GB2351363A - Semiconductor factory automation system and method for processing at least one semiconductor wafer cassette - Google Patents
Semiconductor factory automation system and method for processing at least one semiconductor wafer cassette Download PDFInfo
- Publication number
- GB2351363A GB2351363A GB0015352A GB0015352A GB2351363A GB 2351363 A GB2351363 A GB 2351363A GB 0015352 A GB0015352 A GB 0015352A GB 0015352 A GB0015352 A GB 0015352A GB 2351363 A GB2351363 A GB 2351363A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 265
- 238000000034 method Methods 0.000 title claims abstract description 196
- 235000012431 wafers Nutrition 0.000 claims abstract description 165
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 238000004891 communication Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 6
- 230000032258 transport Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001119 image correlation spectroscopy Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31218—Scheduling communication on bus
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32277—Agv schedule integrated into cell schedule
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/60—Electric or hybrid propulsion means for production processes
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- General Factory Administration (AREA)
Abstract
A method for processing at least one semiconductor wafer cassette in a semiconductor factory automation system, wherein the semiconductor wafer cassette contains a predetermined number of semiconductor wafers, includes the steps of: a) receiving at OIS 201 process schedule data of the semiconductor wafer cassette and a process recipe corresponding to the semiconductor wafer cassette from an operator; b) storing the process schedule data of the semiconductor wafer cassette and the process recipe at EQS 202; c) sending the process schedule data of the semiconductor wafers and the process recipe to a process equipment before the semiconductor wafer cassette is loaded to the process equipment; and d) processing the semiconductor wafer cassette in accordance with the process recipe and the process schedule data of the semiconductor wafer cassette. Therefore, the method can reduce a time period needed to process the semiconductor wafer cassette by sending the schedule of the semiconductor wafer cassette and the process recipe to the process equipment before the semiconductor wafer cassette is loaded to the process equipment.
Description
2351363 SEMICONDUCTOR FACTORY AUTOMATION SYSTEM AND METHOD FOR PROCESSING
AT LEAST ONE SEMICONDUCTOR WAFER CASSETTE The present invention relates to a semiconductor factory automation (hereinafter, referred to as FA) system; and, more particularly, to a semiconductor FA system and method for processing at least one semiconductor wafer cassette.
Generally, a conventional semiconductor FA system automatically processes semiconductor wafers. The conventional semiconductor FA system includes process equipments (hereinafter, referred to as an EQs), stockers and an automatic guide vehicle (hereinafter, referred to as an AGV). An EQ applies a semiconductor process to the semiconductor wafers. A stocker loads a semiconductor wafer cassette containing the semiconductor wafers to be processed in the EQ. Further, the stocker stocks the semiconductor wafer cassette, which has been already processed in the EQ. The AGV transports the semiconductor wafer cassette from the EQ to another EQ. Further, the AGV transports the semiconductor wafer cassette from the stocker to the EQ. Furthermore, the AGV transports the semiconductor wafer cassette from the process equipment to the stocker.
The conventional semiconductor FA system further includes an 2- operator interface server (hereinafter, referred to as an OIS) and an EQ server (hereinafter, referred to as an EQS). The OIS receives a process recipe as process condition data including a process temperature, a process pressure and so on f rom an operator. The OIS sends the process recipe to the EQS. The EQS sends the process recipe to the EQ. The EQ should carry out the semiconductor process in accordance with the process recipe.
Typically, after the semiconductor wafer cassette has been loaded to the EQ by the AGV, the EQ receives the process recipe from the EQS. While the semiconductor wafer cassette is loaded to the EQ by the AGV, a failure of the EQ or the AGV may be caused. At this time, the EQS can not send the process recipe to the EQ. After the failure of the EQ or the AGV has been repaired, the operator should again input the process recipe to the OIS. Accordingly, there is a problem that a time period needed to process the semiconductor wafer cassette increases.
it is, therefore, an object of the present invention to provide a semiconductor FA system and method for processing at least one semiconductor waf er cassette that is capable of reducing a time period needed to process the semiconductor wafer cassette.
