TW225612B - - Google Patents

Info

Publication number
TW225612B
TW225612B TW081101862A TW81101862A TW225612B TW 225612 B TW225612 B TW 225612B TW 081101862 A TW081101862 A TW 081101862A TW 81101862 A TW81101862 A TW 81101862A TW 225612 B TW225612 B TW 225612B
Authority
TW
Taiwan
Application number
TW081101862A
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Application granted granted Critical
Publication of TW225612B publication Critical patent/TW225612B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
TW081101862A 1991-03-29 1992-03-11 TW225612B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3092851A JPH04301817A (ja) 1991-03-29 1991-03-29 液晶表示装置とその製造方法

Publications (1)

Publication Number Publication Date
TW225612B true TW225612B (zh) 1994-06-21

Family

ID=14065933

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081101862A TW225612B (zh) 1991-03-29 1992-03-11

Country Status (6)

Country Link
US (2) US5311341A (zh)
JP (1) JPH04301817A (zh)
KR (1) KR100244583B1 (zh)
GB (1) GB2255219B (zh)
HK (1) HK112295A (zh)
TW (1) TW225612B (zh)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3205373B2 (ja) * 1992-03-12 2001-09-04 株式会社日立製作所 液晶表示装置
EP0662256B1 (en) * 1993-07-27 1998-11-18 Citizen Watch Co. Ltd. An electrical connecting structure and a method for electrically connecting terminals to each other
US5978054A (en) 1993-10-27 1999-11-02 Seiko Epson Corporation Liquid crystal projector
US5526563A (en) * 1994-03-10 1996-06-18 Matsushita Electric Industrial Co., Ltd. Method for manufacturing an electronic component
JP2555987B2 (ja) * 1994-06-23 1996-11-20 日本電気株式会社 アクティブマトリクス基板
JPH09148731A (ja) * 1995-11-17 1997-06-06 Fujitsu Ltd 配線基板間の接続構造の製造方法
US6738123B1 (en) * 1996-03-15 2004-05-18 Canon Kabushiki Kaisha Drive circuit connection structure including a substrate, circuit board, and semiconductor device, and display apparatus including the connection structure
TW475086B (en) * 1996-07-03 2002-02-01 Toshiba Corp Manufacturing method of flat-panel display unit, display panel carrier therefore and manufacturing method of electronic device or optical device
WO1998033163A1 (en) * 1997-01-27 1998-07-30 Koninklijke Philips Electronics N.V. Method of manufacturing a liquid crystal display module
FR2761510B1 (fr) * 1997-03-27 1999-04-30 Bull Sa Ecran et montage des circuits de commande des pixels de l'ecran
JP3431447B2 (ja) * 1997-04-16 2003-07-28 シャープ株式会社 表示装置
KR100523280B1 (ko) * 1998-06-11 2006-01-12 삼성전자주식회사 액정표시장치의 구동드라이브 아이씨 수리 장치 및 이를이용한 구동드라이브 아이씨 수리방법
JP3462135B2 (ja) * 1999-01-14 2003-11-05 シャープ株式会社 二次元画像検出器およびアクティブマトリクス基板並びに表示装置
TW494255B (en) * 2000-08-31 2002-07-11 Hannstar Display Corp Pressing method and apparatus for front glass substrate and rear glass substrate of the liquid crystal display
GB0021750D0 (en) * 2000-09-04 2000-10-18 Cambridge Consultants Connection method
JP3792554B2 (ja) 2001-03-26 2006-07-05 シャープ株式会社 表示モジュール及びフレキシブル配線板の接続方法
US6490786B2 (en) * 2001-04-17 2002-12-10 Visteon Global Technologies, Inc. Circuit assembly and a method for making the same
DE10210606A1 (de) * 2002-03-11 2003-10-09 Giesecke & Devrient Gmbh Tragbarer Datenträger mit Displaymodul und Verfahren zu seiner Herstellung
WO2005096003A1 (fr) * 2004-03-30 2005-10-13 Quanta Display Inc. Procede de test de defaut d'un panneau afficheur
JP2005327892A (ja) * 2004-05-14 2005-11-24 Matsushita Electric Ind Co Ltd フレキシブルプリント基板を用いた接続装置
TWI351670B (en) * 2006-05-18 2011-11-01 Au Optronics Corp Signal transmission assembly and display panel app
JP5020629B2 (ja) * 2006-12-28 2012-09-05 パナソニック株式会社 電子部品の接続方法
CN101231930B (zh) * 2007-01-26 2010-06-16 纳瑞精密设备有限公司 使用紫外线接合图案电极的设备
KR100882735B1 (ko) * 2007-03-19 2009-02-06 도레이새한 주식회사 이방성 전도필름 및 이의 접착방법
JP2009135388A (ja) * 2007-10-30 2009-06-18 Hitachi Chem Co Ltd 回路接続方法
JP2010015114A (ja) * 2008-07-07 2010-01-21 Toshiba Mobile Display Co Ltd 表示装置
US9107316B2 (en) * 2013-09-11 2015-08-11 Eastman Kodak Company Multi-layer micro-wire substrate structure
EP3079175A4 (en) * 2013-12-02 2018-04-11 Toshiba Hokuto Electronics Corporation Light-emission device
CN108922407B (zh) * 2018-09-11 2023-11-24 合肥京东方光电科技有限公司 显示屏及显示装置
EP3787013A1 (en) * 2019-08-27 2021-03-03 Heraeus Deutschland GmbH & Co KG Method of connecting an electrical conductive item with an uv curable substance, corresponding device and method of use

