JP2000216290A (ja) * 1999-01-26 2000-08-04 Hitachi Cable Ltd 半導体パッケ―ジ
US6277669B1 (en) * 1999-09-15 2001-08-21 Industrial Technology Research Institute Wafer level packaging method and packages formed
US6323542B1 (en) * 1997-01-17 2001-11-27 Seiko Epson Corporation Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
US20020034872A1 (en) * 2000-09-19 2002-03-21 Atsushi Kazama Semiconductor device and mounted semiconductor device structure
US20020079575A1 (en) * 2000-12-25 2002-06-27 Hiroshi Hozoji Semiconductor module
US20020084528A1 (en) * 2000-12-29 2002-07-04 Samsung Electronics Co., Ltd. Wafer level package and method for manufacturing the same
US6462426B1 (en) * 2000-12-14 2002-10-08 National Semiconductor Corporation Barrier pad for wafer level chip scale packages
US20030049193A1 (en) * 2001-07-10 2003-03-13 Yuichi Satsu Thermal stable low elastic modulus material and device using the same
US20030219588A1 (en) * 2002-04-03 2003-11-27 Makoto Ogawa Dielectric film for printed wiring board, multilayer printed board, and semiconductor device
US20050258539A1 (en) * 2004-05-20 2005-11-24 Nec Electronics Corporation Semiconductor device
KR20060007881A (ko) * 2004-07-22 2006-01-26 주식회사 하이닉스반도체 웨이퍼 레벨 칩 스케일 패키지
EP1677585A1 (en) * 2004-01-30 2006-07-05 Ibiden Co., Ltd. Multilayer printed wiring board and method for manufacturing same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW480636B (en) 1996-12-04 2002-03-21 Seiko Epson Corp Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment
JP4310647B2 (ja) * 1997-01-17 2009-08-12 セイコーエプソン株式会社 半導体装置及びその製造方法
JP2000323628A (ja) * 1999-05-10 2000-11-24 Hitachi Ltd 半導体装置とその製造方法、およびこれを用いた電子機器
JP2001257282A (ja) * 2000-03-09 2001-09-21 Hitachi Chem Co Ltd 半導体装置の製造方法及び半導体装置
TWI248384B (en) * 2000-06-12 2006-02-01 Hitachi Ltd Electronic device
TW577152B (en) * 2000-12-18 2004-02-21 Hitachi Ltd Semiconductor integrated circuit device
US6433427B1 (en) 2001-01-16 2002-08-13 Industrial Technology Research Institute Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication
TW517360B (en) * 2001-12-19 2003-01-11 Ind Tech Res Inst Enhanced type wafer level package structure and its manufacture method
US6805974B2 (en) * 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition
US6940177B2 (en) 2002-05-16 2005-09-06 Dow Corning Corporation Semiconductor package and method of preparing same
US20040089470A1 (en) * 2002-11-12 2004-05-13 Nec Corporation Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrate
JP2004214561A (ja) * 2003-01-08 2004-07-29 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP4124173B2 (ja) * 2003-07-01 2008-07-23 日本電気株式会社 応力緩和構造とその形成方法、応力緩和シートとその製造方法、及び半導体装置並びに電子機器
JP4446793B2 (ja) * 2004-04-28 2010-04-07 パナソニック株式会社 半導体装置およびその製造方法
CN100468674C (zh) * 2004-11-25 2009-03-11 日本电气株式会社 半导体器件及其制造方法、线路板及其制造方法、半导体封装件和电子装置
JP4471213B2 (ja) * 2004-12-28 2010-06-02 Ｏｋｉセミコンダクタ株式会社 半導体装置およびその製造方法
US7326638B2 (en) * 2005-01-19 2008-02-05 New Japan Radio Co., Ltd. Method for manufacturing semiconductor device
US7361990B2 (en) * 2005-03-17 2008-04-22 Taiwan Semiconductor Manufacturing Company, Ltd. Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads
GB2444775B (en) * 2006-12-13 2011-06-08 Cambridge Silicon Radio Ltd Chip mounting

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6323542B1 (en) * 1997-01-17 2001-11-27 Seiko Epson Corporation Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
JPH10321750A (ja) * 1997-05-16 1998-12-04 Citizen Watch Co Ltd 半導体装置および半導体チップを搭載する配線基板の製造方法
JP2000216290A (ja) * 1999-01-26 2000-08-04 Hitachi Cable Ltd 半導体パッケ―ジ
US6277669B1 (en) * 1999-09-15 2001-08-21 Industrial Technology Research Institute Wafer level packaging method and packages formed
US20020034872A1 (en) * 2000-09-19 2002-03-21 Atsushi Kazama Semiconductor device and mounted semiconductor device structure
US6462426B1 (en) * 2000-12-14 2002-10-08 National Semiconductor Corporation Barrier pad for wafer level chip scale packages
US20020079575A1 (en) * 2000-12-25 2002-06-27 Hiroshi Hozoji Semiconductor module
US20020084528A1 (en) * 2000-12-29 2002-07-04 Samsung Electronics Co., Ltd. Wafer level package and method for manufacturing the same
US20030049193A1 (en) * 2001-07-10 2003-03-13 Yuichi Satsu Thermal stable low elastic modulus material and device using the same
US20030219588A1 (en) * 2002-04-03 2003-11-27 Makoto Ogawa Dielectric film for printed wiring board, multilayer printed board, and semiconductor device
EP1677585A1 (en) * 2004-01-30 2006-07-05 Ibiden Co., Ltd. Multilayer printed wiring board and method for manufacturing same
US20050258539A1 (en) * 2004-05-20 2005-11-24 Nec Electronics Corporation Semiconductor device
KR20060007881A (ko) * 2004-07-22 2006-01-26 주식회사 하이닉스반도체 웨이퍼 레벨 칩 스케일 패키지

Also Published As

Publication number Publication date
US9177885B2 (en) 2015-11-03
JP5623080B2 (ja) 2014-11-12
TW200832577A (en) 2008-08-01
JP2010514148A (ja) 2010-04-30
JP2014112694A (ja) 2014-06-19
US20100013093A1 (en) 2010-01-21
GB0624888D0 (en) 2007-01-24
JP5806286B2 (ja) 2015-11-10
GB2444775A (en) 2008-06-18
WO2008071905B1 (en) 2008-08-21
US20160086907A1 (en) 2016-03-24
US9659894B2 (en) 2017-05-23
TWI475621B (zh) 2015-03-01
WO2008071905A1 (en) 2008-06-19

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