It is, therefore, another object of the present invention to provide a computer-readable media storing program instructions, the program instructions disposed on a computer to perform a method for processing at least one semiconductor wafer cassette that is capable Wkz Wkz_ of reducing a time period needed to process the semiconductor wafer cassette.
In accordance with an embodiment of an aspect of the present invention, there is provided an apparatus for processing at least one semiconductor wafer cassette, wherein the semiconductor wafer cassette contains a predetermined number of semiconductor wafers, comprising: an operator interface means for receiving process schedule data of the semiconductor wafer cassette and a process recipe corresponding to the semiconductor wafer cassette inputted from an operator; a semiconductor processing means for sending a request for the process recipe; and processing the semiconductor wafer cassette in accordance with the process recipe and the process schedule data of the semiconductor wafer cassette; a storage means for storing the process schedule data of the semiconductor wafer cassette and the process recipe; and a control means for sending the process schedule data of the semiconductor wafer cassette and the process recipe to said semiconductor processing means in response to the request before the semiconductor wafer cassette is loaded to said semiconductor processing means.
In accordance with another embodiment of the aspect of the present invention, there is provided a semiconductor factory automation (FA) system for processing at least one semiconductor wafer cassette, wherein the semiconductor wafer cassette contains a predetermined number of semiconductor wafers, comprising: an operator interface means for receiving process schedule data of the semiconductor wafer cassette and a process recipe corresponding to the semiconductor wafer cassette inputted from an operator; a semiconductor processing means for processing the semiconductor wafer cassette in accordance with the process recipe and the process schedule data of the semiconductor wafer cassette; a storage means coupled between said operator interface means and said semiconductor processing means for storing the process schedule data of the semiconductor wafer cassette and the process recipe; and a control means for sending the process schedule data of the semiconductor wafer cassette and the process recipe to said semiconductor processing means before the semiconductor wafer cassette is loaded to said semiconductor processing means.
In accordance with another aspect of the present invention, there is provided a method for processing at least one semiconductor wafer cassette in a semiconductor factory automation (FA) system, wherein the semiconductor wafer cassette contains a predetermined number of semiconductor wafers, comprising the steps of: a) receiving process schedule data of the semiconductor wafer cassette and a process recipe corresponding to the semiconductor wafer cassette inputted from an operator; b) storing the process schedule data of the semiconductor wafer cassette and the process recipe; c) sending the process schedule data of the semiconductor wa f ers and the process recipe to a process equipment before the semiconductor wafer cassette is loaded to the process equipment; and d) processing the semiconductor wafer cassette in accordance with the process recipe and the process schedule data of the semiconductor wafer cassette.
In accordance with further another aspect of the present invention, there is provided a computer- readable media storing program instructions, the program instructions disposed on a computer to perform for processing at least one semiconductor wafer cassette in a semiconductor factory automation system, wherein the semiconductor wafer cassette contains a predetermined number of semiconductor wafers, comprising the steps of: a) receiving process schedule data of the semiconductor waf er cassette and a process recipe corresponding to the semiconductor wafer cassette inputted from an operator; b) storing the process schedule data of the semiconductor wa f er cassette and the process recipe; c) sending the process schedule data of the semiconductor wafers and the process recipe to a process equipment before the semiconductor wafer cassette is loaded to the process equipment; and d) processing the semiconductor wafer cassette in accordance with the process recipe and the process schedule data of the semiconductor wafer cassette.
The above and other objects and features of the instant invention will become apparent from the following description of preferred embodiments taken in conjunction with the accompanying drawings, in which:
Fig. 1 is a block diagram describing a semiconductor FA system for processing at least one semiconductor wafer cassette in accordance with the present invention; Fig. 2 is a block diagram a block diagram illustrating a transportation control portion shown in Fig. 1; and Figs. 3 and 4 are flowcharts showing a method for processing at least one semiconductor wafer cassette in a semiconductor FA system 6 in accordance with the present invention.
