GB2351363B - Semiconductor factory automation system and method for processing at least one semiconductor wafer cassette - Google Patents

Semiconductor factory automation system and method for processing at least one semiconductor wafer cassette

Info

Publication number
GB2351363B
GB2351363B GB0015352A GB0015352A GB2351363B GB 2351363 B GB2351363 B GB 2351363B GB 0015352 A GB0015352 A GB 0015352A GB 0015352 A GB0015352 A GB 0015352A GB 2351363 B GB2351363 B GB 2351363B
Authority
GB
United Kingdom
Prior art keywords
semiconductor
processing
automation system
wafer cassette
factory automation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0015352A
Other versions
GB0015352D0 (en
GB2351363A (en
Inventor
Young-Jo Kang
Sung-Hae Ha
Kyeong-Seok Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR10-1999-0023540A external-priority patent/KR100507871B1/en
Priority claimed from KR10-1999-0023539A external-priority patent/KR100529389B1/en
Priority claimed from KR1019990024872A external-priority patent/KR100540471B1/en
Priority claimed from KR10-1999-0028417A external-priority patent/KR100498602B1/en
Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd
Publication of GB0015352D0 publication Critical patent/GB0015352D0/en
Publication of GB2351363A publication Critical patent/GB2351363A/en
Application granted granted Critical
Publication of GB2351363B publication Critical patent/GB2351363B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31218—Scheduling communication on bus
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32277—Agv schedule integrated into cell schedule
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/60—Electric or hybrid propulsion means for production processes
GB0015352A 1999-06-22 2000-06-22 Semiconductor factory automation system and method for processing at least one semiconductor wafer cassette Expired - Fee Related GB2351363B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-1999-0023540A KR100507871B1 (en) 1999-06-22 1999-06-22 Method for providing recipe to physical vapor depositor in plant manufacturing semiconductor
KR10-1999-0023539A KR100529389B1 (en) 1999-06-22 1999-06-22 Method for operating scrubber used in manufacturing semiconductor
KR1019990024872A KR100540471B1 (en) 1999-06-28 1999-06-28 System for automatically operating single wafer type equipment used in manufacturing semiconductor and method using for the same
KR10-1999-0028417A KR100498602B1 (en) 1999-07-14 1999-07-14 Method for operating sputtering equipment in manufacturing semiconductor

Publications (3)

Publication Number Publication Date
GB0015352D0 GB0015352D0 (en) 2000-08-16
GB2351363A GB2351363A (en) 2000-12-27
GB2351363B true GB2351363B (en) 2003-12-10

Family

ID=27483375

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0015352A Expired - Fee Related GB2351363B (en) 1999-06-22 2000-06-22 Semiconductor factory automation system and method for processing at least one semiconductor wafer cassette

Country Status (7)

Country Link
JP (1) JP2001068391A (en)
CN (1) CN1196044C (en)
DE (1) DE10030461A1 (en)
FR (1) FR2796474B1 (en)
GB (1) GB2351363B (en)
IT (1) IT1318042B1 (en)
NL (1) NL1015480C2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535784B2 (en) * 2001-04-26 2003-03-18 Tokyo Electron, Ltd. System and method for scheduling the movement of wafers in a wafer-processing tool
US7337019B2 (en) * 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6907305B2 (en) * 2002-04-30 2005-06-14 Advanced Micro Devices, Inc. Agent reactive scheduling in an automated manufacturing environment
JP4673548B2 (en) * 2003-11-12 2011-04-20 東京エレクトロン株式会社 Substrate processing apparatus and control method thereof
CN111301982A (en) * 2019-11-12 2020-06-19 深圳中集智能科技有限公司 Synchronous beat system and control method for container production factory

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2279775A (en) * 1990-09-17 1995-01-11 Honda Motor Co Ltd Production line control system
US5668056A (en) * 1990-12-17 1997-09-16 United Microelectronics Corporation Single semiconductor wafer transfer method and manufacturing system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4667403A (en) * 1984-05-16 1987-05-26 Siemens Aktiengesellschaft Method for manufacturing electronic card modules
US4974166A (en) * 1987-05-18 1990-11-27 Asyst Technologies, Inc. Processing systems with intelligent article tracking
JP3309997B2 (en) * 1991-09-05 2002-07-29 株式会社日立製作所 Compound processing equipment
EP0633207A1 (en) * 1993-07-07 1995-01-11 Siemens Aktiengesellschaft Conveying system for the transport of samples to different treating arrangements
US5432702A (en) * 1994-06-17 1995-07-11 Advanced Micro Devices Inc. Bar code recipe selection system using workstation controllers
US5751581A (en) * 1995-11-13 1998-05-12 Advanced Micro Devices Material movement server

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2279775A (en) * 1990-09-17 1995-01-11 Honda Motor Co Ltd Production line control system
US5668056A (en) * 1990-12-17 1997-09-16 United Microelectronics Corporation Single semiconductor wafer transfer method and manufacturing system

Also Published As

Publication number Publication date
IT1318042B1 (en) 2003-07-21
GB0015352D0 (en) 2000-08-16
NL1015480A1 (en) 2000-12-28
ITMI20001408A1 (en) 2001-12-22
FR2796474A1 (en) 2001-01-19
DE10030461A1 (en) 2001-01-25
GB2351363A (en) 2000-12-27
FR2796474B1 (en) 2006-11-17
NL1015480C2 (en) 2002-08-22
CN1280323A (en) 2001-01-17
ITMI20001408A0 (en) 2000-06-22
CN1196044C (en) 2005-04-06
JP2001068391A (en) 2001-03-16

Similar Documents

Publication Publication Date Title
AU3875899A (en) A system and method for inspecting semiconductor wafers
GB2343672B (en) Wafer Handler and Multi-Station Processing System and Method for Handling Wafers
SG63810A1 (en) Wafer processing apparatus wafer processing method and semiconductor substrate fabrication method
EP1174912A4 (en) Semiconductor wafer processing apparatus and processing method
AU5682898A (en) Device for processing semiconductor wafers
EP0631304A3 (en) System and method for monitoring and evaluating semiconductor wafer fabrication.
AU7358994A (en) Semiconductor wafer processing system
AU7262596A (en) Method and apparatus for chemical processing semiconductor wafers
AU2679999A (en) Semiconductor wafer processing tapes
GB0100034D0 (en) Distributed control system for a semiconductor wafer processing machine
GB2351161B (en) Semiconductor factory automation system and method for transporting semiconductor wafers
EP0984489A4 (en) Method and device for cleaving semiconductor wafer
AU3308699A (en) Apparatus and method for cleaning semiconductor wafers
AU5947499A (en) Inspection system and method for leads of semiconductor devices
SG93851A1 (en) Method and apparatus for processing semiconductor substrates
EP1014437B8 (en) In-situ measurement method and apparatus for semiconductor processing
GB2351806B (en) Apparatus and method for automatically controlling semiconductor manufacturing process in semiconductor factory automation system
SG91256A1 (en) Method and apparatus for processing semiconductive wafers
AU5290098A (en) Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
AU3872900A (en) System and method for controlling process temperatures for semi-conductor wafer
EP1429375A4 (en) System and method for performing semiconductor processing on substrate being processed
GB2352532B (en) Semiconductor factory automation system and method for resetting process recipe by employing trace file
GB2317052B (en) Thermal processing apparatus for semiconductor wafers
SG67503A1 (en) Process for etching semiconductor wafers
GB2351363B (en) Semiconductor factory automation system and method for processing at least one semiconductor wafer cassette

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20090622