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4431270A (en) * 1979-09-19 1984-02-14 Sharp Kabushiki Kaisha Electrode terminal assembly on a multi-layer type liquid crystal panel
JPS60111068U (ja) * 1983-12-28 1985-07-27 アルプス電気株式会社 フレキシブルプリント基板
JPS6246482U (zh) * 1985-09-06 1987-03-20
JP2598030B2 (ja) * 1986-09-11 1997-04-09 株式会社東芝 液晶表示装置
CN87107022A (zh) * 1986-10-13 1988-05-18 株式会社半导体能源研究所 液晶器件的制造方法
JPH0688316B2 (ja) * 1987-02-06 1994-11-09 日産自動車株式会社 内装部品を一体成形した中空成形品のブロー成形法
EP0289026B1 (en) * 1987-05-01 1994-12-28 Canon Kabushiki Kaisha External circuit connecting method and packaging structure
JPH0529460Y2 (zh) * 1987-06-15 1993-07-28
JPS63313126A (ja) * 1987-06-17 1988-12-21 Hitachi Ltd 液晶表示素子
JPS6491115A (en) * 1987-10-02 1989-04-10 Ricoh Kk Liquid crystal display device
JP2596960B2 (ja) * 1988-03-07 1997-04-02 シャープ株式会社 接続構造
EP0368262B1 (en) * 1988-11-09 2001-02-14 Nitto Denko Corporation Wiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor device
JP2522071B2 (ja) * 1989-11-07 1996-08-07 日本電気株式会社 液晶ディスプレイ基板
KR940006185Y1 (ko) * 1990-06-07 1994-09-10 가시오 게이상기 가부시끼가이샤 Ic 모듈
JPH04216589A (ja) * 1990-12-18 1992-08-06 Mitsubishi Electric Corp 電子回路の接続構造

Also Published As

Publication number Publication date
GB2255219B (en) 1995-03-15
US5311341A (en) 1994-05-10
GB2255219A (en) 1992-10-28
HK112295A (en) 1995-07-21
US5375003A (en) 1994-12-20
GB9206278D0 (en) 1992-05-06
KR100244583B1 (ko) 2000-02-15
JPH04301817A (ja) 1992-10-26

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