Referring to Fig. 1, there is shown a block diagram showing a semiconductor FA system for prDcessinq at least semiconductor wafer cassette in accordance with an embodiment of the present invention. As shown, the semiconductor FA system includes at least one cell, which has a predetermined number, e.g., 4, of semiconductor production bays. A semiconductor production bay 400 is included in a cell. A semiconductor production bay 400 is provided with EQs 204, stockers 216 and an AGV 214. The EQ 204 processes semiconductor wafers in order to obtain semiconductor devices. The EQ 204 includes, e.g., an etching equipment, a photo- 1 i thography equipment, a furnace equipment, a physical vapor deposition (PVD) equipment, a sputtering equipment and the like. A stocker 216 temporarily stores a number of semiconductor wafer cassettes. Each of semiconductor wafer cassettes has a predetermined number of semiconductor wafers, which is referred to as a lot. The semiconductor wafer cassettes are selectively transported to the EQ 204 by using the AGV 214. The semiconductor wafer cassette stored in the stocker 216 is transported to another semiconductor production bay 400.
A process equipment server (hereinafter, referred to as an EQS) 202 is coupled to a common communication line 500, e.g., EthernetTM supplied by Xerox Corporation. An AGV controller (hereinafter, referred to as an AGVC) 212 controls the AGV 214.
The semiconductor FA system also includes a cell management -7 portion 100, a real-time database 300 connected to the cell management portion 100, a temporary storage unit 310, a history management portion 312 connected to the temporary storage unit 310 and a history database 314 connected to the history management portion 312. The cell management portion 100, the history management portion 312 and the history database 314 are respectively connected to the common communication line 500 for communication therebetween.
The cell management portion 100 includes a cell management server (CMS) 206, an operator interface server (hereinafter, referred to as an OIS) 201 and a data gathering server (DGS) 207.
The DGS 207 stores process data associated with the lot in the real-time database 300.
The OIS 201 receives process schedule data of the semiconductor wafer cassette and a process recipe corresponding to the semiconductor wafer cassette from an operator. The EQ 204 sends a request for the process recipe to the EQS 202. The EQ 204 processes the semiconductor wafer cassette in accordance with the process recipe and the process schedule data of the semiconductor wafer cassette. The EQS 202 coupled between the OIS 201 and the EQ 204 stores the process schedule data of the semiconductor wafer cassette and the process recipe. The EQS 202 sends the process schedule data of the semiconductor wafer cassette and the process recipe to the EQ 204 in response to the request before the semiconductor wafer cassette is loaded to the EQ 204.
The OIS 201 sends a line mode conversion message to the EQS 202.
The EQS 202 sends a line mode conversion command corresponding to the line mode conversion message to the EQ 204. The EQS 202 converts S a communication line mode from an of fline to an online mode. Further, the EQS 202 communicates with the EQ 202 on the basis of the online mode. The EQS 202 sends date and time data to the EQ 204. The date and time data contained in the EQ 204 is adjusted to that contained in the EQS 202. The EQ 204 reports a port state and an operating mode state of the EQ 204 to the EQS 202, wherein the operating mode state includes a full automation mode and a semi-automation mode.
The EQ 202 sends result data of the semiconductor process to the EQS 202 after completing the semiconductor process with respect to the semiconductor wafer cassette.
Accordingly, the semiconductor FA system can reduce a time period needed to process the semiconductor wafer cassette by sending the process schedule data of the semiconductor wafer cassette and the process recipe to the EQ 204 before the semiconductor wafer cassette is loaded to the EQ 204.
Referring to Fig. 2, there is shown a block diagram illustrating a transportation control portion shown in Fig. 1. As shown, the transportation control portion 116 includes intrabay control servers (hereinafter, referred to as ICSs) 210 coupled to the common communication line 500 and stocker control servers (hereinafter, referred to as SCSs) 218. The ICS 210 converts a transportation message into a transportation command from the common communication line 500. The SCS 218 generates a stocker control command to control the stockers 216 in response to the transportation command. The AGVC 212 generates an AGV control command to control an AGV 214 in response to the transportation command.
