GB2255219B - Liquid-crystal display device and process for producing the same - Google Patents

Liquid-crystal display device and process for producing the same

Info

Publication number
GB2255219B
GB2255219B GB9206278A GB9206278A GB2255219B GB 2255219 B GB2255219 B GB 2255219B GB 9206278 A GB9206278 A GB 9206278A GB 9206278 A GB9206278 A GB 9206278A GB 2255219 B GB2255219 B GB 2255219B
Authority
GB
United Kingdom
Prior art keywords
producing
liquid
display device
same
crystal display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9206278A
Other languages
English (en)
Other versions
GB2255219A (en
GB9206278D0 (en
Inventor
Minoru Hirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of GB9206278D0 publication Critical patent/GB9206278D0/en
Publication of GB2255219A publication Critical patent/GB2255219A/en
Application granted granted Critical
Publication of GB2255219B publication Critical patent/GB2255219B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
GB9206278A 1991-03-29 1992-03-23 Liquid-crystal display device and process for producing the same Expired - Fee Related GB2255219B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3092851A JPH04301817A (ja) 1991-03-29 1991-03-29 液晶表示装置とその製造方法

Publications (3)

Publication Number Publication Date
GB9206278D0 GB9206278D0 (en) 1992-05-06
GB2255219A GB2255219A (en) 1992-10-28
GB2255219B true GB2255219B (en) 1995-03-15

Family

ID=14065933

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9206278A Expired - Fee Related GB2255219B (en) 1991-03-29 1992-03-23 Liquid-crystal display device and process for producing the same

Country Status (6)

Country Link
US (2) US5311341A (OSRAM)
JP (1) JPH04301817A (OSRAM)
KR (1) KR100244583B1 (OSRAM)
GB (1) GB2255219B (OSRAM)
HK (1) HK112295A (OSRAM)
TW (1) TW225612B (OSRAM)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3205373B2 (ja) 1992-03-12 2001-09-04 株式会社日立製作所 液晶表示装置
DE69414686T2 (de) * 1993-07-27 1999-05-06 Citizen Watch Co., Ltd., Tokio/Tokyo Elektrische verbindungsstruktur und verfahren zum elektrischen verbinden von anschluessen untereinander
USRE40450E1 (en) 1993-10-27 2008-08-05 Seiko Epson Corporation Liquid crystal projector
US5526563A (en) * 1994-03-10 1996-06-18 Matsushita Electric Industrial Co., Ltd. Method for manufacturing an electronic component
JP2555987B2 (ja) * 1994-06-23 1996-11-20 日本電気株式会社 アクティブマトリクス基板
JPH09148731A (ja) * 1995-11-17 1997-06-06 Fujitsu Ltd 配線基板間の接続構造の製造方法
US6738123B1 (en) * 1996-03-15 2004-05-18 Canon Kabushiki Kaisha Drive circuit connection structure including a substrate, circuit board, and semiconductor device, and display apparatus including the connection structure
TW475086B (en) * 1996-07-03 2002-02-01 Toshiba Corp Manufacturing method of flat-panel display unit, display panel carrier therefore and manufacturing method of electronic device or optical device
WO1998033163A1 (en) * 1997-01-27 1998-07-30 Koninklijke Philips Electronics N.V. Method of manufacturing a liquid crystal display module
FR2761510B1 (fr) * 1997-03-27 1999-04-30 Bull Sa Ecran et montage des circuits de commande des pixels de l'ecran
JP3431447B2 (ja) * 1997-04-16 2003-07-28 シャープ株式会社 表示装置
KR100523280B1 (ko) * 1998-06-11 2006-01-12 삼성전자주식회사 액정표시장치의 구동드라이브 아이씨 수리 장치 및 이를이용한 구동드라이브 아이씨 수리방법
JP3462135B2 (ja) * 1999-01-14 2003-11-05 シャープ株式会社 二次元画像検出器およびアクティブマトリクス基板並びに表示装置
TW494255B (en) * 2000-08-31 2002-07-11 Hannstar Display Corp Pressing method and apparatus for front glass substrate and rear glass substrate of the liquid crystal display
GB0021750D0 (en) * 2000-09-04 2000-10-18 Cambridge Consultants Connection method
JP3792554B2 (ja) * 2001-03-26 2006-07-05 シャープ株式会社 表示モジュール及びフレキシブル配線板の接続方法
US6490786B2 (en) * 2001-04-17 2002-12-10 Visteon Global Technologies, Inc. Circuit assembly and a method for making the same
DE10210606A1 (de) * 2002-03-11 2003-10-09 Giesecke & Devrient Gmbh Tragbarer Datenträger mit Displaymodul und Verfahren zu seiner Herstellung
WO2005096003A1 (fr) * 2004-03-30 2005-10-13 Quanta Display Inc. Procede de test de defaut d'un panneau afficheur
JP2005327892A (ja) * 2004-05-14 2005-11-24 Matsushita Electric Ind Co Ltd フレキシブルプリント基板を用いた接続装置
TWI351670B (en) * 2006-05-18 2011-11-01 Au Optronics Corp Signal transmission assembly and display panel app
JP5020629B2 (ja) * 2006-12-28 2012-09-05 パナソニック株式会社 電子部品の接続方法
CN101231930B (zh) * 2007-01-26 2010-06-16 纳瑞精密设备有限公司 使用紫外线接合图案电极的设备
KR100882735B1 (ko) * 2007-03-19 2009-02-06 도레이새한 주식회사 이방성 전도필름 및 이의 접착방법
JP2009135388A (ja) * 2007-10-30 2009-06-18 Hitachi Chem Co Ltd 回路接続方法
JP2010015114A (ja) * 2008-07-07 2010-01-21 Toshiba Mobile Display Co Ltd 表示装置
US9107316B2 (en) * 2013-09-11 2015-08-11 Eastman Kodak Company Multi-layer micro-wire substrate structure
JP6431485B2 (ja) * 2013-12-02 2018-11-28 東芝ホクト電子株式会社 発光装置
CN108922407B (zh) * 2018-09-11 2023-11-24 合肥京东方光电科技有限公司 显示屏及显示装置
EP3787013A1 (en) * 2019-08-27 2021-03-03 Heraeus Deutschland GmbH & Co KG Method of connecting an electrical conductive item with an uv curable substance, corresponding device and method of use

