GB2313489B - Mounting structure for mounting an electrical device with terminal pins on a printed wiring board - Google Patents
Mounting structure for mounting an electrical device with terminal pins on a printed wiring boardInfo
- Publication number
- GB2313489B GB2313489B GB9709850A GB9709850A GB2313489B GB 2313489 B GB2313489 B GB 2313489B GB 9709850 A GB9709850 A GB 9709850A GB 9709850 A GB9709850 A GB 9709850A GB 2313489 B GB2313489 B GB 2313489B
- Authority
- GB
- United Kingdom
- Prior art keywords
- wiring board
- printed wiring
- electrical device
- terminal pins
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10075—Non-printed oscillator
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8128445A JPH09312449A (ja) | 1996-05-23 | 1996-05-23 | 端子付き部品の取付け構造 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9709850D0 GB9709850D0 (en) | 1997-07-09 |
GB2313489A GB2313489A (en) | 1997-11-26 |
GB2313489B true GB2313489B (en) | 2000-11-29 |
Family
ID=14984904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9709850A Expired - Fee Related GB2313489B (en) | 1996-05-23 | 1997-05-16 | Mounting structure for mounting an electrical device with terminal pins on a printed wiring board |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH09312449A (ko) |
KR (1) | KR100272806B1 (ko) |
CN (1) | CN1088550C (ko) |
GB (1) | GB2313489B (ko) |
MY (1) | MY118880A (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100421857C (zh) * | 2003-07-24 | 2008-10-01 | 台湾莫仕股份有限公司 | 导电端子植接焊料之方法 |
DE102006013825A1 (de) * | 2006-03-23 | 2007-09-27 | Endress + Hauser Flowtec Ag | Leiterplatten-Nutzen bzw. Leiterplatte mit Bauteilfixierung |
JP2016171132A (ja) * | 2015-03-11 | 2016-09-23 | 株式会社小糸製作所 | 光源モジュール |
KR102236798B1 (ko) * | 2019-05-21 | 2021-04-06 | 조인셋 주식회사 | 탄성 전기접속단자 어셈블리 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4211890A (en) * | 1977-05-25 | 1980-07-08 | Shin-Etsu Polymer Co., Ltd. | Electronic circuit boards |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0715129A (ja) * | 1993-06-28 | 1995-01-17 | Hitachi Ltd | 表面実装型半導体装置の実装構造および実装方法 |
-
1996
- 1996-05-23 JP JP8128445A patent/JPH09312449A/ja active Pending
-
1997
- 1997-05-16 GB GB9709850A patent/GB2313489B/en not_active Expired - Fee Related
- 1997-05-22 KR KR1019970019905A patent/KR100272806B1/ko not_active IP Right Cessation
- 1997-05-23 CN CN97112159A patent/CN1088550C/zh not_active Expired - Fee Related
- 1997-05-23 MY MYPI97002264A patent/MY118880A/en unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4211890A (en) * | 1977-05-25 | 1980-07-08 | Shin-Etsu Polymer Co., Ltd. | Electronic circuit boards |
Also Published As
Publication number | Publication date |
---|---|
GB2313489A (en) | 1997-11-26 |
KR970078793A (ko) | 1997-12-12 |
CN1168080A (zh) | 1997-12-17 |
MY118880A (en) | 2005-02-28 |
JPH09312449A (ja) | 1997-12-02 |
GB9709850D0 (en) | 1997-07-09 |
KR100272806B1 (ko) | 2001-04-02 |
CN1088550C (zh) | 2002-07-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20060516 |