Referring to Figs. 3 and 4, there are shown flowcharts showing W R AL.1- i C a method for processing at least one semiconductor wafer cassette in a semiconductor FA system in accordance with the present invention.
Referring to Fig. 3, at step S302, the OIS 201 receives a line mode conversion command inputted from the operator and sends a message corresponding to the line mode conversion command via the common communication line 500 to the EQS 202.
At step S304, the EQS 202 converts a communication line mode from an offline mode to an online mode. The EQS 202 sends the line mode conversion command to the EQ 204. Then, the EQS 202 communicates with the EQ 204 on the basis of an online mode.
At step S306, the EQ 204 asks the EQS 202 for date and time data after receiving the line mode conversion command from the EQS 202.
At step S308, the EQS 202 sends the date and time data to the EQ 204. Then, the date and time data stored in the EQ 204 is adjusted to that stored in the EQS 202.
At step S310, the EQ 204 reports a port state, an EQ state and an operating mode state of the EQ 204 to the EQS 202, wherein the operating mode state includes a full automation mode and a semi automation mode.
At step S312, the EQS 202, responsive to the report from the EQ 204, sends an acknowledgment signal to the EQ 204.
At step S314, the EQ 204 sends a request to the EQS 202 so that the semiconductor wafer cassette can be loaded to the EQ 204.
At step S316, the EQS 202, responsive to the request from the EQ 204, sends the acknowledgment signal to the EQ 204.
At step S318, the OIS 201 receives process schedule data of the semiconductor wafer cassette from the operator so that the k 0 semiconductor wafer cassette is scheduled to be loaded to the EQ 204 according to the process schedule data of the semiconductor wafer cassette. Further, the OIS 201 receives a process recipe corresponding to the semiconductor wafer cassette from the operator, wherein the process recipe includes a process temperature, a process pressure and so on as process condition data. Then, the OIS 201 sends the process schedule data of the semiconductor wafer cassette and the process recipe corresponding to the semiconductor wafer cassette to the EQS 202.
At step S320, the EQS 202 stores the process schedule data of the semiconductor wafer cassette and the process recipe corresponding to the semiconductor wafer cassette from the OIS 201.
The EQS 202 asks the EQ 204 to initialize a semiconductor process. At step S322, the EQ 204, responsive to the asking from the EQS 202, sends the acknowledgment signal to the EQS 202.
At step S324, the EQS 202 sends the process recipe to the EQ 204.
At step S326, the EQ 204 informs the EQS 202 that the EQ 204 has received the process recipe from the EQS 202.
At step S328, the EQS 202 asks the AGV 214 to load the semiconductor wafer cassette to the EQ 204.
At step S330, the AGV 214, responsive to the asking from the EQS 202, sends the acknowledgment signal to the EQS 202.
At step S332, the AGV 214 informs the EQS 202 that the AGV 214 has started for the EQ 204.
At step S334, the AGV 214 reaches the EQ 204 so as to load the semiconductor wafer cassette to the EQ 204.
a k AW IL I AW L I k% At step S336, the EQ 204 makes its door open.
At step S338, the AGV 214 loads the semiconductor wafer cassette to the EQ 204.
At step S340, the EQ 204 reports the port state of the EQ 204 to the EQS 202.
At step S342, the EQS 202, responsive to the report from the EQ 204, sends the acknowledgment signal to the EQ 204.
At step S344, the EQ 204 makes its door closed.
At step S346, the AGV 214 informs the EQS 202 that the AGV 214 has loaded the semiconductor wafer cassette to the EQ 204.
At step S348, the EQ 204 informs the EQS 202 that the semiconductor wafer cassette has been loaded to the EQ 204.
At step S350, the EQS 202, responsive to the information from the EQ 204, sends the acknowledgment signal to the EQ 204.
Referring to Fig. 4, at step S402, the EQS 202 asks the EQ 204 to process semiconductor wafers contained in the semiconductor wafer cassette.