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4431270A (en) * 1979-09-19 1984-02-14 Sharp Kabushiki Kaisha Electrode terminal assembly on a multi-layer type liquid crystal panel
EP0260141A2 (en) * 1986-09-11 1988-03-16 Kabushiki Kaisha Toshiba Liquid crystal apparatus
EP0289026A2 (en) * 1987-05-01 1988-11-02 Canon Kabushiki Kaisha External circuit connecting method and packaging structure

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60111068U (ja) * 1983-12-28 1985-07-27 アルプス電気株式会社 フレキシブルプリント基板
JPS6246482U (OSRAM) * 1985-09-06 1987-03-20
KR920000601B1 (ko) * 1986-10-13 1992-01-16 세미콘덕터 에너지 라보라터리 캄파니 리미티드 액정 장치 제조방법
JPH0688316B2 (ja) * 1987-02-06 1994-11-09 日産自動車株式会社 内装部品を一体成形した中空成形品のブロー成形法
JPH0529460Y2 (OSRAM) * 1987-06-15 1993-07-28
JPS63313126A (ja) * 1987-06-17 1988-12-21 Hitachi Ltd 液晶表示素子
JPS6491115A (en) * 1987-10-02 1989-04-10 Ricoh Kk Liquid crystal display device
JP2596960B2 (ja) * 1988-03-07 1997-04-02 シャープ株式会社 接続構造
SG49842A1 (en) * 1988-11-09 1998-06-15 Nitto Denko Corp Wiring substrate film carrier semiconductor device made by using the film carrier and mounting structure comprising the semiconductor
JP2522071B2 (ja) * 1989-11-07 1996-08-07 日本電気株式会社 液晶ディスプレイ基板
KR940006185Y1 (ko) * 1990-06-07 1994-09-10 가시오 게이상기 가부시끼가이샤 Ic 모듈
JPH04216589A (ja) * 1990-12-18 1992-08-06 Mitsubishi Electric Corp 電子回路の接続構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4431270A (en) * 1979-09-19 1984-02-14 Sharp Kabushiki Kaisha Electrode terminal assembly on a multi-layer type liquid crystal panel
EP0260141A2 (en) * 1986-09-11 1988-03-16 Kabushiki Kaisha Toshiba Liquid crystal apparatus
EP0289026A2 (en) * 1987-05-01 1988-11-02 Canon Kabushiki Kaisha External circuit connecting method and packaging structure

Also Published As

Publication number Publication date
HK112295A (en) 1995-07-21
US5311341A (en) 1994-05-10
TW225612B (OSRAM) 1994-06-21
GB2255219A (en) 1992-10-28
JPH04301817A (ja) 1992-10-26
GB9206278D0 (en) 1992-05-06
KR100244583B1 (ko) 2000-02-15
US5375003A (en) 1994-12-20

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20020323