KR970078793A - 단자가 부착된 부품의 설치구조 - Google Patents

단자가 부착된 부품의 설치구조 Download PDF

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Publication number
KR970078793A
KR970078793A KR1019970019905A KR19970019905A KR970078793A KR 970078793 A KR970078793 A KR 970078793A KR 1019970019905 A KR1019970019905 A KR 1019970019905A KR 19970019905 A KR19970019905 A KR 19970019905A KR 970078793 A KR970078793 A KR 970078793A
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KR
South Korea
Prior art keywords
component
terminal
circuit board
printed circuit
protrusion
Prior art date
Application number
KR1019970019905A
Other languages
English (en)
Other versions
KR100272806B1 (ko
Inventor
히로또 기누야마
Original Assignee
가다오까 마사다까
아루푸스 덴키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가다오까 마사다까, 아루푸스 덴키 가부시키가이샤 filed Critical 가다오까 마사다까
Publication of KR970078793A publication Critical patent/KR970078793A/ko
Application granted granted Critical
Publication of KR100272806B1 publication Critical patent/KR100272806B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10075—Non-printed oscillator
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

본 발명은 사용환경의 온도변화가 큰 경우에도, 단자가 프린트기판의 패턴을 접속하는 납땜부의 파손을 방지할 수 있는 동시에, 작업비 및 부품점수를 늘리는 일을 필요로 하지 않고 끝나는 단자부착 부품의 설치구조를 제공한다.
본 발명에서는, 프린트기판(3)에 돌출부(3a)를 하프펀치가공에 의해 형성하고, 단자(2)가 부착된 부품(1)을 프린트기판(3)에 실장할 때, 부품(1)저면을 돌출부(3a)에 맞닿게 한 상태에서, 프린트기판(3)의 패턴과 단자(2)를 납땜한다. 그때, 부품(1)의 저면과 프린트기판(3)의 표면과의 사이에 소정의 간극(G)이 개재하기 때문에, 플럭스가 모세관 현상에 의해 부품(1)의 저면과 돌출부(3a)의 당접 개소까지 도달하는 일은 없고, 크림땜납의 냉각고화시에 프린트기판(3)이 단지 (2)보다 크게 수축하여, 부품(1)의 저면과 돌출부(3a)의 표면과의 사이에 클리어런스가 형성된다.

Description

단자가 부착된 부품의 설치구조
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일 실시예에 관계되는 단자가 부착된 부품의 설치구조를 나타내는 정면도.

Claims (3)

  1. 단자가 부착된 부품이 실장되는 프린트기판에 상기 부품의 저면에 대향하는 돌출부를 마련하고, 상기 부품을 상기 프린트기판상에 재치하고 상기 부품의 저면을 상기 돌출부에 당접시킨 상태에서 상기 프린트기판의 패턴과 상기 단자를 납땜한 것을 특징으로 하는 단자가 부착된 부품의 설치구조.
  2. 제1항에 있어서, 상기 돌출부가 상기 프린트기판의 일부로 이루어지고, 외주가 주위에서 잘려내어져 마찰력에 의해 지지되는 돌출편으로 이루어지는 것을 특징으로 하는 단자가 부착된 부품의 설치구조.
  3. 제1항에 있어서, 상기 돌출부가 상기 프린트기판의 일부로 이루어지고, 근원부를 제외하고 외주가 잘려내어져 상기 근원부로부터 상기 부품방향으로 굽혀올려진 절기편으로 이루어지는 것을 특징으로 하는 단자가 부착된 부품의 설치구조.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970019905A 1996-05-23 1997-05-22 단자가부착된부품의설치구조 KR100272806B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8-128445 1996-05-23
JP8128445A JPH09312449A (ja) 1996-05-23 1996-05-23 端子付き部品の取付け構造

Publications (2)

Publication Number Publication Date
KR970078793A true KR970078793A (ko) 1997-12-12
KR100272806B1 KR100272806B1 (ko) 2001-04-02

Family

ID=14984904

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970019905A KR100272806B1 (ko) 1996-05-23 1997-05-22 단자가부착된부품의설치구조

Country Status (5)

Country Link
JP (1) JPH09312449A (ko)
KR (1) KR100272806B1 (ko)
CN (1) CN1088550C (ko)
GB (1) GB2313489B (ko)
MY (1) MY118880A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200134031A (ko) * 2019-05-21 2020-12-01 조인셋 주식회사 탄성 전기접속단자 어셈블리

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100421857C (zh) * 2003-07-24 2008-10-01 台湾莫仕股份有限公司 导电端子植接焊料之方法
DE102006013825A1 (de) * 2006-03-23 2007-09-27 Endress + Hauser Flowtec Ag Leiterplatten-Nutzen bzw. Leiterplatte mit Bauteilfixierung
JP2016171132A (ja) * 2015-03-11 2016-09-23 株式会社小糸製作所 光源モジュール

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6314473Y2 (ko) * 1977-05-25 1988-04-22
JPH0715129A (ja) * 1993-06-28 1995-01-17 Hitachi Ltd 表面実装型半導体装置の実装構造および実装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200134031A (ko) * 2019-05-21 2020-12-01 조인셋 주식회사 탄성 전기접속단자 어셈블리

Also Published As

Publication number Publication date
MY118880A (en) 2005-02-28
GB2313489A (en) 1997-11-26
GB2313489B (en) 2000-11-29
JPH09312449A (ja) 1997-12-02
GB9709850D0 (en) 1997-07-09
CN1168080A (zh) 1997-12-17
CN1088550C (zh) 2002-07-31
KR100272806B1 (ko) 2001-04-02

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