At step S404, the EQ 204, responsive to the asking from the EQS 202, sends the acknowledgment signal to the EQS 202.
At step S406, the EQ 204 informs the EQS 202 that the EQ 204 has started for a semiconductor process corresponding to the semiconductor wafer cassette.
At step S408, the EQS 202, responsive to the information from the EQ 204, sends the acknowledgment signal to the EQ 204.
At step S410, the EQ 204 carries out the semiconductor process with respect to the semiconductor wafers contained in the semiconductor wafer cassette in accordance with the process recipe.
tz At step S412, the EQ 204 sends result data of the semiconductor process to the EQS 202.
At step S414, the EQS 202 sends the acknowledgment signal to the EQ 204 after receiving the result data of the semiconductor 5 process.
At step S416, the EQ 204 informs the EQS 202 that the EQ 204 has completed the semiconductor process.
At step S418, the EQS 202, responsive to the information from the EQ 204, sends the acknowledgment signal to the EQ 204.
At step S420, the EQS 202 asks the AGV 214 to unload the semiconductor wafer cassette from the EQ 204.
At step S422, the AGV 214, responsive to the asking from the EQS 202, sends the acknowledgment signal to the EQS 202.
At step S424, the AGV 214 reaches the EQ 204 so as to unload the semiconductor wafer cassette from the EQ 204.
At step S426, the EQ 204 makes its door open.
At step S428, the AGV 214 unloads the semiconductor wafer cassette from the EQ 204.
At step S430, the EQ 204 reports the port state of the EQ 204 to the EQS 202.
At step S432, the EQS 202, responsive to the report from the EQ 204, sends the acknowledgment signal to the EQ 204.
At step S434, the EQ 204 makes its door closed.
At step S436, the AGV 214 informs the EQS 202 that the AGV 214 has unloaded the semiconductor wafer cassette from the EQ 204.
At step S438, the EQ 204 informs the EQS 202 that the semiconductor wafer cassette has been unloaded from the EQ 204.
n t 13 At step S440, the EQS 202, responsive to the information from the EQ 204, sends the acknowledgment signal to the EQ 204.
Although the preferred embodiments of the invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope of the invention as disclosed in the accompanying claims.
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Claims (34)
1. Anzpparatus for processing at least one semiconductor wafer cassette', wnerein the semiconductor wafer cassette contains a predetermined number of semiconductor wafers, comprising:
an operator interface means for receiving process schedule data of the semiconductor wafer cassette and a process recipe corresponding to the semiconductor wafer cassette inputted from an operator; a semiconductor processing means for sending a request for the process recipe; and processing the semiconductor wafer cassette in accordance with the process recipe and the process schedule data of the semiconductor wafer cassette; a storage means for storing the process schedule data of the semiconductor wafer cassette and the process recipe; and a control means for sending the process schedule data of the semiconductor wafer cassette and the process recipe to said semiconductor processing means in response to the request before the semiconductor wafer cassette is loaded to said semiconductor processing means.
2. The apparatus as recited in claim 1, further comprising: a transportation means for transporting the semiconductor wafer cassette to said semiconductor processing means.
3. The apparatus as recited in claim 2, wherein said operator interface means sends a line mode conversion message to said control ALL, I means.
4. The apparatus as recited in claim 3, wherein said control means sends a line mode conversion command corresponding to the line mode conversion message to said semiconductor processing means; converts a communication line mode from an off line mode to an online mode; and communicates with said semiconductor processing means on the basis of the online mode.
5. The apparatus as recited in claim 4, wherein said control means sends date and time data to said semiconductor processing means and the date and time data contained in said semiconductor processing means is adjusted to that contained in said control means.
6. The apparatus as recited in claim 5, wherein said semiconductor processing means reports a port state and an operating mode state of said semiconductor processing means to said control means; and wherein the operating mode state includes a full automation mode and a semi-automation mode.
7. The apparatus as recited in claim 6, wherein said operator interface means and said control means share Ethernet"' supplied by Xerox Corporation.
B. The apparatus as recited in claim 7, wherein said semiconductor processing means sends result data of the semiconductor process to said control means after completing the k6 semiconductor process with respect to the semiconductor wafer cassette.
9. -A semiconductor factory automation (FA) system for processing at least one semiconductor wafer cassette; wherein the semiconductor wafer cassette contains a predetermined number of semiconductor wafers, comprising:
an operator interface means for receiving process schedule data of the semiconductor wafer cassette and a process recipe corresponding to the semiconductor wafer cassette inputted from an operator; a semiconductor processing means for processing the semiconductor wafer cassette in accordance with the process recipe and the process schedule data of the semiconductor wafer cassette; a storage means coupled between said operator interface means and said semiconductor processing means for storing the process schedule data of the semiconductor wafer cassette and the process recipe; and a control means for sending the process schedule data of the semiconductor wafer cassette and the process recipe to said semiconductor processing means before the semiconductor wafer cassette is loaded to said semiconductor processing means.
10. The semiconductor FA system as recited in claim 9, further comprising: a transportation means for transporting the semiconductor wafer cassette to said semiconductor processing means.
I I Wk I k-7 11. The semiconductor FA system as recited in claim 10, further comprising:
a stocker for stocking the semiconductor wafer cassette. 5
12. The semiconductor FA system as recited in claim 11, wherein said transportation means transports the semiconductor wafer cassette from said stocker to said semiconductor processing means.
13. The semiconductor FA system as recited in claim 12, wherein said semiconductor processing means, said stocker and said transportation means are located at a semiconductor production bay.
14. The semiconductor FA system as recited in claim 13, wherein the semiconductor wafer cassette is transported from the semiconductor production bay to another semiconductor production bay by a vehicle.
15. The semiconductor FA system as recited in claim 14, wherein said operator interface means sends a line mode conversion message to said control means.
16. The semiconductor FA system as recited in claim 15, wherein said control means sends a line mode conversion command corresponding to the line mode conversion message to said semiconductor processing means; and wherein said control means converts a communication line mode 19,) from an offline to an online mode and said control means communicates with said semiconductor processing means on the basis of the online mode.
17. The semiconductor FA system as recited in claim 16, wherein said control means sends date and time data to said semiconductor processing means and the date and time data contained in said semiconductor processing means is adjusted to that contained in said control means.
18. The semiconductor FA system as recited in claim 17, wherein said semiconductor processing means reports a port state and an operating mode state of said semiconductor processing means to said control means; and wherein the operating mode state includes a full automation mode and a semi-automation mode.
19. The semiconductor FA system as recited in claim 18, wherein said operator interface means and said control means share EthernetTM supplied by Xerox Corporation.
20. The semiconductor FA system as recited in claim 19, wherein said semiconductor processing means sends result data of the semiconductor process to said control means after completing the semiconductor process with respect to the semiconductor wafer 25 cassette.
21. A method for processing at least one semiconductor wafer __W k C cassette in a semiconductor factory automation (FA) system, wherein the semiconductor wafer cassette contains a predetermined number of semiconductor wafers, comprising the steps of:
a) receiving process schedule data of the semiconductor wafer cassette and a process recipe corresponding to the semiconductor wafer cassette inputted from an operator; b) storing the process schedule data of the semiconductor wafer cassette and the process recipe; c) sending the process schedule data of the semiconductor wafers and the process recipe to a process equipment before the semiconductor wafer cassette is loaded to the process equipment; and d) processing the semiconductor wafer cassette in accordance with the process recipe and the process schedule data of the semiconductor wafer cassette. 15
22. The method as recited in claim 21, further comprising the step of: e) transporting the semiconductor wafer cassette to the process equipment. 20
23. The method as recited in claim 22, wherein said step a) further includes the steps of: al) sending a line mode conversion message from an operator interface server to a process equipment server; 25 a2) sending a line mode conversion command corresponding to the line mode conversion message from the process equipment server to the process equipment; and 2-0 a3) converting a communication line mode between the process equipment and the process equipment server from an offline mode to an online mode.
24. The method as recited in claim 23, wherein said step a) further includes the steps of:
a4) sending date and time data from the process equipment server to the process equipment; and a5) adjusting the date and time data stored in the process equipment to that stored in the process equipment server.
25. The method as recited in claim 24, wherein said step d) further includes the step of:
dl) sending result data of the semiconductor process from the process equipment to the process equipment server after completing the semiconductor process with respect to the semiconductor wafer cassette.
26. A computer- re adabl e media storing program instruCtions, the program instructions disposed on a computer to perform a method for processing at least one semiconductor wafer cassette in a semiconductor factory automation system, wherein the semiconductor wafer cassette contains a predetermined number of semiconductor wafers, comprising the steps of:
a) receiving process schedule data of the semiconductor wafer cassette and a process recipe corresponding to the semiconductor wafer cassette inputted from an operator; ALim Maur 2k b) storing the process schedule data of the semiconductor wafer cassette and the process recipe; c) sending the process schedule data of the semiconductor wafers and the process recipe to a process equipment before the semiconductor 5 wafer cassette is loaded to the process equipment; and d) processing the semiconductor wafer cassette in accordance with the process recipe and the process schedule data of the semiconductor wafer cassette.
27. The computer- readable media as recited in claim 26, further comprising the step of:
e) transporting the semiconductor wafer cassette to the process equipment.
28. The computer- readable media as recited in claim 27, wherein said step a) further includes the steps of:
al) sending a line mode conversion message from an operator interface server to a process equipment server; a2) sending a line mode conversion command corresponding to the line mode conversion message from the process equipment server to the process equipment; and a3) converting a communication line mode between the process equipment and the process equipment server from an offline to an online mode.
29. The computer- readable media as recited in claim 28, wherein said step a) further includes the steps of:
22 a4) sending date and time data from the process equipment server to the process equipment; and a5) adjusting the date and time data contained in the process equipment to that contained in the process equipment server.
30. The computer-readable media as recited in claim 29, wherein said step d) further includes the step of:
dl) sending result data of the semiconductor process from the process equipment to the process equipment server after completing the semiconductor process with respect to the semiconductor wafer cassette.
31. An apparatus for processing at least one semiconductor wafer cassette substantially as hereinbefore described with reference to Figures I to 4.
32. A semiconductor factory automation (FA) system for processing at least one semiconductor wafer cassette substantially as hereinbefore described with reference to Figures I to 4.
33. A method for processing at least one semiconductor wafer cassette in a semiconductor factory automation (FA) system substantially as hereinbefore described with reference to Figures 3 and 4.
34. A computer-Teadable media storing program instructions, the program instructions disposed on a computer to perform a method for processing at least one semiconductor wafer cassette in a semiconductor factory automation system, the method being substantially as hereinbefore described with reference to Figures 3 and 4.
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Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-1999-0023540A KR100507871B1 (en) | 1999-06-22 | 1999-06-22 | Method for providing recipe to physical vapor depositor in plant manufacturing semiconductor |
| KR10-1999-0023539A KR100529389B1 (en) | 1999-06-22 | 1999-06-22 | Method for operating scrubber used in manufacturing semiconductor |
| KR1019990024872A KR100540471B1 (en) | 1999-06-28 | 1999-06-28 | System for automatically operating single wafer type equipment used in manufacturing semiconductor and method using for the same |
| KR10-1999-0028417A KR100498602B1 (en) | 1999-07-14 | 1999-07-14 | Method for operating sputtering equipment in manufacturing semiconductor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB0015352D0 GB0015352D0 (en) | 2000-08-16 |
| GB2351363A true GB2351363A (en) | 2000-12-27 |
| GB2351363B GB2351363B (en) | 2003-12-10 |
Family
ID=27483375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0015352A Expired - Fee Related GB2351363B (en) | 1999-06-22 | 2000-06-22 | Semiconductor factory automation system and method for processing at least one semiconductor wafer cassette |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP2001068391A (en) |
| CN (1) | CN1196044C (en) |
| DE (1) | DE10030461A1 (en) |
| FR (1) | FR2796474B1 (en) |
| GB (1) | GB2351363B (en) |
| IT (1) | IT1318042B1 (en) |
| NL (1) | NL1015480C2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6535784B2 (en) * | 2001-04-26 | 2003-03-18 | Tokyo Electron, Ltd. | System and method for scheduling the movement of wafers in a wafer-processing tool |
| US7337019B2 (en) * | 2001-07-16 | 2008-02-26 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
| US6907305B2 (en) * | 2002-04-30 | 2005-06-14 | Advanced Micro Devices, Inc. | Agent reactive scheduling in an automated manufacturing environment |
| JP4673548B2 (en) * | 2003-11-12 | 2011-04-20 | 東京エレクトロン株式会社 | Substrate processing apparatus and control method thereof |
| CN111301982A (en) * | 2019-11-12 | 2020-06-19 | 深圳中集智能科技有限公司 | Synchronous beat system and control method for container production factory |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2279775A (en) * | 1990-09-17 | 1995-01-11 | Honda Motor Co Ltd | Production line control system |
| US5668056A (en) * | 1990-12-17 | 1997-09-16 | United Microelectronics Corporation | Single semiconductor wafer transfer method and manufacturing system |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4667403A (en) * | 1984-05-16 | 1987-05-26 | Siemens Aktiengesellschaft | Method for manufacturing electronic card modules |
| US4974166A (en) * | 1987-05-18 | 1990-11-27 | Asyst Technologies, Inc. | Processing systems with intelligent article tracking |
| JP3309997B2 (en) * | 1991-09-05 | 2002-07-29 | 株式会社日立製作所 | Compound processing equipment |
| EP0633207A1 (en) * | 1993-07-07 | 1995-01-11 | Siemens Aktiengesellschaft | Conveying system for the transport of samples to different treating arrangements |
| US5432702A (en) * | 1994-06-17 | 1995-07-11 | Advanced Micro Devices Inc. | Bar code recipe selection system using workstation controllers |
| US5751581A (en) * | 1995-11-13 | 1998-05-12 | Advanced Micro Devices | Material movement server |
-
2000
- 2000-06-20 NL NL1015480A patent/NL1015480C2/en not_active IP Right Cessation
- 2000-06-21 DE DE10030461A patent/DE10030461A1/en not_active Withdrawn
- 2000-06-22 IT IT2000MI001408A patent/IT1318042B1/en active
- 2000-06-22 CN CNB001240226A patent/CN1196044C/en not_active Expired - Fee Related
- 2000-06-22 JP JP2000187909A patent/JP2001068391A/en active Pending
- 2000-06-22 GB GB0015352A patent/GB2351363B/en not_active Expired - Fee Related
- 2000-06-22 FR FR0008010A patent/FR2796474B1/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2279775A (en) * | 1990-09-17 | 1995-01-11 | Honda Motor Co Ltd | Production line control system |
| US5668056A (en) * | 1990-12-17 | 1997-09-16 | United Microelectronics Corporation | Single semiconductor wafer transfer method and manufacturing system |
Also Published As
| Publication number | Publication date |
|---|---|
| NL1015480C2 (en) | 2002-08-22 |
| DE10030461A1 (en) | 2001-01-25 |
| ITMI20001408A0 (en) | 2000-06-22 |
| IT1318042B1 (en) | 2003-07-21 |
| NL1015480A1 (en) | 2000-12-28 |
| FR2796474A1 (en) | 2001-01-19 |
| CN1280323A (en) | 2001-01-17 |
| JP2001068391A (en) | 2001-03-16 |
| GB0015352D0 (en) | 2000-08-16 |
| ITMI20001408A1 (en) | 2001-12-22 |
| FR2796474B1 (en) | 2006-11-17 |
| GB2351363B (en) | 2003-12-10 |
| CN1196044C (en) | 2005-04-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20090622 |